What Changed — Semiconductor Data Movements
Recent movements in semiconductor wafer pricing, AI accelerator manufacturing cost, foundry gross margins, foundry capacity, and NRE/mask-set cost, derived daily from an append-only data ledger. Each movement shows direction, magnitude, the two dates compared, and a confidence tier. Public sources only — no proprietary or insider data.
What Changed in Semiconductor Data
Recent movements across wafer pricing, AI accelerator cost, foundry margins, capacity, and NRE — tracked daily from our public-data ledger, every figure with provenance.
Comparing Jul 9, 2026 vs Jul 2, 2026 (7 days of history) ·
Fab capacity & utilization2
| Metric | Change | Move |
|---|---|---|
| TSMC N7/N6 utilization | 70% → 65% | ▼ -5pp |
| TSMC N3E/N3P/N3B utilization | 99% → 100% | ▲ +1pp |
Gross margins2
| Metric | Change | Move |
|---|---|---|
| MAINSTREAM CPU gross margin | 53% → 55% | ▲ +2pp |
| MOBILE SOC gross margin | 53.75% → 54.8% | ▲ +1pp |
Market intelligence behind the moves
All market intelligence →SK Hynix Commits $706B to HBM/DRAM Scale-Up as ISM Flags Memory Components in Active Short Supply
Capacity: P&T7 packaging facility targeted for end-2027; M17 NAND fab operations targeted H1 2029; SK Group aggregate HBM/DRAM CapEx: ~$706B committed. Supply tightness signal: ISM June 2026 survey flags memory in active short supply (no precise % figure cited). Bernstein projects SK Hynix DRAM gross margins peaking at ~92.7% in Q4 2026, implying sustained elevated HBM ASPs through at least 2028.
Samsung & SK Hynix Commit $518B South Korea Fab Buildout, Signaling Multi-Year HBM Supply Expansion
Capacity: Combined ~$518B CapEx across Samsung + SK Hynix new fabs; +81 trillion won (~$52B) dedicated advanced packaging cluster in Chungcheong; Samsung Electro-Mechanics 15 trillion won (~$9.7B) for AI server package substrates. Timeline: multi-year buildout, no near-term capacity relief quantified.
ASE Advanced Packaging Quotes Surge 20%+ Amid AI-Driven Demand Crunch
Est. packaging BOM increase: +20% or greater on advanced packaging line items; direct upward pressure on CoWoS-tier and SiP packaging costs for AI accelerator builds including H200/B100-class systems.
ASE Advanced Packaging Quotes Surge 20%+ as WF₆ Supply Shock Threatens Process Materials
Packaging cost impact: +20%+ on ASE advanced packaging quotes; WF₆ supply reduction: -25% of global high-end capacity (2,200 tons removed from 8,000–9,000 ton annual market)
Recent corrections
Full changelog →Methodology
Every day we freeze the canonical semiconductor cost/pricing data into an append-only ledger. This page compares the most recent snapshot against the closest one ~7 days earlier and surfaces the metrics that moved past a per-dataset significance threshold (filtering out rounding noise).
Each movement shows direction, magnitude (percent for value metrics, percentage-points for rate metrics), the two dates compared, and a confidence tier. The trend column sketches each metric's full ledger history (up to ~90 days). The history is young — the ledger began 2026-06-06, and some domains are tracked from later dates — so a 30-day window automatically clamps to the data available and labels the real lookback, and per-row trends can start on different dates. Underlying values are synthesized from public sources only.
Programmatic access: /api/v1/changes and the get_recent_changes MCP tool. For data provenance and terms, see Terms & Data Provenance.
See current wafer pricing →
300mm wafer prices by node and foundry, with per-row provenance and price ranges.