Semiconductor Component Lead Times — Historical Time Series Data
Lead times in weeks for key AI chip supply chain components: CoWoS packaging, HBM memory by generation, TSMC leading-edge wafers. Tracks the bottleneck cycle from 2022–2026.
Semiconductor Component Lead Times
Lead times in weeks for key AI chip supply chain components: CoWoS packaging, HBM memory by generation, TSMC leading-edge wafers. Tracks the bottleneck cycle from 2022–2026.
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Data Table
| Period | Series | Value |
|---|---|---|
Q1 2022 | CoWoS-S | ••• |
Q4 2022 | CoWoS-S | ••• |
Q2 2023 | CoWoS-S | ••• |
Q2 2023 | HBM3E | ••• |
Q4 2023 | CoWoS-S | ••• |
Q4 2023 | CoWoS-L | ••• |
Q4 2023 | HBM3E | ••• |
Q4 2023 | TSMC N3 | ••• |
Q2 2024 | CoWoS-S | 40 |
Q2 2024 | CoWoS-L | 52 |
Q2 2024 | HBM3E | 40 |
Q2 2024 | TSMC N3 | 44 |
Q4 2024 | TSMC N3 | 36 |
Q4 2024 | CoWoS-S | 32 |
Q4 2024 | CoWoS-L | 44 |
Q4 2024 | HBM3E | 28 |
Q1 2026 | TSMC N3 | 30 |
Q1 2026 | CoWoS-S | 28 |
Q1 2026 | CoWoS-L | 36 |
Q1 2026 | HBM3E | 20 |
Methodology & Sources
Compiled from TSMC earnings calls, SK Hynix/Samsung investor days, DigiTimes Asia procurement reports, SemiAnalysis supply chain research, and industry procurement surveys. Lead times represent booking-to-delivery for new capacity orders, not existing LTAs.
Citations:
- DigiTimes / SemiAnalysis (Mar 2022)
- Industry reports (Dec 2022)
- TSMC earnings Q2 2023 / SemiAnalysis (Jul 2023)
- SK Hynix investor day 2023 (Jun 2023)
- Goldman Sachs semi report Dec 2023 (Dec 2023)
- Industry estimates (Dec 2023)
- Multiple analyst reports Dec 2023 (Dec 2023)
- TSMC Q3 2023 earnings (Oct 2023)
- DigiTimes / TrendForce (Jun 2024)
- DigiTimes Asia May 2024 (May 2024)
- TrendForce Q2 2024 (Jun 2024)
- Industry estimates Q2 2024 (Jun 2024)
- TSMC investor day Dec 2024 (Dec 2024)
- SemiVision / GlobalSemiResearch (Dec 2024)
- GlobalSemiResearch Dec 2024 (Dec 2024)
- TrendForce / DeepResearch (Dec 2024)
- Silicon Analysts estimate Mar 2026 (Mar 2026)
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