Semiconductor Earnings Tracker
Track upcoming and recent semiconductor earnings reports for TSMC, NVIDIA, AMD, Intel, Samsung, SK Hynix, Micron, ASML, Broadcom, and more. View key metrics, guidance, and what to watch for each company.
Semiconductor Earnings Tracker
Track upcoming and recent earnings for major semiconductor companies. Key metrics, guidance, and what to watch for each report.
Calendar last updated: · scheduled dates on file through Jan 27, 2027
Upcoming Earnings
What to watch
- •Net sales and gross margin vs guidance
- •EUV and High-NA EUV system shipments
- •China share of system sales
- •Early view of 2027 demand
What to watch
- •Revenue by node, especially N3 and the N2 ramp
- •Gross margin vs the 65-67% guided range
- •CoWoS / advanced packaging capacity commentary
- •Full-year capex refinement
- •Utilization by node
What to watch
- •Calendar 2026 / 2027 WFE outlook
- •Etch and deposition demand from DRAM and NAND upgrades
- •China share of revenue
- •Gate-all-around and advanced packaging tool revenue
- •Gross margin
What to watch
- •Client and server ASP vs volume mix
- •Intel Foundry external revenue
- •18A / 14A ramp progress
- •Data center segment margin
What to watch
- •HBM revenue and HBM4 share of the mix
- •DRAM and NAND pricing trends
- •Operating margin trajectory
- •Capex plans for 2027
What to watch
- •Process control demand at leading-edge logic and memory
- •Advanced packaging inspection revenue
- •China share of revenue
- •Guidance for the December quarter
What to watch
- •HBM revenue and HBM4 ramp
- •Memory division operating profit
- •Foundry utilization and SF2 (2nm) progress
- •DRAM and NAND pricing commentary
What to watch
- •Data center segment revenue
- •Instinct MI-series accelerator ramp
- •EPYC server share
- •Client and gaming segment trends
What to watch
- •Fiscal 2027 WFE outlook
- •Leading-edge logic (gate-all-around) and DRAM equipment demand
- •Advanced packaging revenue
- •China share of revenue
What to watch
- •Data center revenue and sequential growth
- •Blackwell vs Vera Rubin product mix and timing
- •Inference vs training revenue split
- •Gross margin trajectory
- •China revenue commentary
Recent Results
Record quarter and fiscal year. Server LPDDR SOCAMM revenue more than doubled quarter over quarter.
Guidance: Q1 FY2027: revenue $61.5B ± $1.5B; GAAP gross margin ~85.95%; GAAP EPS $37.84 ± $1.00
AI semiconductor revenue $16.7B, up 221% YoY. Non-GAAP EPS $3.32.
Guidance: Q4 FY2026: revenue ~$34.8B; non-GAAP operating income ~66% of revenue; AI semiconductor revenue ~$21.7B
Data Center revenue $89.0B, up 117% YoY.
Guidance: Q3 FY2027: revenue $108.0B ± 2%; GAAP and non-GAAP gross margin 74.0% ± 50bp
Record revenue and operating income; calendar 2026 Semiconductor Systems revenue expectations raised again. Non-GAAP EPS a record $3.50.
Guidance: Q4 FY2026: revenue $10.25B ± $500M; non-GAAP EPS $4.02 ± $0.20
Record revenue. Data Center segment revenue $6.7B, up 107% YoY. Non-GAAP: gross margin 56%, EPS $1.66.
Guidance: Q3 2026: revenue ~$13B ± $300M; non-GAAP gross margin ~56%
Revenue and operating profit at all-time highs. DS Division revenue KRW 127.5T, operating profit KRW 89.2T; first HBM4E samples shipped to major customers.
Guidance: H2 2026: memory demand expected to stay robust, centered on servers (no numeric guidance)
Record revenue, operating margin and earnings per share. Non-GAAP: gross margin 52.0%, EPS $1.82.
Guidance: September 2026 quarter: revenue $8.10B ± $400M; gross margin 52.0% ± 1%; operating margin 39.5% ± 1%; EPS $2.15 ± $0.15
Mass shipments of HBM4 began in the quarter, with production ramping in the second half.
Revenue above the midpoint of guidance. Ten-for-one stock split effective June 11, 2026; non-GAAP EPS $1.05.
