AI Accelerator Manufacturing Cost Estimates (2026)
As of April 2026, manufacturing costs for leading AI accelerators range from ~$3,320 for the NVIDIA H100 to ~$13,000+ for the GB200 superchip. HBM memory and advanced packaging now account for 60-70% of total BOM cost.
Last updated: · Data sources: Epoch AI, Raymond James, TrendForce, SemiAnalysis · JSON API ·
Manufacturing Cost Comparison
Estimated bill-of-materials (BOM) manufacturing costs for 8 leading AI accelerators. All figures are per-unit estimates excluding non-recurring engineering (NRE) costs.
| Chip | Vendor | Process | Die Size | Logic Cost | HBM Cost | Packaging | Total Mfg Cost | Sell Price | Margin |
|---|---|---|---|---|---|---|---|---|---|
| H100 SXM5 | NVIDIA | TSMC 4N | 814mm² | $300Wafer + yield cost for H100 SXM5 logic die | $1,350HBM memory stack cost for H100 SXM5 | $750CoWoS / advanced packaging cost for H100 SXM5 | $3,320Total BOM manufacturing cost for H100 SXM5 | $28,000Average selling price for H100 SXM5 | 88%Gross margin: (sell price - mfg cost) / sell price |
| H200 SXM5 | NVIDIA | TSMC 4N | 814mm² | $300Wafer + yield cost for H200 SXM5 logic die | $1,500HBM memory stack cost for H200 SXM5 | $750CoWoS / advanced packaging cost for H200 SXM5 | $4,250Total BOM manufacturing cost for H200 SXM5 | $38,000Average selling price for H200 SXM5 | 89%Gross margin: (sell price - mfg cost) / sell price |
| B200 | NVIDIA | TSMC 4NP | 2×800mm² | $850Wafer + yield cost for B200 logic die | $2,900HBM memory stack cost for B200 | $1,100CoWoS / advanced packaging cost for B200 | $6,400Total BOM manufacturing cost for B200 | $40,000Average selling price for B200 | 84%Gross margin: (sell price - mfg cost) / sell price |
| GB200 | NVIDIA | TSMC 4NP | Grace+2×B200 | $1,700Wafer + yield cost for GB200 logic die | $5,800HBM memory stack cost for GB200 | $2,200CoWoS / advanced packaging cost for GB200 | $13,500Total BOM manufacturing cost for GB200 | $65,000Average selling price for GB200 | 79%Gross margin: (sell price - mfg cost) / sell price |
| MI300X | AMD | TSMC N5/N6 | 1,725mm² (chiplet) | $600Wafer + yield cost for MI300X logic die | $2,900HBM memory stack cost for MI300X | $1,200CoWoS / advanced packaging cost for MI300X | $5,300Total BOM manufacturing cost for MI300X | $15,000Average selling price for MI300X | 65%Gross margin: (sell price - mfg cost) / sell price |
| MI325X | AMD | TSMC N5/N6 | 1,725mm² (chiplet) | $600Wafer + yield cost for MI325X logic die | $2,200HBM memory stack cost for MI325X | $500CoWoS / advanced packaging cost for MI325X | $3,800Total BOM manufacturing cost for MI325X | $20,000Average selling price for MI325X | 81%Gross margin: (sell price - mfg cost) / sell price |
| Gaudi2 | Intel | TSMC 7nm | — | $700Wafer + yield cost for Gaudi2 logic die | $960HBM memory stack cost for Gaudi2 | $500CoWoS / advanced packaging cost for Gaudi2 | $2,500Total BOM manufacturing cost for Gaudi2 | $12,000Average selling price for Gaudi2 | 79%Gross margin: (sell price - mfg cost) / sell price |
| Gaudi3 | Intel | TSMC 5nm | — | $1,500Wafer + yield cost for Gaudi3 logic die | $1,950HBM memory stack cost for Gaudi3 | $1,200CoWoS / advanced packaging cost for Gaudi3 | $6,500Total BOM manufacturing cost for Gaudi3 | $15,625Average selling price for Gaudi3 | 58%Gross margin: (sell price - mfg cost) / sell price |
All costs are estimates based on industry consensus data. Actual costs vary by volume, contract terms, yield, and market conditions.
H100 SXM5 est. mfg cost & sell price — daily ledger
Daily ledger; history began 2026-06-06 (per-domain start may be later). Append-only — cannot be backfilled.
H100 SXM secondary-market price — residual value tracker
Median used-market price per GPU across independent public sources (sold-listing roundups, broker pages, trade press). The ledger also records the low/high band and a derived residual value (median ÷ launch price) — weekly, measured, not assumed.
Cost Structure Analysis
1. HBM memory is now the dominant cost component
Across all chips in the table, HBM memory represents 35-47% of total manufacturing cost. For the GB200 superchip, HBM alone costs $4,800 per unit -- more than the entire manufacturing cost of an H100. The shift from HBM3 ($200/stack) to HBM3E ($300/stack) further amplifies this trend, with next-generation chips requiring 8-12 stacks each.
2. Advanced packaging adds $300-$2,000 per chip
CoWoS-S and CoWoS-L interposer packaging is the third-largest cost element after HBM and logic dies. Multi-die designs like the B200 (two Blackwell dies on a single CoWoS-L substrate) and GB200 (Grace CPU + two B200 GPUs) push packaging costs to $1,000-$2,000 per unit. TSMC CoWoS capacity remains supply-constrained with 40-52 week lead times.
3. NVIDIA maintains significantly higher margins than AMD
NVIDIA chips command 80-88% gross margins compared to AMD's 65-70%. This margin gap reflects NVIDIA's CUDA software ecosystem lock-in, stronger enterprise demand, and first-mover advantage in data center AI. Intel's Gaudi line achieves 82-83% margins at lower absolute price points, targeting a different market segment.
Methodology & Data Sources
Cost estimates on this page are derived from multiple independent sources and cross-validated where possible:
- Epoch AI -- Monte Carlo cost models for semiconductor manufacturing, covering wafer cost, yield, and packaging economics
- Raymond James -- Semiconductor equity research with bottom-up BOM cost analysis for NVIDIA and AMD accelerators
- TrendForce -- Quarterly foundry pricing reports and HBM supply/demand tracking
- SemiAnalysis -- Teardown analysis and cost modeling for AI accelerator products
Estimates are directional and may vary +/-15-20% from actual manufacturing costs. Logic die costs are calculated from wafer price, die area, and estimated yield. HBM costs use per-stack pricing multiplied by stack count. Packaging costs include interposer, substrate, and assembly. For full terms see Terms & Data Provenance.
Related Tools
Use our interactive tools to model custom chip cost scenarios and compare accelerators: