Fab Capacity Utilization — Historical Time Series Data
TSMC, UMC, and Samsung foundry utilization rates quarterly from Q1 2022 through Q1 2026. Shows the two-speed recovery: leading-edge at 100% vs mature nodes declining. Samsung foundry series tracks the yield crisis and customer defections to TSMC.
Fab Capacity Utilization — latest readings
23 data points across 4 series, covering Q1 2022 to Q3 2026. Values below are free; the full point-level history is available with Pro.
| Series | Period | Latest (%) | Change |
|---|---|---|---|
| Samsung Foundry | Q1 2026 | 65% | +8.3% versus Q4 2024 |
| TSMC Leading Edge (≤7nm) | 2024 | 100% | 0.0% versus H2 2023 |
| UMC Mature (>14nm) | Q2 2026 | 85% | +7.6% versus Q1 2026 |
| TSMC Mature (≥14nm) | H1 2025 (TSMC mature) | 72% | +2.9% versus 2024 (TSMC mature) |
Fab Capacity Utilization
TSMC, UMC, and Samsung foundry utilization rates quarterly from Q1 2022 through Q1 2026. Shows the two-speed recovery: leading-edge at 100% vs mature nodes declining. Samsung foundry series tracks the yield crisis and customer defections to TSMC.
Data sparse before 2022. Public pricing data for this category is limited prior to the AI demand inflection. Data points before 2022 are single-source estimates and should be treated as directional only.
12 data point values hidden. Unlock exact values, sources, and exports with Pro.
Data Table
| Period | Series | Value |
|---|---|---|
Q1 2022 | Samsung Foundry | ••• |
Q3 2022 | Samsung Foundry | ••• |
Q3 2022 | TSMC Leading Edge (≤7nm) | ••• |
Q3 2022 | UMC Mature (>14nm) | ••• |
Q4 2022 | TSMC Leading Edge (≤7nm) | ••• |
Q1 2023 | UMC Mature (>14nm) | ••• |
Q1 2023 | TSMC Leading Edge (≤7nm) | ••• |
Q2 2023 | TSMC Leading Edge (≤7nm) | 90% |
Q2 2023 | Samsung Foundry | ••• |
Q3 2023 | UMC Mature (>14nm) | ••• |
H2 2023 | TSMC Leading Edge (≤7nm) | 100% |
Q4 2023 | Samsung Foundry | ••• |
2024 | UMC Mature (>14nm) | ••• |
2024 | TSMC Leading Edge (≤7nm) | 100% |
2024 (TSMC mature) | TSMC Mature (≥14nm) | 70% |
Q2 2024 | Samsung Foundry | 55% |
Q4 2024 | Samsung Foundry | 60% |
H1 2025 | UMC Mature (>14nm) | 68% |
H1 2025 (TSMC mature) | TSMC Mature (≥14nm) | 72% |
Q1 2026 | UMC Mature (>14nm) | 79% |
Q1 2026 | Samsung Foundry | 65% |
Q2 2026 | UMC Mature (>14nm) | 85% |
Q3 2026P | UMC Mature (>14nm) | ••• |
Methodology & Sources
Sources: TSMC quarterly earnings transcripts, SemiAnalysis earnings analysis, Deep Research (120 sources). Note: foundries do not disclose exact utilization by node; figures are analyst estimates from wafer shipment and revenue data.
Citations:
- Industry estimates Q1 2022 (Mar 2022)
- DigiTimes / analyst estimates Q3 2022 (Sep 2022)
- SemiAnalysis (Jan 2023)
- Deep Research (120 sources) (Mar 2026)
- UMC earnings / Silicon Analysts (Mar 2026)
- SemiAnalysis (Apr 2023)
- Samsung Q2 2023 earnings (Jul 2023)
- UMC earnings / industry reports (Mar 2026)
- Samsung Q4 2023 earnings (Jan 2024)
- TSMC Annual Report 2024 (Feb 2025)
- Samsung investor day / analyst estimates Q2 2024 (Jun 2024)
- Industry estimates Q4 2024 (Dec 2024)
- UMC Q1 2025 earnings / Silicon Analysts (Mar 2026)
- TSMC Q1 2025 earnings / Silicon Analysts (Mar 2026)
- UMC Q1 2026 results release (Apr 2026)
- Silicon Analysts estimate Mar 2026 (Mar 2026)
- UMC Q2 2026 results release (Jul 2026)
Related Tools
Related Analysis
Market intelligence on this data
All market intelligence →SK Hynix Breaks Ground on Indiana HBM Fab: $4B US Domestic Capacity Confirmed
CapEx commitment: ~$4B USD; production ramp targeted 2029; near-term (2026–2028) HBM supply capacity unchanged.
HBM4/4e Supply Squeeze Drives 50%+ Price Surge Threat; Nvidia Passes 15%+ Cost Hike Downstream
HBM price impact: +50%+ potential increase in 2027 (TrendForce via Polinews); AI server system pricing: +15%+ (Nvidia, multiple sources); AMD CoWoS demand: +308% YoY to 530,000 wafers in 2026 (Morgan Stanley); Global HBM TAM: ~$35B (2025) → ~$100B (2028), ~40% CAGR (Micron, Hot Chips 2026)
Nvidia Confirms >15% AI Server Price Hikes Driven by Soaring HBM Costs
Est. AI server BOM cost increase: +15% or more on affected Vera Rubin / Grace Blackwell system configurations; memory (HBM) identified as primary cost driver.
TSMC CoWoS 5.5x Reticle Hits 98-99% Yield in Volume Production; 14x Roadmap Confirmed to 2029
Yield: CoWoS 5.5x reticle confirmed at 98-99% in volume production (positive); Roadmap: 14x reticle-size CoWoS targeted by 2029; SoIC pitch: 6 microns currently in HVM, targeting 4.5 microns by 2029.
Frequently Asked Questions
- What is current semiconductor fab utilization?
- TSMC fab utilization recovered to approximately 90% by Q1 2025, up from the cyclical trough of roughly 70% in Q2 2023. Advanced nodes (3nm, 5nm) run at near-100% utilization while mature nodes (28nm+) remain around 60–70%.
- Why did fab utilization drop in 2023?
- The 2023 utilization downturn was caused by post-COVID inventory correction in consumer electronics (PCs, smartphones), coinciding with the DRAM/NAND price crash. AI demand partially offset this at leading-edge nodes, but mature nodes saw severe underutilization.