Foundry Allocation Dashboard (2026) — Semiconductor Capacity Status & Lead Times
As of April 2026, track allocation status across 13 foundry nodes from TSMC, Samsung, Intel, GlobalFoundries, SMIC, UMC, Rapidus. 2 nodes fully booked, 4 constrained, 5 available. Plus 3 advanced packaging technologies (CoWoS, SoIC, WMCM) and 3 HBM memory suppliers (SK Hynix, Samsung, Micron).
Foundry Allocation Dashboard
Live capacity status, lead times, and allocation signals across 13 foundry nodes, 3 packaging technologies, and 3 HBM suppliers. Updated April 2026.
Nodes Tracked
13
7 foundries
Fully Booked
2
No new orders accepted
Constrained
4
Limited availability
CoWoS Packaging
Sold Out
52wk lead time
Available
7
Accepting new orders
Advanced Packaging Status
CoWoS (S + L)
TSMC + OSATs
CoWoS-L dominates new expansion (required for dual-die Blackwell/Rubin). NVIDIA holds >70% of CoWoS-L specifically. OSAT outsourcing: ~240-270K wafers/yr. Lead times >50 weeks for new orders.
Customer Allocation
2026 target: 130K WPM
SoIC (3D hybrid bonding)
TSMC
TSMC VP confirmed >100% CAGR 2022-2026. 4 major companies currently using SoIC. AP7 Phase 1 targets SoIC mass production 2027.
Customer Allocation
2026 target: 20K WPM
WMCM (Wafer-Level MCM)
TSMC
Hybrid of InFO and CoWoS. Ramping to ~60K WPM by end 2026, >120K WPM by 2027. Dedicated primarily to Apple iPhone 18 and M6 products.
Customer Allocation
2026 target: 60K WPM
HBM Supplier Allocation
SK Hynix
53% market share
HBM3E: Fully allocated through 2026+. 12-Hi in full mass production.
HBM4: Mass production started Feb 2026 at M16 Icheon + M15X Cheongju. Using TSMC 12nm for base die.
Dominant position. M15X started 4 months ahead of schedule. FY2025 revenue KRW 97.1T (+47% YoY), 58% operating margin in Q4. CapEx $20.5B for 2026.
HBM3E $/stack
$330
HBM4 $/stack
$520
NVIDIA HBM4 allocation: ~55%
Key Customers
NVIDIA (primary) · Google · AMD
Samsung
35% market share
HBM3E: In mass production. NVIDIA qualified Sep 2025 after 18 months of failed attempts.
HBM4: World's first commercial HBM4 shipped Feb 12, 2026. Vertically integrated: 1c DRAM + 4nm foundry base die.
Dramatic recovery from 17% share in Q2 2025 to 35%. Turnkey advantage: memory + foundry + packaging under one roof. HBM sales expected to more than triple in 2026.
HBM3E $/stack
$310
HBM4 $/stack
$500
NVIDIA HBM4 allocation: ~25%
Key Customers
Google (>60% of Google HBM) · Broadcom · NVIDIA · AMD
Micron
11% market share
HBM3E: Full production. 12-Hi yields surpassed 8-Hi. 30% lower power than competitors.
HBM4: Volume production started Q1 FY2026. 16-Hi samples (48GB) shipped. Meeting only 50-66% of customer demand.
Record FQ2 2026: revenue $23.86B (nearly 3x YoY), 74.9% gross margin. Produces both DRAM and base dies in-house. CapEx raised to >$25B for FY2026.
HBM3E $/stack
$320
HBM4 $/stack
$510
NVIDIA HBM4 allocation: ~20%
Key Customers
NVIDIA · AMD · 4 paying customers total
Recent Allocation Changes
JASM Phase 2 upgraded from 6nm to 3nm
Taiwan government approved upgrading TSMC's Japan JASM P2 from original 6nm plan to 3nm, adding 15K WSPM of advanced-node capacity by 2028.
Source: Taipei Times
Intel Fab 34 Apollo buyback for $14.2B
Intel repurchasing Apollo's 49% stake in Leixlip fab at $3.2B premium, restoring 100% ownership. Funded by cash + $6.5B new debt.
