HBM Market Analysis (2026) — Pricing, Supply Chain & Forecast Dashboard
As of August 2026, track high bandwidth memory market dynamics. HBM3 ~$200/stack, HBM3E ~$300/stack, HBM4 ~$550/stack (est., 36GB 12-hi). SK Hynix leads at 50-55% market share. Compare HBM configurations across NVIDIA H100, H200, B200, AMD MI300X, MI325X, Google TPU v5p, and other AI accelerators. Track vendor market share, supply chain qualification signals, and revenue forecasts through 2027. Data available via free JSON API at /api/v1/hbm for programmatic access.
Comparing Generations (2022-2027) • Source: Official Company Specifications
Source: Silicon Analysts Projections
"The unit of compute is no longer the individual GPU. The emergence of the NVIDIA GB200 NVL72 and Google TPU Pods signals that system-level bandwidth prioritizes over individual chip peak."
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OpenAI & Google's $84B Custom Silicon War
HBM demand surge from custom silicon investment exceeding supply 1.4-1.6x.
NAND Price Explosion: How AI Demand Is Driving SSD Costs Higher
Broader memory market context — AI demand impacts across NAND and DRAM.
High Bandwidth Memory (HBM) has become the critical enabler—and bottleneck—for AI accelerator performance. Every major AI chip from NVIDIA's H100 to Google's TPU v5p relies on HBM stacks for the memory bandwidth needed to feed massive transformer models. Understanding HBM price trends, supply constraints, and technology roadmaps is essential for forecasting AI hardware costs.
The HBM market forecast shows demand growing faster than supply through at least 2026. Only three companies—SK Hynix, Samsung, and Micron—produce HBM, and capacity expansion requires 12–18 months of lead time. SK Hynix holds the dominant market share with early qualification on NVIDIA platforms, while Samsung and Micron compete for the remaining allocation. This supply concentration gives HBM vendors significant pricing power, with high bandwidth memory pricing up 20–40% year-over-year.
Each HBM generation delivers higher bandwidth and capacity at increased cost. HBM3 (used in H100) offers 819 GB/s per stack at 24GB capacity. HBM3E (used in H200, B200, MI300X) pushes to 1.18 TB/s with 36GB stacks. The upcoming HBM4, expected in 2026, will further increase bandwidth with a wider interface but at higher HBM3E cost per bit. The transition between generations creates pricing crossover periods where previous-gen inventory becomes more cost-effective for certain applications.
SK Hynix currently leads with roughly 50% HBM market share by revenue, driven by early HBM3E qualification with NVIDIA. Samsung is ramping aggressively with improved yield on its HBM3E stacks after early quality issues. Micron entered the HBM3E market later but has secured allocation with several AI chip vendors. This tool tracks all three vendors' revenue, market share, pricing, and qualification status in real time.
Related: HBM Price History · Packaging Cost Model · Cost Bridge Chart · Price/Performance Frontier
The full free tier of the HBM dataset as of August 2026, in plain tables. Identical to what GET /api/v1/hbm returns without an API key. For the hand-curated pricing reference, see HBM memory pricing and specifications.
Tracked spot pricing with per-row provenance. Confidence and as-of date reflect the source the figure was last verified against.
| Product | Price | Basis | Trend | Change | Driver | As of | Confidence |
|---|---|---|---|---|---|---|---|
| HBM3 (Active) | $1,200 - $1,400 | per device | up | +5% | Capacity cut for HBM3E | — | — |
| HBM3E 8-Hi | $1,800 - $2,000 | per device | up | +10% | Standard B200 Supply Tightness | — | — |
| HBM3E 12-Hi | $8.33/GB | per GB | up | — | GPU and ASIC order upward revisions pushing HBM3E prices higher | 2026-01-01 | low |
| HBM4 12-Hi (contract est.) | $500 - $600+/stack (36GB) | per stack | up | +55-70% vs HBM3E | 2026 ramp for NVIDIA Vera Rubin; TSMC/foundry base-die cost floor; suppliers seeking multi-fold 2027 increases | 2026-01-01 | medium |
Who has passed whose qualification, by HBM generation and target customer.
