Silicon Analysts

AI Accelerator Manufacturing Cost (COGS) — Historical Time Series Data

Estimated manufacturing cost breakdown for NVIDIA A100, H100, H200, B200 and AMD MI300X. Shows HBM shift from 33% to 45%+ of BOM.

AI Accelerator Manufacturing Cost (COGS)

Estimated manufacturing cost breakdown for NVIDIA A100, H100, H200, B200 and AMD MI300X. Shows HBM shift from 33% to 45%+ of BOM.

15 data points·Unit: $·Last updated: Mar 2026

Data Table

PeriodSeriesValue
A100 (2020)
Logic Die
$400
A100 (2020)
HBM
$1,350
A100 (2020)
Packaging & Test
$750
H100 (2023)
Logic Die
$300
H100 (2023)
HBM
$1,350
H100 (2023)
Packaging & Test
$1,670
H200 (2024)
HBM
$1,500
H200 (2024)
Logic Die
$300
H200 (2024)
Packaging & Test
$2,450
MI300X (2024)
Logic Die
$600
MI300X (2024)
HBM
$2,900
MI300X (2024)
Packaging & Test
$1,800
B200 (2025)
Logic Die
$850
B200 (2025)
HBM
$2,900
B200 (2025)
Packaging & Test
$2,650

Methodology & Sources

Sources: Silicon Analysts (H100 Feb 2026), Epoch.ai (B200 Dec 2025), Deep Research (102 sources). NVIDIA/AMD do not disclose COGS; estimates from teardown analysis. Gross margin estimates based on analyst consensus.

Citations:

  • Deep Research (102 sources) (Mar 2026)
  • Silicon Analysts (Feb 2026)
  • Silicon Analysts (Mar 2026)
  • Silicon Analysts / SemiAnalysis (Mar 2026)
  • Epoch.ai (Dec 2025)

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Frequently Asked Questions

How much does it cost NVIDIA to manufacture an H100?
The estimated total manufacturing cost (COGS) for an H100 SXM5 is approximately $3,320: roughly $300 for the 814mm² TSMC 4N logic die, $1,350 for HBM3 memory, $750 for CoWoS-S packaging, and $920 for test/assembly.
Why is the B200 logic die cheaper than the H100 despite being more advanced?
The B200 uses a chiplet design with two ~400mm² N4P dies (~800mm² total) instead of a single monolithic 814mm² die like the H100. Each smaller chiplet yields significantly better, driving per-die cost down to roughly $900 total for the logic despite using a more advanced node.
What percentage of AI chip cost is HBM memory?
HBM as a share of total BOM has grown from roughly 14% (A100) to 33% (H100) to 43% (H200) to 45%+ (MI300X). The B200 reverses this trend slightly at ~38% because its chiplet logic die is relatively cheap, but the absolute HBM cost continues to rise.