Historical Semiconductor Market Data (2004–2026)
Time series data on TSMC wafer prices by process node, HBM pricing by generation, DDR4 contract and spot prices, CoWoS advanced packaging capacity, fab utilization rates, chip design NRE costs, and AI accelerator manufacturing cost breakdowns. All data sourced and cited from analyst reports, earnings transcripts, and industry publications.
Historical Semiconductor Market Data
Time series data on wafer prices, HBM pricing, DRAM cycles, and fab utilization — sourced and cited.
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TSMC Wafer Price by Node
Estimated 300mm wafer prices at TSMC across process nodes, 2004–2026. All figures are analyst estimates — TSMC does not publicly disclose pricing.
Foundry Wafer Price Comparison
Side-by-side wafer price comparison across TSMC, Samsung, and SMIC at comparable nodes.
HBM Price per GB by Generation
HBM contract pricing per GB from HBM2 through HBM4, 2020–2026. Tracks the AI demand supercycle impact.
HBM Market Share by Vendor
HBM market share split between SK Hynix, Samsung, and Micron, 2023–2026.
DDR4 8Gb Contract & Spot Price
DDR4 8Gb pricing history 2022–2026, including the historic $1.63→$12.76 spot price reversal in 2025.
CoWoS Packaging Capacity (TSMC)
TSMC CoWoS monthly capacity expansion 2023–2026, tracking the AI chip packaging bottleneck.
Fab Capacity Utilization
TSMC and UMC utilization rates showing the two-speed recovery: leading-edge at 100% vs mature nodes at 65–75%.
Chip Design & NRE Cost by Node
Total chip design cost escalation from 180nm to 2nm. IBS figures shown alongside real-world startup estimates.
AI Accelerator Manufacturing Cost (COGS)
Estimated manufacturing cost breakdown for NVIDIA A100, H100, H200, B200 and AMD MI300X. Shows HBM shift from 33% to 45%+ of BOM.