Market Pulse - Semiconductor Supply Chain Intelligence Dashboard
Real-time semiconductor market intelligence dashboard tracking supply chain signals across six key sectors: Logic (foundry pricing, node transitions), Memory (HBM, DDR5, NAND), Packaging (CoWoS, glass substrates, 2.5D/3D), Connectivity (optical interconnects, silicon photonics), Power (PMIC, GaN/SiC), and Geopolitics (trade policy, supply chain diversification). Each signal includes trend direction, source attribution, and impact analysis for AI accelerator and semiconductor supply chains. Data available via free JSON API at /api/v1/market-pulse for programmatic access.
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- What is the current TSMC 3nm wafer price?
- TSMC 3nm (N3/N3E) wafer pricing is approximately $19,500 per wafer as of early 2026, with a range of $17,000–$22,000 depending on volume and contract terms. Lead times for N3 capacity exceed 50 weeks, with pricing expected to rise 3–5% for 2026 orders due to sustained AI chip demand.
- How much does advanced packaging cost?
- TSMC CoWoS-S 2.5D packaging costs approximately $70 per unit for standard configurations. CoWoS-L (used for larger multi-die designs like NVIDIA B200) costs more due to organic interposer complexity. Intel EMIB costs approximately $35 per unit. 3D stacking (SoIC) costs approximately $120 per unit. CoWoS demand currently exceeds supply by 40–50%, with lead times of 40–52 weeks.
- What is semiconductor fab utilization in 2026?
- Leading-edge fab utilization is near 100% for TSMC 3nm and 5nm nodes, driven by AI accelerator demand. TSMC 3nm capacity is fully allocated for the next 18–24 months. Mature node utilization varies more widely, with some foundries running at 70–80% capacity. Advanced packaging (CoWoS) satisfies only 50–60% of total demand.
- Where can I find semiconductor market data?
- Silicon Analysts provides free semiconductor market intelligence covering Logic, Memory, Packaging, Connectivity, Power, and Geopolitics sectors. Data is available via this dashboard and through our free JSON API at /api/v1/market-pulse for programmatic access. We also offer tools for chip cost modeling, HBM analysis, and fab exploration.