Silicon Analysts

Semiconductor Capex by Company

Newest print Jan 2026Reviewed quarterlyCSV — newest observations; full series with a Pro keyAPI

TSMC: $40.9B (2025) — TSMC 4Q25 management report, Jan 2026 (confirmed). Basis: as reported. +37.2% vs 2024.

Semiconductor Capex by Company — latest readings

20 observations across 4 series, 2020–2026.

Latest freely available reading for each series in Semiconductor Capex by Company, with its basis, source and date
SeriesLatest ($B)Source
TSMC202540.9TSMC 4Q25 management reportJan 2026
Samsung2025E40Samsung investor day / analyst estimatesJan 2026
Micron2025E14Micron guidance + $100B NY megafabJan 2026
SK Hynix2025E22SK Hynix guidance 2025Jan 2026

Annual capital expenditure by leading semiconductor companies — TSMC, Samsung, Micron, SK Hynix, and Intel. A leading indicator of future capacity additions 12–18 months out.

TSMC: $40.9B (2025), TSMC 4Q25 management report, Jan 2026

  1. 12023 — Memory Capex Cut: Samsung, Micron, SK Hynix slash capex during DRAM downturn. SK Hynix cuts nearly 50%.
  2. 22025 — Micron NY Megafab: Micron announces $100B New York megafab commitment. HBM4 investment accelerates.

Source: Samsung 2023 Annual Report, SK Hynix 2023 Annual Report, TSMC 2023 Annual Report, Micron FY2023 Annual Report, SK Hynix 2024 Annual Report, Samsung 2024 Annual Report and 6 more · Basis: reported · Anonymous view: the newest 3 observations per series (Jul 2023–Jul 2025); 7 earlier prints back to 2020 — full ledger is Pro.

Prints ledger

Prints ledger: every observation in this dataset with its period, value, basis, type, confidence and source
Note and copy
2025TSMC40.9
2025ESamsung4036–$44B
2025EMicron1412–$16B
2025ESK Hynix2219–$25B
2024TSMC29.8
2024Samsung34
2024SK Hynix17.5
2024Micron8
2023TSMC30.4
2023Samsung30.5
2023SK Hynix10
2023Micron7
TSMC: 3 earlier prints, 2020–2022 and 1 projection (2026) — full ledger is Pro
Samsung: 2 earlier prints, 2021–2022 — full ledger is Pro
Micron: 1 earlier print, 2022 — full ledger is Pro
SK Hynix: 1 earlier print, 2022 — full ledger is Pro
Showing the newest 3 observations per series (2023–2025); 7 earlier observations (2020–2022) and 1 projection are in Pro.

Provenance

Annual reports, quarterly earnings releases, and investor day presentations. Capex = PP&E additions as reported. Includes fab construction, equipment, and technology upgrades. All figures in USD billions.

Basis: as reported

PP&E additions exactly as the company reported them in annual/quarterly filings.

Sources

  • TSMC 2020 Annual Report (Feb 2021)
  • TSMC 2021 Annual Report (Feb 2022)
  • Samsung 2021 Annual Report (Feb 2022)
  • TSMC 2022 Annual Report (Feb 2023)
  • Samsung 2022 Annual Report (Feb 2023)
  • Micron FY2022 Annual Report (Oct 2022)
  • SK Hynix 2022 Annual Report (Feb 2023)
  • Samsung 2023 Annual Report (Feb 2024)
  • SK Hynix 2023 Annual Report (Feb 2024)
  • TSMC 2023 Annual Report (Feb 2024)
  • Micron FY2023 Annual Report (Oct 2023)
  • SK Hynix 2024 Annual Report (Jan 2025)
  • Samsung 2024 Annual Report (Jan 2025)
  • Micron FY2024 Annual Report (Oct 2024)
  • TSMC Q4 2024 earnings (Jan 2025)
  • Samsung investor day / analyst estimates (Jan 2026)
  • TSMC 4Q25 management report (Jan 2026)
  • Micron guidance + $100B NY megafab (Jan 2026)
  • SK Hynix guidance 2025 (Jan 2026)
  • TSMC Q2 2026 earnings call guidance (Jul 2026)

Suggested citation

Silicon Analysts, "Semiconductor Capex by Company", as of Jan 2026, https://siliconanalysts.com/market-data/semiconductor-capex, retrieved September 28, 2026.

API: /api/v1/market-data/semiconductor-capexCSVLicence

Showing the newest 3 observations per series (2023–2025); 7 earlier observations (2020–2022) and 1 projection are in Pro.

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HighMemorySep 23, 2026

Samsung HBM4 Yield Climbs to ~80%, Wafer Starts Up 40% as HBM4 Pricing Projected +65%

Yield: <60% → ~80% (+20pp); Capacity: Samsung HBM wafer starts +40% (180k→250k wpm), HBM4-family mix 40%→80%; Price: HBM4 ASP +65% YoY; Share shift: Samsung 21%→33%, SK hynix 58%→50% (Counterpoint, Q1→Q2)

CriticalMemorySep 18, 2026

HBM3E Contract Prices Surge ~20% for 2026; Server DRAM Spikes 90-95% QoQ as Supply Crunch Intensifies

HBM3E 2026 contract price: ~+20% full-year vs. prior contracts (Samsung, SK Hynix per TrendForce); Server DRAM contract price QoQ: +90–95% Q1 2026, +58–63% Q2 2026, +13–18% Q3 2026 (TrendForce); DDR4 commodity spot: +249% Nov 2025 to Aug 2026 ($12.18 → $42.50). Est. BOM impact on H200/B200-class GPU: HBM cost line up ~+20% YoY on contracted volumes.

HighMemoryAug 29, 2026

SK Hynix Breaks Ground on Indiana HBM Fab: $4B US Domestic Capacity Confirmed

CapEx commitment: ~$4B USD; production ramp targeted 2029; near-term (2026–2028) HBM supply capacity unchanged.

HighPackagingAug 28, 2026

SK Hynix Breaks Ground on $4B+ Indiana HBM4E Packaging Facility; HBM Shortage Forecast Through 2030

Capacity: +U.S. HBM4E packaging base online Q3 2029 (net-new domestic capacity); CapEx committed: >$4B; Supply gap: HBM shortage characterized as persisting through end-2030 per SK Hynix CEO public statement.