AI Accelerator Manufacturing Cost (COGS) — Historical Time Series Data
Estimated manufacturing cost breakdown for NVIDIA A100, H100, H200, B200 and AMD MI300X. Shows HBM shift from 33% to 45%+ of BOM.
AI Accelerator Manufacturing Cost (COGS)
Estimated manufacturing cost breakdown for NVIDIA A100, H100, H200, B200 and AMD MI300X. Shows HBM shift from 33% to 45%+ of BOM.
Data Table
| Period | Series | Value |
|---|---|---|
A100 (2020) | Logic Die | $400 |
A100 (2020) | HBM | $1,350 |
A100 (2020) | Packaging & Test | $750 |
H100 (2023) | Logic Die | $300 |
H100 (2023) | HBM | $1,350 |
H100 (2023) | Packaging & Test | $1,670 |
H200 (2024) | HBM | $1,500 |
H200 (2024) | Logic Die | $300 |
H200 (2024) | Packaging & Test | $2,450 |
MI300X (2024) | Logic Die | $600 |
MI300X (2024) | HBM | $2,900 |
MI300X (2024) | Packaging & Test | $1,800 |
B200 (2025) | Logic Die | $850 |
B200 (2025) | HBM | $2,900 |
B200 (2025) | Packaging & Test | $2,650 |
Methodology & Sources
Sources: Silicon Analysts (H100 Feb 2026), Epoch.ai (B200 Dec 2025), Deep Research (102 sources). NVIDIA/AMD do not disclose COGS; estimates from teardown analysis. Gross margin estimates based on analyst consensus.
Citations:
- Deep Research (102 sources) (Mar 2026)
- Silicon Analysts (Feb 2026)
- Silicon Analysts (Mar 2026)
- Silicon Analysts / SemiAnalysis (Mar 2026)
- Epoch.ai (Dec 2025)
Related Tools
Related Analysis
Market intelligence on this data
All market intelligence →TSMC $265B US CapEx Commitment + ASML 30% EUV Capacity Surge Signal Multi-Year AI Supply Expansion — with Equipment Price Hike Risk
TSMC CapEx: +$100B incremental US commitment (total $265B), 2026 CapEx at high end of $52–56B range; ASML EUV/DUV capacity: +30% per year for 2 years; ASML 2026 revenue guidance raised ~15–19% vs prior midpoint (€38B → €44B midpoint); ASML EUV price hike quantum not yet disclosed — wafer/packaging cost pass-through risk flagged but unquantified.
SK Hynix CEO Flags 2027 as Worst-Ever HBM Supply Crunch; $26.5B IPO Capital Earmarked for Capacity Expansion
Capacity expansion funded: $26.5B raised (new fab + packaging facility + EUV scanners); Supply gap: demand forecasted to exceed supply through 2030+; No specific yield or price-per-unit figure disclosed.
HBM Supply Shortage Persists as SK Hynix Commands 56.4% Market Share; Micron Commits $250B to Domestic DRAM Expansion
HBM shortage: supply constrained with SK Hynix holding 56.4% market share per SEC filing; Micron US DRAM capacity target: 40% of total output domestically by 2035; Micron data center segment gross margin reached 87% on $11.5B revenue (up 103% QoQ), signaling sustained premium pricing on memory inputs to AI hardware.
SK Hynix Commits $706B to HBM/DRAM Scale-Up as ISM Flags Memory Components in Active Short Supply
Capacity: P&T7 packaging facility targeted for end-2027; M17 NAND fab operations targeted H1 2029; SK Group aggregate HBM/DRAM CapEx: ~$706B committed. Supply tightness signal: ISM June 2026 survey flags memory in active short supply (no precise % figure cited). Bernstein projects SK Hynix DRAM gross margins peaking at ~92.7% in Q4 2026, implying sustained elevated HBM ASPs through at least 2028.
Frequently Asked Questions
- How much does it cost NVIDIA to manufacture an H100?
- The estimated total manufacturing cost (COGS) for an H100 SXM5 is approximately $3,320: roughly $300 for the 814mm² TSMC 4N logic die, $1,350 for HBM3 memory, $750 for CoWoS-S packaging, and $920 for test/assembly.
- Why is the B200 logic die cheaper than the H100 despite being more advanced?
- The B200 uses a chiplet design with two ~400mm² N4P dies (~800mm² total) instead of a single monolithic 814mm² die like the H100. Each smaller chiplet yields significantly better, driving per-die cost down to roughly $900 total for the logic despite using a more advanced node.
- What percentage of AI chip cost is HBM memory?
- HBM as a share of total BOM has grown from roughly 14% (A100) to 33% (H100) to 43% (H200) to 45%+ (MI300X). The B200 reverses this trend slightly at ~38% because its chiplet logic die is relatively cheap, but the absolute HBM cost continues to rise.