Fab Explorer (2026) — Semiconductor Fabrication Facility Map & Supply Chain Simulator
As of February 2026, explore 64 semiconductor fabrication facilities across 10 countries from 16 companies including TSMC, Samsung, Intel, SMIC, Rapidus, GlobalFoundries, UMC, Tower, PSMC, Hua Hong, Nexchip, VIS, ASE, Amkor, JCET, SPIL. Filter by technology node, country, capacity, and ownership. View 42 operational fabs,12 under construction, and 2 announced. Simulate product supply chains for Nvidia H100, Nvidia B100, Nvidia B200, Nvidia GB200, AMD MI300X, AMD MI325X, Intel Gaudi 3 and other AI accelerators with bottleneck identification across wafer fabrication and advanced packaging.
Loading Fab Explorer…
Semiconductor Fab FAQ
- Where are the major semiconductor fabs located worldwide?
- Silicon Analysts tracks 64 fabrication facilities across 10 countries. Leading-edge fabs are concentrated in Taiwan (TSMC in Hsinchu, Tainan, Kaohsiung), South Korea (Samsung in Pyeongtaek, Hwaseong), the United States (Intel in Arizona; TSMC Arizona; Samsung Taylor TX; GlobalFoundries in Malta NY), Japan (Rapidus Hokkaido, TSMC Kumamoto), and Europe (Intel Ireland, TSMC Dresden, GlobalFoundries Dresden). China (SMIC, Hua Hong, Nexchip) and Singapore (GlobalFoundries, UMC) also host significant mature-node capacity.
- How many semiconductor fabs does TSMC operate?
- Our database tracks 23 TSMC facilities, including frontend wafer fabs and advanced backend packaging plants. TSMC operates primarily in Taiwan (Hsinchu, Taichung, Tainan, Kaohsiung), with expanding operations in Arizona (USA), Kumamoto (Japan), and Dresden (Germany). These fabs span process nodes from mature (28nm/40nm) to cutting-edge (2nm/A16), with the most advanced nodes concentrated in Taiwan.
- What is the CHIPS Act and how does it affect fab locations?
- The U.S. CHIPS Act provides $52 billion in subsidies to incentivize domestic semiconductor manufacturing. In our database, 9 fabs have received CHIPS Act funding, including facilities from TSMC, Samsung, Intel, GlobalFoundries, and Amkor. Similar programs in the EU (€43B), Japan, and India are reshaping global fab distribution to reduce supply chain concentration in East Asia.
- How much does it cost to manufacture an NVIDIA B200?
- Based on our supply chain model, the estimated COGS for the NVIDIA B200 is approximately $5,785, broken down into silicon die costs, $2,900 HBM3e memory, $1,100 CoWoS-L packaging, and $400 other BOM. At a market price of $40,000, this represents approximately 86% gross margin. Explore detailed cost breakdowns in the AI Supply Chain Scenario Simulator.
- What is the CoWoS packaging bottleneck?
- Advanced packaging (CoWoS) is the primary bottleneck for AI chip production. TSMC's CoWoS capacity across AP3, AP5, and AP6 facilities is rapidly expanding but still constrained relative to demand from NVIDIA, AMD, and hyperscaler ASICs. Our Allocation Studio lets you model supply/demand gaps with yield stress and demand surge scenarios.
- Where is TSMC building new fabs?
- TSMC is actively expanding beyond Taiwan. Key construction projects include: Fab 21 Phase 2-3 in Phoenix, Arizona (3nm and 2nm); JASM Phase 2 in Kumamoto, Japan (6nm/7nm); ESMC in Dresden, Germany (22nm/28nm); and new advanced-node capacity in Kaohsiung and Hsinchu, Taiwan (2nm/A16). These expansions are supported by government subsidies including the US CHIPS Act, Japanese Government grants, and EU Chips Act funding.
Semiconductor Fab Database — 64 Facilities
53 frontend wafer fabs and 11 backend packaging facilities from 16 companies across 10 countries. Data as of February 2026.