| Supplier | Generation | Target | Status | Note |
|---|---|---|---|---|
| SK Hynix | HBM3 | NVIDIA H100 | volume_shipping | Industry-first HBM3 to NVIDIA; mass production began June 2022. |
| Micron | HBM3E 8-Hi | NVIDIA H200 | volume_shipping | Micron HBM3E 24GB 8-Hi for NVIDIA H200; volume production Feb 2024. |
| SK Hynix | HBM3E 8-Hi | NVIDIA H200 | volume_shipping | First in industry to mass-produce HBM3E; supply to customer from late March 2024. |
| Samsung | HBM3E 12-Hi | NVIDIA B300 | volume_shipping | NVIDIA HBM shipments began Q3 2025; HBM3E in mass production, 2026 supply sold out. |
| Samsung | HBM3 8-Hi | NVIDIA H20 | qualified | Samsung HBM3 passed NVIDIA qualification, limited to China-market H20. |
| SK Hynix | HBM3E 12-Hi | AMD MI325X | volume_shipping | Prep to ship 12-Hi 36GB HBM3E for MI325X (forward-looking). |
| Micron | HBM3E 12-Hi | NVIDIA B200 | qualified | Production-capable 12-Hi HBM3E shipped to enable qualification; targets H200 & B100/B200 (Sep 2024). |
| Micron | HBM3E 8-Hi | NVIDIA GB200 | volume_shipping | Micron 8-Hi HBM3E in GB200/B200; shipping from early 2025. |
| SK Hynix | HBM3E 12-Hi | NVIDIA GB300 | qualified | Reported (Business Post via TrendForce) exclusive 12H HBM3E for Blackwell Ultra GB300; exclusivity unconfirmed. |
| Micron | HBM3E 12-Hi | NVIDIA GB300 | volume_shipping | HBM3E 12H designed into GB300; Micron began volume production (reported Mar 2025). |
| Samsung | HBM3E 8-Hi | Broadcom ASIC | qualified | Improved 8-Hi HBM3E passed Broadcom pre-mass-production evaluation. |
| Micron | HBM3E 12-Hi | AMD MI350 | volume_shipping | Micron 12-Hi HBM3E (288GB) in MI350 series; mass production from Q3 2025. |
| Samsung | HBM3E 12-Hi | AMD MI350 | volume_shipping | Samsung HBM3E Shinebolt...stacks 12 layers of D1a nm high-k metal gate 24 Gb DRAM dies...found in AMD MI350X floorplan analysis (published Oct 8, 2025) |
| Micron | HBM4 12-Hi | NVIDIA Vera Rubin | volume_shipping | Micron high-volume HBM4 36GB 12-Hi production for Vera Rubin (GTC, Mar 16 2026). |
| SK Hynix | HBM4 12-Hi | NVIDIA Vera Rubin | volume_shipping | Jensen Huang (Jun 5 2026): all three vendors qualified and in production for Vera Rubin. |
| SK Hynix | HBM3E | NVIDIA H200 | volume_shipping | SK Hynix was the first to achieve volume production of HBM3E, the current generation used in NVIDIA's H200 and B200 accelerators. |
| Samsung | HBM4 | AMD MI400 | qualified | AMD's MI400 is now committed primarily to Samsung HBM4 — the first major AI socket Samsung has fully won this cycle. |
| Samsung | HBM3E 12-Hi | AMD MI350X | volume_shipping | AMD announced at AI Advancing 2025 event that MI350X and MI355X will be equipped with Samsung Electronics' and Micron's 12-Hi HBM3E — described as 'first time AMD has officially confirmed it' |
| Samsung | HBM4 | AMD MI455X | in_qualification | Samsung Electronics today announced it has signed a Memorandum of Understanding (MOU) with AMD to expand their strategic collaboration on next-generation AI memory...Samsung and AMD will align on primary HBM4 supply for the AMD Instinct MI455X GPU |
| Samsung | HBM3E 12-Hi | NVIDIA H200 | volume_shipping | Samsung finally passed NVIDIA's 12-layer HBM3E qualification in September 2025 — third supplier, after SK Hynix and Micron |
| SK Hynix | HBM4 | NVIDIA Vera Rubin | volume_shipping | AlphaSense experts describe SK Hynix at scale serving NVIDIA with fastest qualification track record across HBM3 and HBM4 generations, capturing early-stage demand. |
| Samsung | HBM4 | Google TPU | qualified | Samsung is currently shipping HBM4 samples to key customers such as NVIDIA for qualification testing. Sources expect feedback to come back 'positive' as early as this month. |
| Micron | HBM4 | NVIDIA Vera Rubin | volume_shipping | NVIDIA CEO Jensen Huang confirmed on June 5, 2026 that Micron has passed certification to supply HBM4 for Vera Rubin; announcement reported by Bloomberg. |
