Silicon Analysts
API

Silicon Analysts Data API

Structured semiconductor data for AI agents, applications, and researchers. Free to use — no API key required for read endpoints.

Connect to AI Agents (MCP)

New

MCP (Model Context Protocol) lets AI assistants like Claude directly query Silicon Analysts data during conversations — no manual copy-paste needed. Ask about chip costs, wafer pricing, or supply chain trends and get live data in real time.

Connect to Claude Desktop

1Generate an API key below (or skip for anonymous tier — 10 req/day)
2Open Claude Desktop → Settings → Developer → Edit Config
3Add to claude_desktop_config.json:
{
  "mcpServers": {
    "silicon-analysts": {
      "url": "https://siliconanalysts.com/api/mcp",
      "headers": {
        "Authorization": "Bearer sa_live_YOUR_API_KEY_HERE"
      }
    }
  }
}
4Restart Claude Desktop
5Ask Claude anything about semiconductor supply chain data

Available MCP Tools

ToolWhat it answers
get_accelerator_costsAI chip specs, costs, and margins (18 chips)
calculate_chip_costDie dimensions → manufacturing cost estimate
get_hbm_market_dataHBM pricing, market share, and forecasts
get_market_pulseCurrent supply chain signals and headlines
get_wafer_pricingWafer price ranges by process node
get_packaging_costsPackaging costs and capabilities + HBM specs

Example Prompts

After connecting, try asking Claude:

What's the current wafer price range for TSMC N3?
Calculate chip cost for a 10x10mm die on N3 with CoWoS packaging
Compare H100 vs B200 manufacturing cost breakdown
What are the latest supply chain signals in advanced packaging?

Quick Start

# Get all AI accelerator cost breakdowns curl https://siliconanalysts.com/api/v1/accelerators # Filter by vendor curl "https://siliconanalysts.com/api/v1/accelerators?vendor=NVIDIA" # Calculate chip cost (POST) curl -X POST https://siliconanalysts.com/api/v1/calculate/chip-cost \ -H "Content-Type: application/json" \ -d '{"dieWidth": 26, "dieHeight": 33, "processNode": "5nm"}' # Get HBM market data curl https://siliconanalysts.com/api/v1/hbm # Search analysis articles curl "https://siliconanalysts.com/api/v1/articles?q=tsmc&limit=5"

Endpoints

MethodEndpoint
GET/api/v1
GET/api/v1/accelerators
GET/api/v1/hbm
GET/api/v1/articles
GET/api/v1/market-pulse
GET/api/v1/market-data
GET/api/v1/foundry/wafer-pricing
GET/api/v1/foundry/packaging-costs
POST/api/v1/calculate/chip-cost
GET/api/v1

Lists all available endpoints, schemas, and usage terms. Start here for discovery.

Example Response

{
  "name": "Silicon Analysts Data API",
  "version": "1",
  "endpoints": [ ... ],
  "usage": { "tracking": "All requests logged" }
}
Cache: 1 hour · Rate limit: 10 req/day (no key) · 100 req/day (free key) · 10k req/hr (Pro)
GET/api/v1/accelerators

Manufacturing cost data for 13 AI accelerators: NVIDIA H100, H200, B100, B200, GB200, AMD MI300X, MI355X, Intel Gaudi 3, Google TPU v5p, AWS Trainium 2, Microsoft Maia 100, Meta MTIA v2. Includes logic die, HBM, packaging, and test costs.

Query Parameters

vendorFilter by vendor (case-insensitive)?vendor=NVIDIA
chipFilter by chip name (partial match, case-insensitive)?chip=H100
fieldsReturn only specified fields (comma-separated)?fields=chip,estMfgCostUsd

Example Response

{
  "success": true,
  "data": [{
    "chip": "NVIDIA H100 SXM5",
    "vendor": "NVIDIA",
    "processNode": "TSMC 4N",
    "estMfgCostUsd": 3320,
    "estSellPriceUsd": 32500,
    "chipGrossMarginPct": 87.5,
    "costBreakdown": {
      "logicDieCostUsd": 300,
      "hbmCostUsd": 1350,
      "packagingCostUsd": 750,
      "testAssemblyCostUsd": 920
    },
    ...
  }],
  "meta": { "count": 13, "source": "Silicon Analysts" }
}
Cache: 1 hour · Rate limit: 10 req/day (no key) · 100 req/day (free key) · 10k req/hr (Pro)
GET/api/v1/hbm

Full HBM market dataset with 9 data tables: accelerator specs, HBM generation specs, vendor market share, spot prices, leading indicators, qualification feed, revenue forecast, supplier revenue, and validation checks.