Frontend Wafer Fabs
| Company | Fab Name | Location | Country | Status | Tech Nodes | HVM Start | Cap. 2025 (kWSPM) | Cap. 2026 (kWSPM) | Subsidy |
|---|---|---|---|---|---|---|---|---|---|
| GlobalFoundries | Fab 1 (Dresden) | Dresden, Saxony | Germany | In Production | 22nm, 28nm, 40nm | 2005 | 45 | 50 | EU Chips Act (600M EUR) |
| GlobalFoundries | Fab 7 (Burlington) | Burlington, Vermont | USA | In Production | 90nm, 130nm, 180nm | 2002 | 20 | 20 | — |
| GlobalFoundries | Fab 8 (Malta) | Malta, New York | USA | In Production | 12nm, 14nm, 22nm | 2012 | 65 | 70 | US CHIPS Act (1.587B USD + 575M NY credits) |
| GlobalFoundries | Singapore (Woodlands) | Woodlands, Singapore | Singapore | In Production | 22nm, 40nm, 130nm | 2010 | 55 | 60 | — |
| Hua Hong | Shanghai Fab | Shanghai, Shanghai | China | In Production | 55nm, 90nm, 130nm | 2005 | 30 | 30 | — |
| Hua Hong | Wuxi Fab | Wuxi, Jiangsu | China | In Production | 40nm, 55nm, 90nm | 2019 | 45 | 50 | — |
| Intel | Fab 11X | Kiryat Gat, Southern | Israel | Announced | Intel 18A | 2028 | — | — | Israeli Government (3.2B USD) |
| Intel | Fab 28 | Kiryat Gat, Southern | Israel | In Production | Intel 7 | 2019 | 35 | 35 | — |
| Intel | Fab 34 | Leixlip, Kildare | Ireland | In Production | Intel 4, Intel 3 | 2023 | 40 | 40 | — |
| Intel | Fab 42 | Chandler, Arizona | USA | Under Construction | Intel 20A, 18A | 2025 | 10 | 25 | US CHIPS Act (11.1B USD (incl. 8.9B equity)) |
| Intel | Fab 52 & 62 | Chandler, Arizona | USA | Ramping | Intel 18A | 2024 | 15 | 30 | US CHIPS Act (11.1B USD (incl. 8.9B equity)) |
| Intel | Ohio One | New Albany, Ohio | USA | Under Construction | Intel 18A | 2028 | — | — | US CHIPS Act (part of 11.1B USD) |
| Nexchip | Hefei Fab | Hefei, Anhui | China | In Production | 28nm, 40nm, 55nm | 2020 | 35 | 40 | — |
| PSMC | Hsinchu Fab | Hsinchu, Taiwan | Taiwan | In Production | 28nm, 40nm, 55nm | 2010 | 35 | 35 | — |
| PSMC | Tongluo Fab | Tongluo, Miaoli | Taiwan | In Production | 28nm, 40nm | 2016 | 25 | 25 | — |
| Rapidus | IIM-1 | Chitose, Hokkaido | Japan | Under Construction | 2nm | 2027 | — | — | Japanese Government (590B Yen) |
| Samsung | Hwaseong S1 | Hwaseong, Gyeonggi | South Korea | In Production | 14nm, 10nm | 2005 | 35 | 35 | — |
| Samsung | Hwaseong S2 | Hwaseong, Gyeonggi | South Korea | In Production | 14nm, 10nm, 7nm | 2015 | 40 | 40 | — |
| Samsung | Hwaseong S3 | Hwaseong, Gyeonggi | South Korea | In Production | 2nm, 5nm, 7nm | 2018 | 50 | 50 | — |
| Samsung | Pyeongtaek P1 | Pyeongtaek, Gyeonggi | South Korea | In Production | 7nm, 5nm | 2017 | 40 | 40 | — |
| Samsung | Pyeongtaek P2 | Pyeongtaek, Gyeonggi | South Korea | Ramping | 5nm, 4nm | 2020 | 45 | 45 | — |
| Samsung | Pyeongtaek P3 | Pyeongtaek, Gyeonggi | South Korea | Ramping | 4nm, 3nm | 2022 | 40 | 50 | — |
