Semiconductor Analysis Tools

Model chip manufacturing costs from wafer to packaged die. Calculate GDPW, net die yield, wafer costs by process node (2nm to 28nm), packaging costs (CoWoS, EMIB), HBM pricing, and gross margin analysis.

Compare manufacturing cost breakdowns side by side across 13 AI accelerators including NVIDIA H100, H200, B200, AMD MI300X, Intel Gaudi, Google TPU, and AWS Trainium. Visualize cost deltas for logic die, HBM, packaging, and assembly.

Interactive visualization of semiconductor supply chain chokepoints and geographic concentration risk. Explore equipment, materials, fabrication, and memory dependencies across 7 countries.

Compare AI accelerator price-performance across TFLOPS/dollar, inference throughput, training time, and total cost of ownership. Analyze chips from NVIDIA, AMD, Intel, Google, AWS, and Groq.

Track HBM pricing, capacity forecasts, supplier revenue, spot prices, leading indicators, and qualification data. Covers SK Hynix, Samsung, and Micron across HBM3 and HBM3E generations.

Explore global semiconductor fabrication facilities by company, process node, wafer size, and geography. View capacity data, expansion plans, and competitive positioning for TSMC, Samsung, Intel, and more.

Model advanced packaging costs and configurations for CoWoS, EMIB, InFO, SoIC, and chiplet architectures. Compare packaging approaches, HBM integration costs, and substrate sizing.