Source: Tom's Hardware; Intel
Samsung Taylor fab achieves EUV first light
>90% construction complete. Risk production targeting H2 2026. Tesla $16.5B anchor tenant for AI5/AI6 chips.
Source: Tom's Hardware
Micron reports record $23.86B quarterly revenue
Nearly 3x YoY growth with 74.9% gross margins. HBM4 volume shipments and 16-Hi samples shipped. CapEx raised to >$25B.
Source: Micron FQ2 2026 Earnings
Rapidus raises $1.7B from 32 investors
Japanese government becomes largest shareholder at 11.5%. Canon confirmed as first customer. Mass production on track for H2 2027.
Source: Rapidus; Nikkei
Samsung ships world's first commercial HBM4
Using vertically integrated 1c DRAM + 4nm foundry base die. Achieved "highest evaluation scores" in NVIDIA testing for speed and power efficiency.
Source: Samsung; KED Global
SK Hynix begins HBM4 mass production
Production at M16 Icheon and M15X Cheongju using 1b DRAM + TSMC 12nm base die. Mid-50% of NVIDIA HBM4 allocation.
Source: SK Hynix Q4 Earnings; Hankyung
ASML records record Q4 bookings
Nearly doubled consensus. Backlog through 2027. Memory orders surpassed logic for first time (56/44 split). 60+ High-NA systems ordered.
Source: ASML Q4 2025 Earnings
SMIC receives $7.778B Big Fund III investment
Big Fund Phase III plus six state banks invested in SMIC South to fund 7nm capacity doubling and potential 5nm development.
Source: Nikkei; SMIC filings
Intel 18A Panther Lake launches at CES
First commercial process combining GAA transistors + backside power delivery. Shipping across 200+ notebook designs. Yields ~60%.
Source: Intel CES 2026
Unlock full allocation intelligence
You can see which nodes are constrained — Pro shows who has the capacity, at what price, and when slots open up.
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- Full change log with detailed impact analysis
All benchmarks and data are derived from publicly available sources (earnings calls, press releases, analyst reports, regulatory filings). Figures are estimates for educational purposes only and should not be used as the sole basis for business or investment decisions. Full Terms & Data Provenance
Allocation & Supply FAQ
- Which TSMC nodes are sold out in 2026?
- TSMC's 2nm (N2/A16) and 3nm (N3E/N3P) nodes are fully booked through at least 2027-2028. New 3nm project kickoffs have been suspended, with TSMC steering all new customers toward 2nm. The 5nm/4nm family is constrained with 100% booking for H1 2026. CoWoS advanced packaging is also fully booked with lead times exceeding 50 weeks.
- What are current semiconductor foundry lead times?
- Lead times vary dramatically by node. TSMC 2nm: 78-156 weeks (2-3 year engagement). TSMC 3nm: 104+ weeks (new kickoffs suspended). TSMC 5nm/4nm: 22-32 weeks. TSMC 7nm: 8-16 weeks (declining). CoWoS packaging: 50+ weeks. Samsung 2nm and Intel 18A are ramping with limited external capacity.
- Is HBM memory available in 2026?
- All three major HBM suppliers (SK Hynix 53% share, Samsung 35%, Micron 11%) have sold out their entire 2026 production under non-cancellable contracts. HBM4 mass production began at SK Hynix and Samsung in February 2026. NVIDIA consumes approximately 68% of total HBM output.
- What is the CoWoS packaging bottleneck?
- TSMC CoWoS advanced packaging is fully booked with ~80,000 WPM capacity, targeting 130,000 WPM by end 2026. NVIDIA holds ~60% of total CoWoS allocation and >70% of CoWoS-L specifically. Lead times exceed 50 weeks for new orders. OSAT outsourcing to Amkor and SPIL provides ~20,000 WPM of additional capacity.
- How does Samsung's foundry compare to TSMC in 2026?
- Samsung's foundry recovered to 80%+ utilization in Q1 2026, driven largely by internal HBM4 base-die production on 4nm. Samsung 2nm (SF2) entered mass production Q4 2025 with 50-60% yields vs TSMC's 70%+ at 2nm. Samsung 3nm is being phased out (yields stuck at ~50%). Tesla's $16.5B deal is Samsung's largest external foundry contract.
- What is Intel 18A's status for external customers?
