Cost Bridge Chart - Side-by-Side Chip Cost Comparison
Compare manufacturing costs of AI accelerators side by side. Select any two chips from Nvidia H100, H200, B200, GB200, AMD MI300X, MI355X, Intel Gaudi 3, Google TPU v5p, AWS Trainium 2, Microsoft Maia 100, and Meta MTIA v2. Visualize cost component deltas across logic die, HBM memory, advanced packaging (CoWoS, SoIC), and assembly. Analyze gross margin differences and cost-per-TFLOP efficiency ratios.
Cost Bridge Chart
Compare manufacturing costs of AI accelerators side by side. Select two chips to visualize how cost components differ and identify the key drivers of the cost delta.
AMD MI300X costs +$2.0K (+59.6%) more to manufacture than NVIDIA H100 SXM5
Cost per FP8 TFLOP: NVIDIA H100 SXM5 = $0.84 · AMD MI300X = $1.01
Gross margin: NVIDIA H100 SXM5 = 89.8% ($29.2K) · AMD MI300X = 57.6% ($7.2K)
Cost + Margin to Sell Price
Mfg cost stacked with gross margin = sell price. Chips not commercially sold show cost only.
Cost Bridge (Waterfall)
Component Cost Breakdown
| Component | NVIDIA H100 SXM5 | AMD MI300X | Delta | % Change |
|---|---|---|---|---|
| Logic Die | $300 | $600 | +$300 | +100.0% |
| HBM Memory | $1.4K | $2.9K | +$1.6K | +114.8% |
| Packaging | $750 | $1.2K | +$450 | +60.0% |
| Test & Assembly | $920 | $600 | $-320 | -34.8% |
| Total Manufacturing Cost | $3.3K | $5.3K | +$2.0K | +59.6% |
| Pricing & Margin | ||||
| Sell Price | $32.5K | $12.5K | ||
| Gross Margin | $29.2K (89.8%) | $7.2K (57.6%) | ||
Specifications Comparison
| Specification | NVIDIA H100 SXM5 | AMD MI300X |
|---|---|---|
| Vendor | NVIDIA | AMD |
| Process Node | TSMC 4N | N5/N6 chiplet |
| Die Size | 814 mm² | 1725 mm² |
| Memory | 80 GB HBM3 | 192 GB HBM3 |
| Memory BW | 3.35 TB/s | 5.3 TB/s |
| FP8 TFLOPS (sparse) | 3,958 | 5,230 |
| BF16 TFLOPS (dense) | 990 | 1,307 |
| Package | CoWoS-S | CoWoS-S + SoIC |
| Interconnect | NVLink 4 | Infinity Fabric |
| Est. Sell Price | $32.5K | $12.5K |
| Gross Margin | 87.5% | 57.5% |
Data Sources & Methodology
Manufacturing cost estimates derived from Epoch AI Monte Carlo models, Raymond James semiconductor research, TrendForce quarterly reports, and SemiAnalysis teardown data. Cost components include wafer fabrication (logic die), HBM memory stacks, advanced packaging (CoWoS, SoIC), and test/assembly. Estimates are directional and may vary ±15-20% from actual costs.
Cloud-only chips (TPU, Trainium, Maia, MTIA) show $0 sell price as they are not commercially sold. Gross margin is not applicable for internal/cloud-only products.
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