| Samsung | Pyeongtaek P4 | Pyeongtaek, Gyeonggi | South Korea | Announced | 2nm, 3nm | 2027 | — | — | — |
| Samsung | Taylor Fab 1 | Taylor, Texas | USA | Under Construction | 2nm | 2026 | — | 5 | US CHIPS Act (4.745B USD + 250M TX) |
| SMIC | Beijing Fab | Beijing, Beijing | China | In Production | 28nm, 40nm, 55nm | 2014 | 50 | 50 | — |
| SMIC | Shanghai SN3 | Shanghai, Shanghai | China | Under Construction | 14nm, 28nm | 2026 | 10 | 30 | — |
| SMIC | Shenzhen Fab | Shenzhen, Guangdong | China | In Production | 28nm, 40nm | 2017 | 30 | 30 | — |
| SMIC | SN1/SN2 | Shanghai, Shanghai | China | In Production | 7nm | 2021 | 20 | 25 | — |
| Tower | Migdal HaEmek | Migdal HaEmek, Northern | Israel | In Production | 65nm, 130nm, 180nm | 2001 | 20 | 20 | — |
| Tower | San Antonio | San Antonio, Texas | USA | In Production | 65nm, 130nm, 180nm | 2007 | 15 | 15 | — |
| TSMC | ESMC (Dresden) | Dresden, Saxony | Germany | Under Construction | 12nm, 16nm, 22nm, 28nm | 2027 | — | — | EU Chips Act (5B EUR) |
| TSMC | Fab 12 | Hsinchu, Taiwan | Taiwan | In Production | 7nm, 5nm | 2018 | 100 | 100 | — |
| TSMC | Fab 14 | Tainan, Taiwan | Taiwan | In Production | 7nm, 5nm | 2014 | 120 | 120 | — |
| TSMC | Fab 15 | Taichung, Taiwan | Taiwan | In Production | 7nm, 5nm, 3nm | 2012 | 130 | 130 | — |
| TSMC | Fab 16 (Nanjing) | Nanjing, Jiangsu | China | In Production | 16nm, 28nm | 2018 | 20 | 20 | — |
| TSMC | Fab 18 (P1-3) | Tainan, Taiwan | Taiwan | In Production | 5nm, N4, 4NP | 2020 | 120 | 120 | — |
| TSMC | Fab 18 (P4-8) | Tainan, Taiwan | Taiwan | Ramping | 3nm, N3B, N3E | 2022 | 130 | 150 | — |
| TSMC | Fab 2 | Hsinchu, Taiwan | Taiwan | In Production | 28nm, 40nm, 65nm | 1999 | 40 | 40 | — |
| TSMC | Fab 20 | Hsinchu, Taiwan | Taiwan | Ramping | 2nm, A16 | 2025 | 30 | 65 | — |
| TSMC | Fab 21 (P1) | Phoenix, Arizona | USA | Ramping | 4nm, N5 | 2024 | 20 | 20 | US CHIPS Act (6.6B USD) |
| TSMC | Fab 21 (P2) | Phoenix, Arizona | USA | Under Construction | 3nm | 2027 | — | — | US CHIPS Act (6.6B USD grants + 5B USD loans) |
| TSMC | Fab 21 (P3) | Phoenix, Arizona | USA | Under Construction | 2nm, A16 | 2029 | — | — | US CHIPS Act (6.6B USD grants + 5B USD loans) |
| TSMC | Fab 22 | Kaohsiung, Taiwan | Taiwan | Ramping | 2nm, A16 | 2025 | 20 | 60 | — |
| TSMC | Fab 3 | Hsinchu, Taiwan | Taiwan | In Production | 28nm, 40nm | 2003 | 35 | 35 | — |
| TSMC | Fab 5 | Hsinchu, Taiwan | Taiwan | In Production | 28nm, 40nm | 2005 | 30 | 30 | — |
| TSMC | Fab 6 | Tainan, Taiwan | Taiwan | In Production | 28nm, 40nm, 65nm | 2004 | 45 | 45 | — |
| TSMC | Fab 8 | Hsinchu, Taiwan | Taiwan | In Production | 16nm, 12nm | 2009 | 60 | 60 | — |
| TSMC | JASM (P1) | Kumamoto, Kyushu | Japan | In Production | 12nm, 16nm, 22nm, 28nm, 40nm | 2024 | 40 | 55 | Japanese Government (476B Yen) |