- Intel 18A entered HVM with Panther Lake in January 2026 — the only process combining GAA transistors and backside power delivery. Yields are at ~60%. External customers include Microsoft (Maia), Amazon/AWS, and the U.S. Government. Apple is reportedly evaluating 18A for low-end M-series. External foundry revenue was just $222M in Q4 2025.
Foundry Allocation Status — 13 Nodes
Allocation status, lead times, and utilization for major foundry process nodes. Data as of April 2026.
| Foundry | Node | Status | Lead Time | Utilization | Price Trend | Geo Risk | Note |
|---|---|---|---|---|---|---|---|
| TSMC | N2 / A16 | Fully Booked | 78-156 wks | — | rising | moderate | Fully booked through 2028. HVM started Q4 2025 at Fab 20 + Fab 22. ~70% initial yield. Apple holds >50% of initial allocation. A16 (backside power) on track for H2 2026 risk production. |
| TSMC | N3E / N3P / N3B | Fully Booked | 104-156 wks | 98% | rising | moderate | 28% of Q4 2025 wafer revenue. Running at ~100% utilization. New project kickoffs SUSPENDED. Hot-run pricing at 50-100% premium for ~10% of capacity. |
| TSMC | N5 / N4P / N4NP | Constrained | 22-32 wks | 97% | rising | moderate | 35% of Q4 2025 wafer revenue. 100% booked for H1 2026. Arizona Fab 21 P1 in HVM since Q4 2024 with yields on par with Taiwan. 3-10% price increase effective Jan 2026. |
| TSMC | N7 / N6 | Available | 8-16 wks | 65% | declining | low | 14% of Q4 2025 revenue. Utilization dropped below 70% as customers migrate to N5/N3. TSMC implemented 10% price cut Jan 2025. |
| TSMC | N16/12 / N28/40 | Available | 4-12 wks | 72% | flat | low | 23% of Q4 revenue (declining). Sub-80% utilization. Fab 14 mature capacity being cut 15-20% by 2028. JASM P1 at ~50% utilization. |
| Samsung | SF2 / SF2P (2nm) | Constrained | N/A | — | rising | moderate | Mass production started Q4 2025 (Exynos 2600). Yields at 50-60%. Tesla AI6 is $16.5B anchor deal but MPW delayed ~6 months. Taylor TX fab risk production H2 2026. |
| Samsung | 3GAE / 3GAP (3nm) | Available | N/A | 45% | declining | low | Commercial disappointment. Yields stuck at ~50% vs TSMC >90%. S3 Hwaseong line being fully converted to 2nm. Only notable product is Exynos 2500. |
| Samsung | 4LPP (4nm) | Constrained | N/A | 80% | flat | low | The HBM workhorse. >50% of Pyeongtaek 4nm capacity allocated to internal HBM4 logic base-die production. Shipped world's first commercial HBM4 on Feb 12, 2026. |
| Intel | Intel 18A | Early Access | N/A | — | tbd | low | HVM started with Panther Lake at CES Jan 2026. Only foundry shipping GAA + backside power in volume. Yields at ~60%. External revenue just $222M in Q4. Apple reportedly evaluating for low-end M-series (2027). |
| GlobalFoundries | 12nm-22nm | Available | 10-16 wks | 85% | flat | low | FY2025 revenue $6.79B (+1% YoY). Utilization recovered to 85-86%. Automotive revenue record $1.4B (+17%). Silicon photonics doubled to >$200M. |
| SMIC | N+2 (7nm) | Severely Constrained | N/A | 96% | rising | high | Record FY2025 revenue $9.33B (+16.2%). Q4 utilization 95.7%. Huawei dominates for Kirin 9020 and Ascend 910C/910D. Plans to double 7nm capacity in 2026. |
| UMC | 14nm-28nm | Available | 8-14 wks | 78% | flat | low | Q4 2025 utilization at 78% (up from 70% YoY). 22nm revenue surged 93% YoY. Singapore Fab 12i P3 production starting 2026. |
| Rapidus | 2nm GAA | Early Access | N/A | — | tbd | low | Pilot line operational since Apr 2025. Functional 2nm GAA prototypes demonstrated Jul 2025. Raised $1.7B Feb 2026 from 32 investors. Canon confirmed as first customer. Mass production targets H2 2027. |
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