Silicon Analysts Data API
Structured semiconductor data for AI agents, applications, and researchers. Free to use — no API key required for read endpoints.
Connect to AI Agents (MCP)
NewMCP (Model Context Protocol) lets AI assistants like Claude directly query Silicon Analysts data during conversations — no manual copy-paste needed. Ask about chip costs, wafer pricing, or supply chain trends and get live data in real time.
Connect to Claude Desktop
claude_desktop_config.json:{
"mcpServers": {
"silicon-analysts": {
"url": "https://siliconanalysts.com/api/mcp",
"headers": {
"Authorization": "Bearer sa_live_YOUR_API_KEY_HERE"
}
}
}
}Available MCP Tools
| Tool | What it answers |
|---|---|
| get_accelerator_costs | AI chip specs, costs, and margins (18 chips) |
| calculate_chip_cost | Die dimensions → manufacturing cost estimate |
| get_hbm_market_data | HBM pricing, market share, and forecasts |
| get_market_pulse | Current supply chain signals and headlines |
| get_wafer_pricing | Wafer price ranges by process node |
| get_packaging_costs | Packaging costs and capabilities + HBM specs |
Example Prompts
After connecting, try asking Claude:
Quick Start
# Get all AI accelerator cost breakdowns
curl https://siliconanalysts.com/api/v1/accelerators
# Filter by vendor
curl "https://siliconanalysts.com/api/v1/accelerators?vendor=NVIDIA"
# Calculate chip cost (POST)
curl -X POST https://siliconanalysts.com/api/v1/calculate/chip-cost \
-H "Content-Type: application/json" \
-d '{"dieWidth": 26, "dieHeight": 33, "processNode": "5nm"}'
# Get HBM market data
curl https://siliconanalysts.com/api/v1/hbm
# Search analysis articles
curl "https://siliconanalysts.com/api/v1/articles?q=tsmc&limit=5"Endpoints
/api/v1Lists all available endpoints, schemas, and usage terms. Start here for discovery.
Example Response
{
"name": "Silicon Analysts Data API",
"version": "1",
"endpoints": [ ... ],
"usage": { "tracking": "All requests logged" }
}/api/v1/acceleratorsManufacturing cost data for 13 AI accelerators: NVIDIA H100, H200, B100, B200, GB200, AMD MI300X, MI355X, Intel Gaudi 3, Google TPU v5p, AWS Trainium 2, Microsoft Maia 100, Meta MTIA v2. Includes logic die, HBM, packaging, and test costs.
Query Parameters
vendorFilter by vendor (case-insensitive)?vendor=NVIDIAchipFilter by chip name (partial match, case-insensitive)?chip=H100fieldsReturn only specified fields (comma-separated)?fields=chip,estMfgCostUsdExample Response
{
"success": true,
"data": [{
"chip": "NVIDIA H100 SXM5",
"vendor": "NVIDIA",
"processNode": "TSMC 4N",
"estMfgCostUsd": 3320,
"estSellPriceUsd": 32500,
"chipGrossMarginPct": 87.5,
"costBreakdown": {
"logicDieCostUsd": 300,
"hbmCostUsd": 1350,
"packagingCostUsd": 750,
"testAssemblyCostUsd": 920
},
...
}],
"meta": { "count": 13, "source": "Silicon Analysts" }
}/api/v1/hbmFull HBM market dataset with 9 data tables: accelerator specs, HBM generation specs, vendor market share, spot prices, leading indicators, qualification feed, revenue forecast, supplier revenue, and validation checks.
Example Response
{
"success": true,
"data": {
"accelerators": [ ... ],
"specs": [ ... ],
"marketShare": [ ... ],
"spotPrices": [ ... ],
"leadingIndicators": [ ... ],
"qualificationFeed": [ ... ],
"revenueForecast": [ ... ],
"supplierRevenue": [ ... ],
"validationChecks": [ ... ]
},
"meta": { "source": "Silicon Analysts", "apiVersion": "1" }
}/api/v1/articlesMetadata for 30+ semiconductor industry articles. Includes title, date, description, executive insight, key takeaways, cited sources, and full URL.
