Semiconductor Capex by Company — Historical Time Series Data

Annual capital expenditure by leading semiconductor companies — TSMC, Samsung, Micron, SK Hynix, and Intel. A leading indicator of future capacity additions 12–18 months out.

Semiconductor Capex by Company

Annual capital expenditure by leading semiconductor companies — TSMC, Samsung, Micron, SK Hynix, and Intel. A leading indicator of future capacity additions 12–18 months out.

20 data points·Unit: $B·Last updated: Mar 2026

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Data Table

PeriodSeriesValue
2020
TSMC
•••
2021
Samsung
•••
2021
TSMC
•••
2022
Samsung
•••
2022
Micron
•••
2022
TSMC
•••
2022
SK Hynix
•••
2023
SK Hynix
10
2023
TSMC
•••
2023
Micron
7
2023
Samsung
30.5
2024
Samsung
34
2024
TSMC
30
2024
Micron
8
2024
SK Hynix
17.5
2025E
Micron
14
2025
TSMC
38
2025E
Samsung
40
2025E
SK Hynix
22
2026EP
TSMC
42

Methodology & Sources

Annual reports, quarterly earnings releases, and investor day presentations. Capex = PP&E additions as reported. Includes fab construction, equipment, and technology upgrades. All figures in USD billions.

Citations:

  • TSMC 2020 Annual Report (Feb 2021)
  • Samsung 2021 Annual Report (Feb 2022)
  • TSMC 2021 Annual Report (Feb 2022)
  • Samsung 2022 Annual Report (Feb 2023)
  • Micron FY2022 Annual Report (Oct 2022)
  • TSMC 2022 Annual Report (Feb 2023)
  • SK Hynix 2022 Annual Report (Feb 2023)
  • SK Hynix 2023 Annual Report (Feb 2024)
  • TSMC 2023 Annual Report (Feb 2024)
  • Micron FY2023 Annual Report (Oct 2023)
  • Samsung 2023 Annual Report (Feb 2024)
  • Samsung 2024 Annual Report (Jan 2025)
  • TSMC Q4 2024 earnings (Jan 2025)
  • Micron FY2024 Annual Report (Oct 2024)
  • SK Hynix 2024 Annual Report (Jan 2025)
  • Micron guidance + $100B NY megafab (Jan 2026)
  • TSMC Q4 2025 guidance (Jan 2026)
  • Samsung investor day / analyst estimates (Jan 2026)
  • SK Hynix guidance 2025 (Jan 2026)
  • Analyst consensus Jan 2026 (Jan 2026)

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HighPackagingJul 23, 2026

SK Hynix Commits $5.8B to Advanced HBM Packaging Facility; TSMC Confirms 2027 Wafer Price Hikes Up to 10%

SK Hynix packaging CapEx: +$5.8B committed; TSMC mature-node wafer price hike: up to +10% effective 2027; advanced-node pricing direction unquantified but directionally upward per Barchart/TSMC guidance.

HighMemoryJul 20, 2026

TSMC Commits $100B+ Arizona Expansion, Accelerates 3nm Conversion to Meet AI Chip Surge

Capacity: TSMC U.S. CapEx raised by +$100B incremental; total U.S. commitment reaches ~$265B per Odaily/Reuters; annual CapEx guidance lifted to $60–64B. 5nm-to-3nm fab conversion timeline accelerated (no specific % capacity figure disclosed publicly).

HighPackagingJul 16, 2026

TSMC $265B US CapEx Commitment + ASML 30% EUV Capacity Surge Signal Multi-Year AI Supply Expansion — with Equipment Price Hike Risk

TSMC CapEx: +$100B incremental US commitment (total $265B), 2026 CapEx at high end of $52–56B range; ASML EUV/DUV capacity: +30% per year for 2 years; ASML 2026 revenue guidance raised ~15–19% vs prior midpoint (€38B → €44B midpoint); ASML EUV price hike quantum not yet disclosed — wafer/packaging cost pass-through risk flagged but unquantified.

HighPackagingJul 11, 2026

SK Hynix CEO Flags 2027 as Worst-Ever HBM Supply Crunch; $26.5B IPO Capital Earmarked for Capacity Expansion

Capacity expansion funded: $26.5B raised (new fab + packaging facility + EUV scanners); Supply gap: demand forecasted to exceed supply through 2030+; No specific yield or price-per-unit figure disclosed.