| SK Hynix | HBM4 | NVIDIA | in_qualification | SK Hynix is facing a crisis situation where Samsung may pass HBM4 qualification first; SK Hynix redesigning HBM4 to meet NVIDIA requirements including 11.7Gb/s speed |
| Samsung | HBM4 12-Hi | NVIDIA Vera Rubin | volume_shipping | 삼성전자가 엔비디아에 HBM4를 세계 최초로 양산 출하했다. 12일 HBM4의 양산 출하를 시작했다고 밝혔다. 이번 출하된 제품은 엔비디아가 다음 달 공개할 차세대 AI 가속기 '베라 루빈'에 탑재될 것으로 알려졌다. |
| Samsung | HBM4 | NVIDIA Vera Rubin | volume_shipping | NVIDIA CEO Jensen Huang confirmed on June 5, 2026 that Samsung, SK Hynix, and Micron have all passed certification to supply HBM4 for the Vera Rubin AI accelerator platform. |
| Samsung | HBM4 | AMD | qualified | Korea Economic Daily reported Samsung passed HBM4 qualification tests for Nvidia and AMD, citing chip industry sources; reported by Reuters on January 25, 2026. |
| Samsung | HBM3E 12-Hi | NVIDIA | volume_shipping | Jensen Huang: 'All three companies have passed qualification and are currently in production. They are competing intensely to supply products to Nvidia.' |
| SK Hynix | HBM4 16-Hi | NVIDIA Vera Rubin | not_started | At CES 2026, SK Hynix unveiled a 16-layer HBM4 device with 48 gigabytes of capacity... SK Hynix is planning to begin mass production of these HBM4 devices in the third quarter of 2026. |
| Micron | HBM4 16-Hi | NVIDIA Vera Rubin | sampling | Micron has demonstrated advanced packaging capability of stacking 16 die of HBM by shipping samples of HBM4 48GB 16H to customers. |
| SK Hynix | HBM3E | NVIDIA Blackwell | volume_shipping | For at least the first half of 2026, HBM3E will remain SK hynix's primary production focus; NVIDIA increased orders for HBM3E as demand for Blackwell GPUs remains strong |
| Micron | HBM3E | NVIDIA | volume_shipping | Jensen Huang stated 'All three companies have passed qualification and are' (referring to all three Korean/HBM suppliers including Micron) |
| SK Hynix | HBM3E 12-Hi | NVIDIA | volume_shipping | Jensen Huang officially confirmed HBM products from all three major Korean memory makers, including SK Hynix, have passed Nvidia's qualification: 'All three companies have passed qualification and are currently in production.' |
| Micron | HBM4 | AMD MI400 | in_qualification | Micron HBM4 (development); AMD MI400 series (projected) listed as target customer; Development / early sampling |
| SK Hynix | HBM4 | AMD MI400 | in_qualification | SK Hynix HBM4 (sampling 2025–2026); AMD MI400 series (projected) listed as target customer |
| SK Hynix | HBM3E | AMD MI355X | volume_shipping | MEMORY CAPACITY 2.3 TB HBM3E 8 TB/s per GPU max — official AMD MI355X platform brochure listing HBM3E as shipping memory specification |
| SK Hynix | HBM3E 12-Hi | NVIDIA H200 | volume_shipping | SK Hynix has sent samples of its 12-layer HBM3E to NVIDIA for qualification tests; if it passes, it might debut with NVIDIA's upcoming H200 AI GPU. Report sourced from ZDNet Korea. |
| Micron | HBM3E 12-Hi | NVIDIA | volume_shipping | Jensen Huang confirmed all three major Korean memory makers passed Nvidia qualification; Micron is noted as one of the three suppliers in context. 'All three companies have passed qualification and are currently in production.' |
| Samsung | HBM3E | AMD MI355X | volume_shipping | Samsung previously supplied HBM3E chips for AMD's MI350X and MI355X accelerators. |
| Samsung | HBM4 | NVIDIA | in_qualification | In April, the Korean chipmaker said it is in talks to supply customized sixth-generation HBM4 chips to major AI chipmakers, including Nvidia, Broadcom Inc. and Google LLC. Samsung said it could begin supplying HBM4 chips in large volumes to its clients as early as the first half of 2026. |
Upstream signals that move ahead of reported HBM revenue, with the methodology behind each.
