HBM Market Share by Vendor — Historical Time Series Data
HBM market share split between SK Hynix, Samsung, and Micron, annually from 2023 through 2026E. Tracks SK Hynix dominance eroding as Samsung and Micron ramp HBM3E.
HBM Market Share by Vendor
HBM market share split between SK Hynix, Samsung, and Micron, annually from 2023 through 2026E. Tracks SK Hynix dominance eroding as Samsung and Micron ramp HBM3E.
Data Table
| Period | Series | Value |
|---|---|---|
2023 | SK Hynix | 90% |
2023 | Samsung | 8% |
2023 | Micron | 2% |
2024 | SK Hynix | 58% |
2024 | Samsung | 25% |
2024 | Micron | 17% |
2025 | SK Hynix | 53% |
2025 | Samsung | 28% |
2025 | Micron | 19% |
2026EP | SK Hynix | 50% |
2026EP | Samsung | 30% |
2026EP | Micron | 20% |
Methodology & Sources
Sources: The Register (May 2024), TrendForce, Deep Research (99 sources). 2023 SK Hynix near-monopoly driven by sole H100 supplier status.
Citations:
- The Register (May 2024)
- Deep Research (99 sources) (Mar 2026)
- TrendForce / Goldman Sachs (Mar 2026)
- TrendForce (Nov 2025)
Related Tools
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Market intelligence on this data
All market intelligence →SK Hynix Commits $5.8B to Advanced HBM Packaging Facility; TSMC Confirms 2027 Wafer Price Hikes Up to 10%
SK Hynix packaging CapEx: +$5.8B committed; TSMC mature-node wafer price hike: up to +10% effective 2027; advanced-node pricing direction unquantified but directionally upward per Barchart/TSMC guidance.
TSMC Commits $100B+ Arizona Expansion, Accelerates 3nm Conversion to Meet AI Chip Surge
Capacity: TSMC U.S. CapEx raised by +$100B incremental; total U.S. commitment reaches ~$265B per Odaily/Reuters; annual CapEx guidance lifted to $60–64B. 5nm-to-3nm fab conversion timeline accelerated (no specific % capacity figure disclosed publicly).
TSMC $265B US CapEx Commitment + ASML 30% EUV Capacity Surge Signal Multi-Year AI Supply Expansion — with Equipment Price Hike Risk
TSMC CapEx: +$100B incremental US commitment (total $265B), 2026 CapEx at high end of $52–56B range; ASML EUV/DUV capacity: +30% per year for 2 years; ASML 2026 revenue guidance raised ~15–19% vs prior midpoint (€38B → €44B midpoint); ASML EUV price hike quantum not yet disclosed — wafer/packaging cost pass-through risk flagged but unquantified.
SK Hynix CEO Flags 2027 as Worst-Ever HBM Supply Crunch; $26.5B IPO Capital Earmarked for Capacity Expansion
Capacity expansion funded: $26.5B raised (new fab + packaging facility + EUV scanners); Supply gap: demand forecasted to exceed supply through 2030+; No specific yield or price-per-unit figure disclosed.
Frequently Asked Questions
- Why is SK Hynix losing HBM market share?
- SK Hynix’s share has declined from 90% in 2023 to roughly 53% in 2025 as Samsung and Micron successfully qualified HBM3E for NVIDIA and AMD platforms. Samsung has been aggressive on pricing (30% below SK Hynix) to win H20 and B200 supply slots.
- Will Micron become a major HBM supplier?
- Micron has grown from 2% HBM market share in 2023 to approximately 19% in 2025, and is projected to reach 20% by 2026. Micron’s HBM3E is qualified for the H200 and the company is pursuing B200 qualification.