Query Parameters
limitReturn only the N most recent articles?limit=5qSearch in title and description (case-insensitive)?q=nvidiaExample Response
{
"success": true,
"data": [{
"slug": "nvidia-gpu-prices-double-...",
"title": "Nvidia GPU Prices Double as AI Demand...",
"date": "2026-01-23",
"description": "Analysis of Jensen Huang's comments...",
"insight": "The spillover of AI-driven demand...",
"keyTakeaways": ["...", "..."],
"url": "https://siliconanalysts.com/analysis/...",
"sources": [{ "publisher": "...", "title": "..." }]
}],
"meta": { "count": 30, "source": "Silicon Analysts" }
}/api/v1/market-pulseReal-time semiconductor market intelligence across 6 sectors: Logic, Memory, Packaging, Connectivity, Power, Geopolitics. Each headline includes trend direction, source, and impact analysis.
Query Parameters
categoryFilter by sector (logic, memory, packaging, connectivity, power, geopolitics)?category=memorytrendFilter by trend direction (up, down, neutral)?trend=uplimitMax items to return (1-50)?limit=5Example Response
{
"success": true,
"data": [{
"category": "Memory",
"headline": "HBM3e prices expected to increase 15-20%...",
"trend": "up",
"date": "Jan 2026",
"source": "Silicon Analysts Research",
"impact_analysis": "HBM demand continues to grow..."
}],
"meta": { "count": 12, "categories": ["Logic", "Memory", ...] }
}/api/v1/market-dataList all 14 semiconductor market data datasets with metadata. Covers wafer pricing, HBM/DRAM pricing, CoWoS capacity, fab utilization, NRE costs, AI chip BOM, capex, lead times, NAND pricing, and cloud GPU pricing. Individual dataset endpoints (/api/v1/market-data/{id}) require Pro for full history.
Example Response
{
"success": true,
"data": [{
"id": "wafer-price-tsmc",
"name": "TSMC Wafer Price by Node",
"category": "Wafer Pricing",
"unit": "USD/wafer",
"description": "Estimated 300mm wafer prices...",
"proOnly": false
}, ...],
"meta": { "count": 14 }
}/api/v1/foundry/wafer-pricingCurrent wafer price ranges for 7 process nodes across TSMC, Samsung, and Intel. Includes defect density, NRE/mask set costs, and node maturity status with yield risk ratings.
Query Parameters
nodeFilter to a specific node (tsmc-n3, tsmc-n5, tsmc-n7, samsung-3nm, samsung-5nm, intel-16, tsmc-28)?node=tsmc-n3Example Response
{
"success": true,
"data": [{
"node": "tsmc-n3",
"label": "TSMC 3nm (N3)",
"waferCost": { "avg": 19500, "min": 17000, "max": 22000, "unit": "USD/wafer" },
"defectDensity": { "mature": 0.09, "early": 0.14, "unit": "defects/cm²" },
"nreCost": { "maskSetCost": 15000000, "totalNRE": 22000000, "unit": "USD" },
"maturity": { "status": "Ramping", "yieldRisk": "High" },
"source": "Analyst Reports, TrendForce, Morgan Stanley"
}],
"meta": { "count": 7, "updated": "2026-04-07" }
}/api/v1/foundry/packaging-costsAdvanced semiconductor packaging cost benchmarks and technology capabilities for 14 packaging types (CoWoS-S, CoWoS-L, EMIB, SoIC, InFO-PoP, FC-BGA, and more). Also returns HBM memory specs and per-stack costs across generations.