| Indicator | Value | Signal | Source | Cadence | Methodology |
|---|---|---|---|---|---|
| AI Server Demand Proxy | +38% YoY | bullish | Taiwan MOEA Export Orders | Next: Feb 20 | Calculation: (Dec 2025 Export Value / Dec 2024 Export Value) - 1. Tracks dollar value of orders received by ODM giants (Foxconn, Quanta) for AI servers. |
| Raw Chip Output Signal | +32% YoY | bullish | Korea MOTIE Chip Exports | Next: Feb 1 | Calculation: (Dec 2025 "Memory" Export Value / Dec 2024 Value). A divergence where Value > Volume indicates increasing Average Selling Price (ASP). |
Stack count, capacity, bandwidth and observed market/contract price range per accelerator, live from the tracked dataset. This is a market-range series: it is not the same measurement as the modelled per-device procurement cost on the HBM pricing reference, which sits higher on the revenue-implied basis.
| Accelerator | Vendor | HBM Type | Stacks | Capacity | Bandwidth | Market Range | Suppliers |
|---|---|---|---|---|---|---|---|
| H100 | NVIDIA | 8hi | 5 | 80 GB | 3.35 GB/s | $1,200 - $1,400 | SK Hynix (~70%), Samsung (~30%) |
| H200 | NVIDIA | 8hi | 6 | 141 GB | 4.8 GB/s | $1,600 - $1,800 | SK Hynix (~70%), Micron (~20%) |
| B200 | NVIDIA | 8hi | 8 | 192 GB | 8 GB/s | $1,850 | SK Hynix (>60%), Micron (~25%) |
| B300 | NVIDIA | 12hi | 8 | 288 GB | 8 GB/s | $2,600 - $2,800 | SK Hynix, Micron, Samsung |
| R100 | NVIDIA | 12hi | 8 | 288 GB | 13 GB/s | $3,500+ (Est.) | SK Hynix (First 16-Hi demo) |
| VR300 | NVIDIA | 16hi | 16 | 576 GB | 16 GB/s | $4,500+ (Est.) | SK Hynix (Lead), Samsung |
| MI300X | AMD | 12hi | 8 | 192 GB | 5.3 GB/s | $1,100 - $1,300 | Samsung (>60%), SK Hynix |
| MI325X | AMD | 12hi | 8 | 256 GB | 6 GB/s | $2,100 - $2,300 | Samsung (Primary), Micron |
| MI355X | AMD | 12hi | 8 | 288 GB | 8 GB/s | $2,500 - $2,800 | Samsung ($3B deal signed) |
| MI400 | AMD | 16hi | 12 | 432 GB | 10 GB/s | $3,200 - $3,400 (Est.) | Samsung, SK Hynix |
| TPU v5p | 8hi | 4 | 95 GB | 2.7 GB/s | ~$750 (Est.) | Samsung, SK Hynix | |
| TPU v6e | 8hi | 4 | 32 GB | 1.2 GB/s | ~$1,000 (Est.) | Samsung (>60%), SK Hynix | |
| TPU v7 | 12hi | 8 | 192 GB | 7.4 GB/s | $1,700 - $1,800 | SK Hynix (First), Samsung |
Bandwidth, capacity and pin-speed envelope per generation, as currently tracked.
| Generation | Bandwidth | Capacity | Pin Speed | Note |
|---|---|---|---|---|
| HBM2 | 256 GB/s | 8 GB | 2.0 Gbps | Legacy (V100) |
| HBM2e | 460 GB/s | 16 GB | 3.6 Gbps | Standard (A100) |
| HBM3 | 819 GB/s | 24 GB | 6.4 Gbps | Mainstream (H100) |
| HBM3E | 1.2 TB/s | 36 GB | 8.0+ Gbps | Cutting Edge (H200) |
| HBM4 | >2 TB/s | 48 GB | High | Future Gen |
Current tracked share of HBM bit output by supplier.
| Supplier | Share | Note |
|---|---|---|
| SK Hynix | 62% | Lead in HBM3E |
| Samsung | 30% | Volume Leader |
| Micron | 8% | Efficiency |
Public sources only. Figures are estimates unless a source is linked. Forward-looking series (revenue forecast, supplier revenue, monthly bit demand) are not included here — see the API docs for access tiers.