Example Response

{
  "success": true,
  "data": {
    "accelerators": [ ... ],
    "specs": [ ... ],
    "marketShare": [ ... ],
    "spotPrices": [ ... ],
    "leadingIndicators": [ ... ],
    "qualificationFeed": [ ... ],
    "revenueForecast": [ ... ],
    "supplierRevenue": [ ... ],
    "validationChecks": [ ... ]
  },
  "meta": { "source": "Silicon Analysts", "apiVersion": "1" }
}
Cache: 5 minutes · Rate limit: 10 req/day (no key) · 100 req/day (free key) · 10k req/hr (Pro)
GET/api/v1/articles

Metadata for 30+ semiconductor industry articles. Includes title, date, description, executive insight, key takeaways, cited sources, and full URL.

Query Parameters

limitReturn only the N most recent articles?limit=5
qSearch in title and description (case-insensitive)?q=nvidia

Example Response

{
  "success": true,
  "data": [{
    "slug": "nvidia-gpu-prices-double-...",
    "title": "Nvidia GPU Prices Double as AI Demand...",
    "date": "2026-01-23",
    "description": "Analysis of Jensen Huang's comments...",
    "insight": "The spillover of AI-driven demand...",
    "keyTakeaways": ["...", "..."],
    "url": "https://siliconanalysts.com/analysis/...",
    "sources": [{ "publisher": "...", "title": "..." }]
  }],
  "meta": { "count": 30, "source": "Silicon Analysts" }
}
Cache: 1 hour · Rate limit: 10 req/day (no key) · 100 req/day (free key) · 10k req/hr (Pro)
GET/api/v1/market-pulse

Real-time semiconductor market intelligence across 6 sectors: Logic, Memory, Packaging, Connectivity, Power, Geopolitics. Each headline includes trend direction, source, and impact analysis.

Query Parameters

categoryFilter by sector (logic, memory, packaging, connectivity, power, geopolitics)?category=memory
trendFilter by trend direction (up, down, neutral)?trend=up
limitMax items to return (1-50)?limit=5

Example Response

{
  "success": true,
  "data": [{
    "category": "Memory",
    "headline": "HBM3e prices expected to increase 15-20%...",
    "trend": "up",
    "date": "Jan 2026",
    "source": "Silicon Analysts Research",
    "impact_analysis": "HBM demand continues to grow..."
  }],
  "meta": { "count": 12, "categories": ["Logic", "Memory", ...] }
}
Cache: 5 minutes · Rate limit: 10 req/day (no key) · 100 req/day (free key) · 10k req/hr (Pro)
GET/api/v1/market-data

List all 14 semiconductor market data datasets with metadata. Covers wafer pricing, HBM/DRAM pricing, CoWoS capacity, fab utilization, NRE costs, AI chip BOM, capex, lead times, NAND pricing, and cloud GPU pricing. Individual dataset endpoints (/api/v1/market-data/{id}) require Pro for full history.

Example Response

{
  "success": true,
  "data": [{
    "id": "wafer-price-tsmc",
    "name": "TSMC Wafer Price by Node",
    "category": "Wafer Pricing",
    "unit": "USD/wafer",
    "description": "Estimated 300mm wafer prices...",
    "proOnly": false
  }, ...],
  "meta": { "count": 14 }
}
Cache: 1 hour · Rate limit: 10 req/day (no key) · 100 req/day (free key) · 10k req/hr (Pro)
GET/api/v1/foundry/wafer-pricing

Current wafer price ranges for 7 process nodes across TSMC, Samsung, and Intel. Includes defect density, NRE/mask set costs, and node maturity status with yield risk ratings.

Query Parameters

nodeFilter to a specific node (tsmc-n3, tsmc-n5, tsmc-n7, samsung-3nm, samsung-5nm, intel-16, tsmc-28)?node=tsmc-n3

Example Response

{
  "success": true,
  "data": [{
    "node": "tsmc-n3",
    "label": "TSMC 3nm (N3)",
    "waferCost": { "avg": 19500, "min": 17000, "max": 22000, "unit": "USD/wafer" },
    "defectDensity": { "mature": 0.09, "early": 0.14, "unit": "defects/cm²" },
    "nreCost": { "maskSetCost": 15000000, "totalNRE": 22000000, "unit": "USD" },
    "maturity": { "status": "Ramping", "yieldRisk": "High" },
    "source": "Analyst Reports, TrendForce, Morgan Stanley"
  }],
  "meta": { "count": 7, "updated": "2026-04-07" }
}
Cache: 1 hour · Rate limit: 10 req/day (no key) · 100 req/day (free key) · 10k req/hr (Pro)
GET/api/v1/foundry/packaging-costs

Advanced semiconductor packaging cost benchmarks and technology capabilities for 14 packaging types (CoWoS-S, CoWoS-L, EMIB, SoIC, InFO-PoP, FC-BGA, and more). Also returns HBM memory specs and per-stack costs across generations.