Guidance: September 2026 quarter: revenue $4.0B ± $200M; GAAP gross margin 61.6% ± 1.0%; GAAP EPS $1.14 ± $0.10
Strongest revenue growth in more than fifteen years. The GAAP loss per share reflects a mark-to-market loss on escrowed shares; non-GAAP EPS was $0.42.
Guidance: Q3 2026: revenue $15.8-16.8B; GAAP gross margin 41.0%; GAAP EPS $0.31 (non-GAAP $0.38)
2nm reported for the first time at 3% of wafer revenue; 3nm 30%, 5nm 33%, 7nm 11%; 7nm and below 77%.
Guidance: Q3 2026: revenue US$44.6-45.8B, gross margin 65-67%, operating margin 56-58%
Order intake "remained extremely strong in the first half of the year"; full-year outlook raised.
Guidance: Q3 2026: net sales €11.0-12.0B, gross margin 55-57%; full year raised to €43-45B, gross margin 54-56%
Record results. HBM4 in high-volume shipments for the lead customer's platform; HBM4E volume production expected in calendar 2027.
Guidance: Q4 FY2026: revenue $50.0B ± $1.0B; GAAP gross margin ~86%; GAAP EPS $30.73 ± $1.00
Tracked Companies
| Company | Ticker | Sector | Key Metrics to Track |
|---|---|---|---|
| TSMC | TSM | Foundry | Revenue by node, utilization, gross margin, capex guidance |
| NVIDIA | NVDA | GPU / AI Accelerator | Data center revenue, H/B-series shipments, margin, guidance |
| AMD | AMD | GPU / CPU | MI-series revenue, EPYC share, data center segment |
| Intel | INTC | IDM / Foundry | 18A yield, IFS revenue/loss, product margins |
| Samsung | 005930.KS | Memory / Foundry | HBM revenue, foundry utilization, DRAM pricing |
| SK Hynix | 000660.KS | Memory | HBM revenue and share, DRAM pricing, margins |
| Micron | MU | Memory | HBM shipments, DRAM pricing, capacity outlook |
| ASML | ASML | Equipment | Bookings, EUV shipments, backlog, High-NA EUV |
| Broadcom | AVGO | Custom ASIC | AI ASIC revenue, custom chip pipeline, XPU wins |
| Applied Materials | AMAT | Equipment | WFE outlook, advanced packaging equipment |
| Lam Research | LRCX | Equipment | Etch market share, WFE forecast, China exposure |
| KLA | KLAC | Equipment | Process control, advanced node adoption |
The Tuesday digest tracks what foundry & memory earnings actually moved — wafer prices, HBM supply, capex signals. Free.
One short email a week — only when the data moves. No marketing, ever. One-click unsubscribe.
Related Tools
Frequently Asked Questions
- When do the major semiconductor companies report earnings?
- Semiconductor earnings cluster in four waves per year. TSMC reports first, typically in the third week of January, April, July and October. ASML reports within days of TSMC. Intel, Samsung and SK Hynix follow in the last week of the month. NVIDIA reports on a separate fiscal calendar, roughly three weeks after the rest, in late February, May, August and November. Micron is furthest out of step, reporting in late March, June, September and December. Confirmed dates for the current quarter are listed above.
- What are the key semiconductor earnings metrics to track?
- Revenue and year-over-year growth, gross margin trend, operating margin, and forward guidance are the baseline. Beyond those, the metric that matters is segment-specific: revenue by process node and fab utilization for foundries like TSMC, HBM revenue share and DRAM contract pricing for memory makers, bookings and backlog for equipment vendors like ASML and Applied Materials, and data center revenue plus product mix for NVIDIA and AMD.
- Why does NVIDIA report earnings on a different schedule?
- NVIDIA uses a fiscal year ending in late January, so its quarters are offset roughly one month from the calendar year used by most of the industry. NVIDIA's "Q1" covers February through April and is reported in May. This matters when comparing results: NVIDIA's reported quarter captures a different period than a same-named quarter from TSMC or Samsung, so year-over-year comparisons across the two are not aligned.
- Which semiconductor earnings matter most for AI infrastructure?
- TSMC for advanced-node and CoWoS packaging capacity, since it is the binding constraint on accelerator supply. SK Hynix and Micron for HBM pricing and qualification status. NVIDIA for data center demand. ASML for the equipment order book, which leads fab capacity by 12 to 18 months. Read together, these four give most of the forward signal on AI accelerator supply and cost.