Estimated 300mm wafer prices at TSMC across 15 process nodes from 65nm (2008) through A16 (2026+).

Side-by-side wafer price comparison across TSMC, Samsung, and SMIC at comparable nodes (4nm, 3nm, 2nm).

HBM contract and blended pricing per GB, HBM2 through HBM4, with dated anchors from 2017 through 2026.

HBM market share split between SK Hynix, Samsung, and Micron, annually from 2023 through 2026E.

DDR4 8Gb contract and spot pricing 2018–2026.

TSMC CoWoS monthly capacity expansion with quarterly granularity from End 2023 through End 2026, tracking the AI chip packaging bottleneck from 13K to 125K+ wpm.

TSMC, UMC, and Samsung foundry utilization rates quarterly from Q1 2022 through Q1 2026.

Total chip design cost escalation from 180nm to 2nm.

Estimated manufacturing cost breakdown for NVIDIA A100, H100, H200, B200 and AMD MI300X.

Lead times in weeks for key AI chip supply chain components: CoWoS packaging, HBM memory by generation, TSMC leading-edge wafers.

Annual capital expenditure by leading semiconductor companies — TSMC, Samsung, Micron, SK Hynix, and Intel.

Quarterly capital expenditure (cash purchases of property and equipment) by the four largest AI infrastructure buyers — Microsoft, Alphabet, Amazon, and Meta — from Q1 2022 thro…

NAND flash pricing for enterprise SSD (TLC) and consumer SSD (TLC/QLC), quarterly 2022–2026.

Full system-level bill of materials for AI training servers — from DGX H100 (8-GPU) through GB200 NVL72 (72-GPU rack).

Hourly rental cost for AI GPUs on major cloud platforms — CoreWeave, AWS, and spot markets (Vast.ai/Lambda).

Derived price-per-performance series for rented AI GPUs: public on-demand rental prices divided by NVIDIA peak FP8 (sparse) throughput — H100 SXM5 and H200 at 3,958 TFLOPS, B200…

300mm wafer prices for TSMC, Samsung, Intel from 28nm to 3nm — averages, ranges, NRE/mask costs, plus the historical ASP-by-node curve. Every row cited.

HBM cost per stack and per GB by generation (HBM2→HBM4), vendor market share, and per-accelerator HBM content — analyst estimates from public sources.

Estimated manufacturing cost per AI accelerator — logic die, HBM, packaging (CoWoS), and gross-margin split across 13 chips from A100 to B200.

Input/output token prices across frontier and open models, tracked over time — the $/token trend behind inference-cost economics.

Booking-to-delivery lead times and allocation status across leading-edge, mature, packaging (CoWoS/SoIC/WMCM) and HBM capacity — with the quarterly lead-time curve back to Q1 2022.

Vendor × customer qualification matrix (SK Hynix / Samsung / Micron) with per-relationship milestone timelines back to 2022.

Lead time, percent-locked, CoWoS capacity, and utilization signals by node — weekly observations stacking into a time series.

65 fabs mapped worldwide with capacity (kWSPM) by node class and availability status, 2024–2028 baseline plus event-driven updates.

Quarterly per-node wafer ASP and utilization for 6 foundries, derived from public investor-relations disclosures.

Point-in-time daily ledger of Wafer pricing — every move dated and sourced.

Point-in-time daily ledger of Chip cost — every move dated and sourced.

Point-in-time daily ledger of GPU secondary market — every move dated and sourced.

Point-in-time daily ledger of Foundry margins — every move dated and sourced.

Point-in-time daily ledger of Foundry capacity — every move dated and sourced.

Point-in-time daily ledger of Defect density (D0) — every move dated and sourced.

Point-in-time daily ledger of NRE / design cost — every move dated and sourced.

Point-in-time daily ledger of Packaging & interposer — every move dated and sourced.

Point-in-time daily ledger of Chip archetypes — every move dated and sourced.

Point-in-time daily ledger of Industrial electricity — every move dated and sourced.

Point-in-time daily ledger of HBM spot price — every move dated and sourced.

Point-in-time daily ledger of Commodity memory spot — every move dated and sourced.

Point-in-time daily ledger of HBM leading indicators — every move dated and sourced.

Point-in-time daily ledger of HBM market share — every move dated and sourced.

Point-in-time daily ledger of HBM revenue forecast — every move dated and sourced.

Point-in-time daily ledger of HBM supplier revenue — every move dated and sourced.

Point-in-time daily ledger of Cloud GPU rental — every move dated and sourced.

Point-in-time daily ledger of LLM token pricing — every move dated and sourced.

Point-in-time daily ledger of Foundry IR economics — every move dated and sourced.

Third-party forecasts (TrendForce, WSTS, company guidance) archived with their original publication date — the revision history no one else keeps.

Bookings, backlog, and segment revenue from ASML / AMAT / Lam / KLA / TEL quarterly IR — the leading indicator for fab capacity.

Dated groundbreaking → equipment move-in → risk-production → HVM events, with schedule slips recorded as their own events.

Export controls, entity listings, tariffs, and subsidies anchored to government primary documents — back to the Oct 2022 BIS rule.