What Changed — Semiconductor Data Movements
Recent movements in semiconductor wafer pricing, AI accelerator manufacturing cost, foundry gross margins, foundry capacity, and NRE/mask-set cost, derived daily from an append-only data ledger. Each movement shows direction, magnitude, the two dates compared, and a confidence tier. Public sources only — no proprietary or insider data.
What Changed in Semiconductor Data
Recent movements across wafer pricing, AI accelerator cost, foundry margins, capacity, and NRE — tracked daily from our public-data ledger, every figure with provenance.
Comparing Jul 31, 2026 vs Jul 24, 2026 (7 days of history) ·
Memory spot pricing3
View dataset →| Metric | Change | Move |
|---|---|---|
| DDR4 8GB SPOT spot $/unit | $37.34/chip → $42.14/chip | ▲ +12.9% |
| DDR4 8GB SPOT spot $/unit (consensus low) | $37.34/chip → $42.14/chip | ▲ +12.9% |
| DDR4 8GB SPOT spot $/unit (consensus high) | $37.34/chip → $42.14/chip | ▲ +12.9% |
HBM market share3
View dataset →| Metric | Change | Move |
|---|---|---|
| Samsung HBM4 hybrid-bonding yield | 10% → 65% | ▲ +55pp |
| Samsung HBM bit share | 35% → 29% | ▼ -6pp |
| SK Hynix HBM bit share | 52.5% → 56% | ▲ +3.5pp |
Fab capacity & utilization1
View dataset →| Metric | Change | Move |
|---|---|---|
| TSMC N3E/N3P/N3B utilization | 100% → 98% | ▼ -2pp |
Foundry IR economics2
| Metric | Change | Move |
|---|---|---|
| TSMC N7 2026Q2 node revenue share | 44% → 11% | ▼ -33pp |
| TSMC ALL 2025FY wafer ASP (blended) | $8,000 → $8,250 | ▲ +3.1% |
Gross margins1
| Metric | Change | Move |
|---|---|---|
| MAINSTREAM CPU gross margin | 44.575% → 53% | ▲ +8.4pp |
Download the full historical ledger (Pro)
Every figure here is a dated, append-only series. Get the complete history as CSV/JSONL for backtesting and models — join the list and we'll reach out.
Market intelligence behind the moves
All market intelligence →Nvidia–SK Hynix Multi-Year HBM Supply Partnership Confirmed at Up to $500B
Supply commitment: up to $500B multi-year; Capacity: SK Hynix HBM allocation heavily directed toward Nvidia; Lead time risk for non-Nvidia HBM buyers: elevated (magnitude unquantified in sources).
Nvidia-SK Hynix & Samsung-Broadcom Lock In $950B HBM Supply Agreements, Securing Next-Gen Memory Pipeline Through 2030
SK Hynix: $750B long-term HBM supply commitment to U.S. customers (led by Nvidia); Samsung: $200B memory + foundry + packaging commitment to Broadcom through 2030; SK Telecom 2GW AI data center powered by HBM4 targeting 2027 online date; TSMC CoWoS and advanced packaging capacity described as largely booked through 2027.
SK Hynix Commits $5.8B to Advanced HBM Packaging Facility; TSMC Confirms 2027 Wafer Price Hikes Up to 10%
SK Hynix packaging CapEx: +$5.8B committed; TSMC mature-node wafer price hike: up to +10% effective 2027; advanced-node pricing direction unquantified but directionally upward per Barchart/TSMC guidance.
China Eyes Export Controls on AI Chips & Models; AMD Helios Rack Enters Market with Azure Deal
Geopolitical: Potential restriction on TSMC fab access for Chinese-designed advanced chips (scope/timing unquantified); AMD Helios: Azure H2 2026 deployment commitment (unit volume undisclosed).
Recent corrections
Full changelog →Methodology
Every day we freeze the canonical semiconductor cost/pricing data into an append-only ledger. This page compares the most recent snapshot against the closest one ~7 days earlier and surfaces the metrics that moved past a per-dataset significance threshold (filtering out rounding noise).
Each movement shows direction, magnitude (percent for value metrics, percentage-points for rate metrics), the two dates compared, and a confidence tier. The trend column sketches each metric's full ledger history (up to ~90 days). The history is young — the ledger began 2026-06-06, and some domains are tracked from later dates — so a 30-day window automatically clamps to the data available and labels the real lookback, and per-row trends can start on different dates. Underlying values are synthesized from public sources only.
Programmatic access: /api/v1/changes and the get_recent_changes MCP tool. For data provenance and terms, see Terms & Data Provenance.
See current wafer pricing →
300mm wafer prices by node and foundry, with per-row provenance and price ranges.