Query Parameters
typeFilter by packaging type (cowos, cowos-l, emib, soic, info-pop, fc-bga, fc-csp, etc.)?type=cowosExample Response
{
"success": true,
"data": {
"packaging": [{
"id": "cowos",
"name": "CoWoS-S (2.5D)",
"description": "Silicon Interposer. Standard for high-end chips.",
"category": "hpc-ai",
"costBenchmark": { "cost": 600, "unit": "USD/package" },
"capabilities": { "interposerActive": true, "stacking": false, ... }
}],
"hbmSpecs": [{
"type": "HBM3e",
"bandwidth": "1.2 TB/s",
"capacity": "36 GB",
"costPerStack": 300,
"unit": "USD/stack"
}]
},
"meta": { "packagingCount": 14, "hbmSpecCount": 5 }
}/api/v1/calculate/chip-costCalculate manufacturing cost breakdown for a custom chip design. Provide die dimensions and process node to get yield analysis, cost per die, packaging, and ASP estimates.
Request Body (JSON)
dieWidthnumber *Die width in mmdieHeightnumber *Die height in mmprocessNodestring *Process node (e.g., "7nm", "5nm", "28nm")waferCostnumberOverride wafer cost in USDpackagingTypestringPackaging type (e.g., "Flip-Chip BGA")packagingCostnumberOverride packaging cost in USDhbmStacksnumberNumber of HBM stacks (0-8)hbmCostnumberOverride per-stack HBM cost in USDtestCostnumberOverride test cost in USDvolumenumberAnnual production volumemarginTargetnumberTarget gross margin (0-1)Example Response
{
"success": true,
"data": {
"dieArea": 814,
"processNode": "5nm",
"waferCost": 16000,
"gdpw": 69,
"ndpw": 54,
"yieldRate": 0.78,
"costPerDie": 296.30,
"packagingCost": 750,
"hbmCost": 2700,
"testCost": 150,
"totalManufacturingCost": 3896.30,
"suggestedASP": 6493.83,
"marginTarget": 0.40,
"volume": 100000
}
}Authentication & Rate Limits
Read endpoints (GET) are accessible without an API key, subject to rate limits of 10 requests/day by IP. The calculate endpoint (POST) allows 3 requests/day without auth.
Generate a free API key below for higher rate limits (100 req/day). Pro keys unlock 10,000 req/hr. Include your key in requests via header:
# API key via X-API-Key header
curl -H "X-API-Key: sa_live_abc123..." https://siliconanalysts.com/api/v1/accelerators
# Or via Authorization header
curl -H "Authorization: Bearer sa_live_abc123..." https://siliconanalysts.com/api/v1/hbm| Tier | GET Endpoints | POST Calculate | Auth |
|---|---|---|---|
| Anonymous (no key) | 10 req/day | 3 req/day | None required |
| Free API key | 100 req/day | 20 req/day | X-API-Key header |
| Pro API key | 10,000 req/hr | 10,000 req/hr | X-API-Key header |
Your API Keys
Sign in to generate API keys for higher rate limits and usage tracking.
API Playground
Try any endpoint live. No authentication required for read endpoints.
Try endpoints with live data — no API key required for public endpoints.
Need higher rate limits, webhook alerts, or bulk data access?
Pro API access is coming soon — higher rate limits, webhook alerts for price movements, and priority support.
AI Agent Discovery
Silicon Analysts is optimized for discovery by AI agents and LLM-powered search.
/llms.txt — Machine-readable site description for LLM agents/api/v1 — JSON API manifest for programmatic endpoint discovery/sitemap.xml — Full sitemap with all tools and articlesData Sources
Cost estimates are derived from Epoch AI Monte Carlo models, Raymond James semiconductor research, TrendForce quarterly reports, and SemiAnalysis teardown data.
HBM market data is sourced from SK Hynix, Samsung, and Micron investor relations, TrendForce, and proprietary supply chain tracking models.
Estimates are directional and may vary ±15-20% from actual manufacturing costs. For full terms see Terms & Data Provenance.
Explore Interactive Tools
Use our interactive tools to model chip costs, compare accelerators, and analyze markets