Fab Capacity Utilization — Historical Time Series Data
TSMC, UMC, and Samsung foundry utilization rates quarterly from Q1 2022 through Q1 2026. Shows the two-speed recovery: leading-edge at 100% vs mature nodes declining. Samsung foundry series tracks the yield crisis and customer defections to TSMC.
Fab Capacity Utilization
TSMC, UMC, and Samsung foundry utilization rates quarterly from Q1 2022 through Q1 2026. Shows the two-speed recovery: leading-edge at 100% vs mature nodes declining. Samsung foundry series tracks the yield crisis and customer defections to TSMC.
Data sparse before 2022. Public pricing data for this category is limited prior to the AI demand inflection. Data points before 2022 are single-source estimates and should be treated as directional only.
5 data point values hidden. Unlock exact values, sources, and exports with Pro.
Data Table
| Period | Series | Value |
|---|---|---|
Q3 2022 | TSMC Leading Edge (≤7nm) | ••• |
Q3 2022 | UMC Mature (>14nm) | ••• |
Q4 2022 | TSMC Leading Edge (≤7nm) | ••• |
Q1 2023 | UMC Mature (>14nm) | ••• |
Q1 2023 | TSMC Leading Edge (≤7nm) | ••• |
Q2 2023 | TSMC Leading Edge (≤7nm) | 90% |
Q3 2023 | UMC Mature (>14nm) | 75% |
H2 2023 | TSMC Leading Edge (≤7nm) | 100% |
2024 | UMC Mature (>14nm) | 65% |
2024 | TSMC Leading Edge (≤7nm) | 100% |
2024 (TSMC mature) | TSMC Mature (≥14nm) | 70% |
H1 2025 | UMC Mature (>14nm) | 68% |
H1 2025 (TSMC mature) | TSMC Mature (≥14nm) | 72% |
Methodology & Sources
Sources: TSMC quarterly earnings transcripts, SemiAnalysis earnings analysis, Deep Research (120 sources). Note: foundries do not disclose exact utilization by node; figures are analyst estimates from wafer shipment and revenue data.
Citations:
- SemiAnalysis (Jan 2023)
- Deep Research (120 sources) (Mar 2026)
- UMC earnings / Silicon Analysts (Mar 2026)
- SemiAnalysis (Apr 2023)
- UMC earnings / industry reports (Mar 2026)
- TSMC Annual Report 2024 (Feb 2025)
- UMC Q1 2025 earnings / Silicon Analysts (Mar 2026)
- TSMC Q1 2025 earnings / Silicon Analysts (Mar 2026)
Related Tools
Related Analysis
Market intelligence on this data
All market intelligence →TSMC $265B US CapEx Commitment + ASML 30% EUV Capacity Surge Signal Multi-Year AI Supply Expansion — with Equipment Price Hike Risk
TSMC CapEx: +$100B incremental US commitment (total $265B), 2026 CapEx at high end of $52–56B range; ASML EUV/DUV capacity: +30% per year for 2 years; ASML 2026 revenue guidance raised ~15–19% vs prior midpoint (€38B → €44B midpoint); ASML EUV price hike quantum not yet disclosed — wafer/packaging cost pass-through risk flagged but unquantified.
SK Hynix CEO Flags 2027 as Worst-Ever HBM Supply Crunch; $26.5B IPO Capital Earmarked for Capacity Expansion
Capacity expansion funded: $26.5B raised (new fab + packaging facility + EUV scanners); Supply gap: demand forecasted to exceed supply through 2030+; No specific yield or price-per-unit figure disclosed.
HBM Supply Shortage Persists as SK Hynix Commands 56.4% Market Share; Micron Commits $250B to Domestic DRAM Expansion
HBM shortage: supply constrained with SK Hynix holding 56.4% market share per SEC filing; Micron US DRAM capacity target: 40% of total output domestically by 2035; Micron data center segment gross margin reached 87% on $11.5B revenue (up 103% QoQ), signaling sustained premium pricing on memory inputs to AI hardware.
SK Hynix Commits $706B to HBM/DRAM Scale-Up as ISM Flags Memory Components in Active Short Supply
Capacity: P&T7 packaging facility targeted for end-2027; M17 NAND fab operations targeted H1 2029; SK Group aggregate HBM/DRAM CapEx: ~$706B committed. Supply tightness signal: ISM June 2026 survey flags memory in active short supply (no precise % figure cited). Bernstein projects SK Hynix DRAM gross margins peaking at ~92.7% in Q4 2026, implying sustained elevated HBM ASPs through at least 2028.
Frequently Asked Questions
- What is current semiconductor fab utilization?
- TSMC fab utilization recovered to approximately 90% by Q1 2025, up from the cyclical trough of roughly 70% in Q2 2023. Advanced nodes (3nm, 5nm) run at near-100% utilization while mature nodes (28nm+) remain around 60–70%.
- Why did fab utilization drop in 2023?
- The 2023 utilization downturn was caused by post-COVID inventory correction in consumer electronics (PCs, smartphones), coinciding with the DRAM/NAND price crash. AI demand partially offset this at leading-edge nodes, but mature nodes saw severe underutilization.