What Changed — Semiconductor Data Movements
Recent movements in semiconductor wafer pricing, AI accelerator manufacturing cost, foundry gross margins, foundry capacity, and NRE/mask-set cost, derived daily from an append-only data ledger. Each movement shows direction, magnitude, the two dates compared, and a confidence tier. Public sources only — no proprietary or insider data.
What Changed in Semiconductor Data
Recent movements across wafer pricing, AI accelerator cost, foundry margins, capacity, and NRE — tracked daily from our public-data ledger, every figure with provenance.
Comparing Jul 18, 2026 vs Jul 11, 2026 (7 days of history) ·
GPU cloud rental pricing1
| Metric | Change | Move |
|---|---|---|
| RUNPOD H200 on-demand $/GPU-hr | $3.99/GPU-hr → $2.60/GPU-hr | ▼ -34.8% |
Fab capacity & utilization1
| Metric | Change | Move |
|---|---|---|
| TSMC N3E/N3P/N3B utilization | 100% → 99% | ▼ -1pp |
Foundry capacity1
| Metric | Change | Move |
|---|---|---|
| TSMC N3 annual wafer starts | 1,890,000 wafers_per_year → 2,160,000 wafers_per_year | ▲ +14.3% |
Gross margins2
| Metric | Change | Move |
|---|---|---|
| MAINSTREAM CPU gross margin | 55% → 41% | ▼ -14pp |
| MOBILE SOC gross margin | 54.8% → 53.77% | ▼ -1pp |
Download the full historical ledger (Pro)
Every figure here is a dated, append-only series. Get the complete history as CSV/JSONL for backtesting and models — join the list and we'll reach out.
Market intelligence behind the moves
All market intelligence →TSMC $265B US CapEx Commitment + ASML 30% EUV Capacity Surge Signal Multi-Year AI Supply Expansion — with Equipment Price Hike Risk
TSMC CapEx: +$100B incremental US commitment (total $265B), 2026 CapEx at high end of $52–56B range; ASML EUV/DUV capacity: +30% per year for 2 years; ASML 2026 revenue guidance raised ~15–19% vs prior midpoint (€38B → €44B midpoint); ASML EUV price hike quantum not yet disclosed — wafer/packaging cost pass-through risk flagged but unquantified.
SK Hynix CEO Flags 2027 as Worst-Ever HBM Supply Crunch; $26.5B IPO Capital Earmarked for Capacity Expansion
Capacity expansion funded: $26.5B raised (new fab + packaging facility + EUV scanners); Supply gap: demand forecasted to exceed supply through 2030+; No specific yield or price-per-unit figure disclosed.
HBM Supply Shortage Persists as SK Hynix Commands 56.4% Market Share; Micron Commits $250B to Domestic DRAM Expansion
HBM shortage: supply constrained with SK Hynix holding 56.4% market share per SEC filing; Micron US DRAM capacity target: 40% of total output domestically by 2035; Micron data center segment gross margin reached 87% on $11.5B revenue (up 103% QoQ), signaling sustained premium pricing on memory inputs to AI hardware.
SK Hynix Commits $706B to HBM/DRAM Scale-Up as ISM Flags Memory Components in Active Short Supply
Capacity: P&T7 packaging facility targeted for end-2027; M17 NAND fab operations targeted H1 2029; SK Group aggregate HBM/DRAM CapEx: ~$706B committed. Supply tightness signal: ISM June 2026 survey flags memory in active short supply (no precise % figure cited). Bernstein projects SK Hynix DRAM gross margins peaking at ~92.7% in Q4 2026, implying sustained elevated HBM ASPs through at least 2028.
Recent corrections
Full changelog →Methodology
Every day we freeze the canonical semiconductor cost/pricing data into an append-only ledger. This page compares the most recent snapshot against the closest one ~7 days earlier and surfaces the metrics that moved past a per-dataset significance threshold (filtering out rounding noise).
Each movement shows direction, magnitude (percent for value metrics, percentage-points for rate metrics), the two dates compared, and a confidence tier. The trend column sketches each metric's full ledger history (up to ~90 days). The history is young — the ledger began 2026-06-06, and some domains are tracked from later dates — so a 30-day window automatically clamps to the data available and labels the real lookback, and per-row trends can start on different dates. Underlying values are synthesized from public sources only.
Programmatic access: /api/v1/changes and the get_recent_changes MCP tool. For data provenance and terms, see Terms & Data Provenance.
See current wafer pricing →
300mm wafer prices by node and foundry, with per-row provenance and price ranges.