Query Parameters

typeFilter by packaging type (cowos, cowos-l, emib, soic, info-pop, fc-bga, fc-csp, etc.)?type=cowos

Example Response

{
  "success": true,
  "data": {
    "packaging": [{
      "id": "cowos",
      "name": "CoWoS-S (2.5D)",
      "description": "Silicon Interposer. Standard for high-end chips.",
      "category": "hpc-ai",
      "costBenchmark": { "cost": 600, "unit": "USD/package" },
      "capabilities": { "interposerActive": true, "stacking": false, ... }
    }],
    "hbmSpecs": [{
      "type": "HBM3e",
      "bandwidth": "1.2 TB/s",
      "capacity": "36 GB",
      "costPerStack": 300,
      "unit": "USD/stack"
    }]
  },
  "meta": { "packagingCount": 14, "hbmSpecCount": 5 }
}
Cache: 1 hour · Rate limit: 10 req/day (no key) · 100 req/day (free key) · 10k req/hr (Pro)
POST/api/v1/calculate/chip-cost

Calculate manufacturing cost breakdown for a custom chip design. Provide die dimensions and process node to get yield analysis, cost per die, packaging, and ASP estimates.

Request Body (JSON)

dieWidthnumber *Die width in mm
dieHeightnumber *Die height in mm
processNodestring *Process node (e.g., "7nm", "5nm", "28nm")
waferCostnumberOverride wafer cost in USD
packagingTypestringPackaging type (e.g., "Flip-Chip BGA")
packagingCostnumberOverride packaging cost in USD
hbmStacksnumberNumber of HBM stacks (0-8)
hbmCostnumberOverride per-stack HBM cost in USD
testCostnumberOverride test cost in USD
volumenumberAnnual production volume
marginTargetnumberTarget gross margin (0-1)

Example Response

{
  "success": true,
  "data": {
    "dieArea": 814,
    "processNode": "5nm",
    "waferCost": 16000,
    "gdpw": 69,
    "ndpw": 54,
    "yieldRate": 0.78,
    "costPerDie": 296.30,
    "packagingCost": 750,
    "hbmCost": 2700,
    "testCost": 150,
    "totalManufacturingCost": 3896.30,
    "suggestedASP": 6493.83,
    "marginTarget": 0.40,
    "volume": 100000
  }
}
Cache: No cache · Rate limit: 3 req/day (no key) · 20 req/day (free key) · 10k req/hr (Pro)

Authentication & Rate Limits

Read endpoints (GET) are accessible without an API key, subject to rate limits of 10 requests/day by IP. The calculate endpoint (POST) allows 3 requests/day without auth.

Generate a free API key below for higher rate limits (100 req/day). Pro keys unlock 10,000 req/hr. Include your key in requests via header:

# API key via X-API-Key header curl -H "X-API-Key: sa_live_abc123..." https://siliconanalysts.com/api/v1/accelerators # Or via Authorization header curl -H "Authorization: Bearer sa_live_abc123..." https://siliconanalysts.com/api/v1/hbm
TierGET EndpointsPOST CalculateAuth
Anonymous (no key)10 req/day3 req/dayNone required
Free API key100 req/day20 req/dayX-API-Key header
Pro API key10,000 req/hr10,000 req/hrX-API-Key header

Your API Keys

Sign in to generate API keys for higher rate limits and usage tracking.

API Playground

Try any endpoint live. No authentication required for read endpoints.

Try endpoints with live data — no API key required for public endpoints.

Need higher rate limits, webhook alerts, or bulk data access?

Pro API access is coming soon — higher rate limits, webhook alerts for price movements, and priority support.

Join the Pro Waitlist →

AI Agent Discovery

Silicon Analysts is optimized for discovery by AI agents and LLM-powered search.

/llms.txt — Machine-readable site description for LLM agents
/api/v1 — JSON API manifest for programmatic endpoint discovery
JSON-LD structured data on every page (Dataset, SoftwareApplication, Article)
/sitemap.xml — Full sitemap with all tools and articles

Data Sources

Cost estimates are derived from Epoch AI Monte Carlo models, Raymond James semiconductor research, TrendForce quarterly reports, and SemiAnalysis teardown data.

HBM market data is sourced from SK Hynix, Samsung, and Micron investor relations, TrendForce, and proprietary supply chain tracking models.

Estimates are directional and may vary ±15-20% from actual manufacturing costs. For full terms see Terms & Data Provenance.

Explore Interactive Tools

Use our interactive tools to model chip costs, compare accelerators, and analyze markets