| TSMC | JASM (P2) | Kumamoto, Kyushu | Japan | Under Construction | 3nm, 6nm | 2027 | — | — | Japanese Government (732B Yen) |
| TSMC | Kaohsiung (Mature) | Kaohsiung, Taiwan | Taiwan | Under Construction | 28nm, 7nm | 2025 | 15 | 40 | — |
| UMC | Fab 12A | Hsinchu, Taiwan | Taiwan | In Production | 14nm, 22nm, 28nm | 2009 | 50 | 50 | — |
| UMC | Fab 12i | Singapore, Singapore | Singapore | In Production | 22nm, 28nm | 2015 | 30 | 35 | — |
| VIS | Hsinchu Fab | Hsinchu, Taiwan | Taiwan | In Production | 28nm, 40nm, 90nm | 2000 | 30 | 30 | — |
Backend & Advanced Packaging Facilities
| Company | Facility | Location | Country | Status | Packaging Tech | HVM Start | Cap. 2025 (k units) | Cap. 2026 (k units) |
|---|---|---|---|---|---|---|---|---|
| Amkor | Incheon Fab | Incheon, Gyeonggi | South Korea | In Production | 2.5D, FcBGA, SiP | 2015 | 18 | 22 |
| Amkor | Peoria Fab | Peoria, Arizona | USA | Under Construction | 2.5D, FcBGA, SiP | 2025 | 5 | 15 |
| ASE | Kaohsiung (K12/K21) | Kaohsiung, Taiwan | Taiwan | In Production | CoWoS-S, FcBGA, FoCoS | 2010 | 25 | 35 |
| Intel | Fab 9 (Rio Rancho) | Rio Rancho, New Mexico | USA | Ramping | Foveros, EMIB | 2024 | 15 | 30 |
| Intel | PGAT (Penang) | Penang, Penang | Malaysia | Under Construction | Foveros, EMIB | 2025 | 10 | 25 |
| JCET | Wuxi Fab | Wuxi, Jiangsu | China | In Production | FcBGA, FoWLP, SiP | 2012 | 22 | 25 |
| Samsung | Cheonan Campus | Cheonan, Chungnam | South Korea | In Production | I-Cube, X-Cube | 2020 | 45 | 60 |
| SPIL | Taichung Fab | Taichung, Taiwan | Taiwan | In Production | 2.5D, FcBGA, InFO | 2008 | 20 | 24 |
| TSMC | AP3 | Longtan, Taiwan | Taiwan | In Production | CoWoS-S, InFO | 2014 | 10 | 15 |
| TSMC | AP5 | Taichung, Taiwan | Taiwan | In Production | CoWoS-S, InFO | 2018 | 15 | 25 |
| TSMC | AP6 (Adv. Backend) | Zhunan, Taiwan | Taiwan | In Production | CoWoS-S, CoWoS-L, SoIC | 2023 | 35 | 60 |
AI Accelerator Supply Chain Profiles
Estimated cost structures for leading AI accelerators modeled in the supply chain simulator.
| Chip | Process Node | Die Size (mm²) | Die Count | Wafer Cost | Packaging | HBM Cost | Est. COGS | Market Price | Est. Margin |
|---|---|---|---|---|---|---|---|---|---|
| Nvidia H100 | N4 | 814 | 1 | $16,000 | CoWoS-S | $1,350 | $2,943 | $28,000 | 89% |
| Nvidia B100 | 4NP | 800 | 2 | $18,000 | CoWoS-L | $2,900 | $5,683 | $32,000 | 82% |
| Nvidia B200 | 4NP | 820 | 2 | $18,000 | CoWoS-L | $2,900 | $5,785 | $40,000 | 86% |
| Nvidia GB200 | 4NP | 820 | 2 | $18,000 | CoWoS-L | $5,800 | $10,185 | $65,000 | 84% |
| AMD MI300X | N5 | 115 | 8 | $15,000 | SoIC + CoWoS | $2,900 | $4,649 | $15,000 | 69% |
| AMD MI325X | N5 | 115 | 8 | $15,000 | SoIC + CoWoS | $2,200 | $3,299 | $20,000 | 84% |
| Intel Gaudi 3 | TSMC 5nm | 500 | 1 | $15,000 | OAM | $1,950 | $3,784 | $15,625 | 76% |