What Changed — Semiconductor Data Movements
Recent movements in semiconductor wafer pricing, AI accelerator manufacturing cost, foundry gross margins, foundry capacity, and NRE/mask-set cost, derived daily from an append-only data ledger. Each movement shows direction, magnitude, the two dates compared, and a confidence tier. Public sources only — no proprietary or insider data.
What Changed in Semiconductor Data
Recent movements across wafer pricing, AI accelerator cost, foundry margins, capacity, and NRE — tracked daily from our public-data ledger, every figure with provenance.
Comparing Nov 9, 2026 vs Nov 2, 2026 (7 days of history) ·
No significant movements in this window (last 7 days). Values are tracked daily; movements appear here when a figure crosses its significance threshold.
Download the full historical ledger (Pro)
Every figure here is a dated, append-only series. Get the complete history as CSV/JSONL for backtesting and models — join the list and we'll reach out.
Market intelligence behind the moves
All market intelligence →TSMC Weighs 20% CoWoS Price Hike as Packaging Capacity Tightens
CoWoS packaging quote: up to +20%; equipment lead time: 3-6 months → up to 8 months; Blackwell test time 3-4x Hopper, Rubin up to 7x; SK hynix LTAs cover >50% of 2027-2028 capacity across 14 customers
Nvidia Locks In Packaging Capacity: Amkor Interposer 4x, Substrates 2.5x, $1.1B KYEC Prepay
Interposer wafer capacity: >+300% by end-2028 (Amkor); package substrate capacity: +150% (2.5x) over three years; optical-engine capacity: 15x by mid-2027 then 2x more by end-2028 (SPIL); Nvidia commitments: $3B Amkor (AZ + S. Korea), $1.1B KYEC advance
NVIDIA Locks In 2.5x Substrate and 4x Interposer Capacity With Six Suppliers
Package substrate capacity: +150% (2.5x) over three years; interposer wafer capacity: +300%+ by end-2028; CPO optical engine capacity: 15x by mid-2027, 2x again by end-2028; test capacity: 2x from 2026 to 2027; Samsung Electro-Mechanics FC-BGA supply to NVIDIA growing at double-digit annual rates from 2026
Samsung to Use TSMC 3nm for Base Dies of Nvidia Custom HBM
N/A (no unit pricing disclosed); TSMC 2026 CapEx maintained at $60–64B, new Tainan 3nm fab production 1H 2028, Arizona Fab 2 mass production Q3 2027
Recent corrections
Full changelog →Methodology
Every day we freeze the canonical semiconductor cost/pricing data into an append-only ledger. This page compares the most recent snapshot against the closest one ~7 days earlier and surfaces the metrics that moved past a per-dataset significance threshold (filtering out rounding noise).
Each movement shows direction, magnitude (percent for value metrics, percentage-points for rate metrics), the two dates compared, and a confidence tier. The trend column sketches each metric's full ledger history (up to ~90 days). The history is young — the ledger began 2026-06-06, and some domains are tracked from later dates — so a 30-day window automatically clamps to the data available and labels the real lookback, and per-row trends can start on different dates. Underlying values are synthesized from public sources only.
Programmatic access: /api/v1/changes and the get_recent_changes MCP tool. For data provenance and terms, see Terms & Data Provenance.
See current wafer pricing →
300mm wafer prices by node and foundry, with per-row provenance and price ranges.