Fab Explorer - Semiconductor Fabrication Facility Map & Supply Chain Simulator
Explore global semiconductor fabrication facilities by company, technology node, and manufacturing capacity. Filter by TSMC, Samsung, Intel, and GlobalFoundries. View operational, under construction, and planned fabs. Simulate product supply chains for Nvidia B200, AMD MI300X, Intel Gaudi, and other AI accelerators with real-time bottleneck identification across wafer fabrication and advanced packaging.
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Fab Explorer
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Modeling Nvidia B200 supply chain.
Global Semiconductor Fabrication Landscape
The global semiconductor fab landscape is concentrated among a handful of companies and geographies. Understanding where chips are manufactured—and the capacity constraints at each location—is critical for supply chain risk assessment, procurement planning, and geopolitical analysis. This tool maps 100+ semiconductor fab locations with filterable data on process nodes, capacity, and ownership.
Key Players and Geographic Footprints
TSMC dominates leading-edge production with major fabs in Hsinchu, Tainan, and Kaohsiung (Taiwan), plus expanding operations in Arizona and Kumamoto (Japan). Samsung operates advanced fabs in Pyeongtaek (South Korea) and Taylor (Texas). Intel's foundry fabs span Oregon, Arizona, Ireland, and Israel. SMIC in China focuses on mature and mid-range nodes, while Rapidus in Japan is targeting 2nm production. Together, these companies represent the vast majority of global chip manufacturing capacity.
Location, Cost, and Supply Chain Risk
Fab location directly affects manufacturing cost through labor rates, utility prices, government subsidies, and logistics. It also determines supply chain resilience—the concentration of leading-edge capacity in Taiwan has driven diversification efforts worldwide. Natural disasters, geopolitical tensions, and water scarcity can disrupt production at any single site, making geographic diversification a priority for chip buyers.
Government Incentives Reshaping the Map
The U.S. CHIPS Act ($52B), EU Chips Act (€43B), Japan's semiconductor subsidies, and India's incentive programs are fundamentally reshaping foundry capacity distribution. New fabs in Arizona, Ohio, Dresden, and Kumamoto will add significant capacity over 2025–2028, though ramp timelines and cost structures remain uncertain. This explorer tracks both operational and under-construction facilities.
Related: Chip Price Calculator · Price/Performance Frontier · Analysis Articles
Semiconductor Fab FAQ
- Where are the major semiconductor fabs located worldwide?
- Leading-edge semiconductor fabs are concentrated in Taiwan (TSMC in Hsinchu, Tainan, Kaohsiung), South Korea (Samsung in Pyeongtaek), the United States (Intel in Oregon, Arizona; TSMC Arizona; Samsung Taylor TX), and Japan (Rapidus Hokkaido, TSMC Kumamoto). China (SMIC), Europe (Intel Ireland, TSMC Dresden), and Israel also host significant capacity.
- How many semiconductor fabs does TSMC operate?
- TSMC operates 20+ fabrication facilities, primarily in Taiwan (Hsinchu, Taichung, Tainan, Kaohsiung), with expanding operations in Arizona (USA), Kumamoto (Japan), and Dresden (Germany). These fabs span process nodes from 180nm to 2nm, with the most advanced N3 and upcoming A16 nodes concentrated in Taiwan.
- What is the CHIPS Act and how does it affect fab locations?
- The U.S. CHIPS Act provides $52 billion in subsidies to incentivize domestic semiconductor manufacturing. It has driven TSMC, Samsung, and Intel to build new fabs in Arizona, Texas, and Ohio. Similar programs in the EU (€43B), Japan, and India are reshaping global fab distribution to reduce supply chain concentration in East Asia.