CoWoS Packaging Capacity (TSMC) — Historical Time Series Data
TSMC CoWoS monthly capacity expansion 2023–2026, tracking the AI chip packaging bottleneck.
CoWoS Packaging Capacity (TSMC)
TSMC CoWoS monthly capacity expansion 2023–2026, tracking the AI chip packaging bottleneck.
5 data points·Unit: wafers/month·Last updated: Mar 2026
Data Table
| Period | Series | Value |
|---|---|---|
End 2023 | CoWoS Total Capacity | ••• |
Q3 2024 | CoWoS Total Capacity | ••• |
End 2024 | CoWoS Total Capacity | 40,000 wpm |
End 2025 | CoWoS Total Capacity | 72,500 wpm |
End 2026 (target)P | CoWoS Total Capacity | 125,000 wpm |
Methodology & Sources
Sources: Nomad Semi (Sep 2024), TweakTown (Jun 2024), SemiVision/SemiWiki (Dec 2024), GlobalSemiResearch (Dec 2025).
Citations:
- Nomad Semi (Sep 2024)
- TweakTown / Ctee (Jun 2024)
- SemiVision / SemiWiki (Dec 2024)
- Nomad Semi / SemiVision (Dec 2025)
- GlobalSemiResearch (Dec 2025)