Fab Construction Milestones
A dated log of semiconductor fab construction and ramp events — announcement, groundbreaking, equipment move-in, risk production, volume production — with schedule slips recorded as their own events rather than quietly overwriting the original plan.
/api/v1/fab-events over REST, or the get_fab_events MCP tool. Latest values are free; get a free API key for history.Most recent 60 observations
| Date | Company | Fab | Event | Country | Source |
|---|---|---|---|---|---|
| 2026-07-16 | TSMC | Phoenix Fab 21 site (Arizona expansion) | expansion | USA | source |
| 2026-07-09 | Micron | Boise ID1 | expansion | USA | source |
| 2026-07-09 | Micron | Clay NY1 Megafab | groundbreaking | USA | source |
| 2026-07-03 | Kioxia | Kitakami Fab2 (K2) | hvm_start | Japan | source |
| 2026-07-02 | Infineon | Dresden Smart Power Fab | hvm_start | Germany | source |
| 2026-05-27 | UMC | Intel Ocotillo Fabs 12/22/32 (UMC 12nm program) | announced | USA | source |
| 2026-04-24 | Samsung | Taylor Fab 1 | equipment_move_in | USA | source |
| 2026-04-17 | SK hynix | West Lafayette Indiana Advanced Packaging Fab | groundbreaking | USA | source |
| 2026-03-31 | TSMC | JASM Kumamoto 2 | conversion | Japan | source |
| 2026-03-03 | Samsung | Taylor Fab 1 | delay | USA | source |
| 2026-02-25 | SK hynix | Yongin Fab 1 | expansion | South Korea | source |
| 2025-10-08 | Intel | Fab 52 & 62 | risk_production | USA | source |
| 2025-09-29 | Kioxia | Kitakami Fab2 (K2) | hvm_start | Japan | source |
| 2025-07-17 | TSMC | Fab 21 Phase 2 | expansion | USA | source |
| 2025-06-12 | Micron | Clay NY1 Megafab | delay | USA | source |
| 2025-06-12 | Micron | Boise ID1 | delay | USA | source |
| 2025-06-03 | TSMC | JASM Kumamoto 2 | delay | Japan | source |
| 2025-03-04 | TSMC | Fab 21 Arizona | expansion | USA | source |
| 2025-03-04 | TSMC | Fab 21 Phase 1 | hvm_start | USA | source |
| 2025-02-28 | Intel | Ohio One Mod 1 | delay | USA | source |
| 2025-02-24 | SK hynix | Yongin Fab 1 | groundbreaking | South Korea | source |
| 2024-12-23 | TSMC | JASM Kumamoto 1 | hvm_start | Japan | source |
| 2024-10-24 | Wolfspeed | Ensdorf Saarland Fab | delay | Germany | source |
| 2024-10-19 | Samsung | Taylor Fab 1 | delay | USA | source |
| 2024-09-16 | Intel | Penang Advanced Packaging Fab | delay | Malaysia | source |
| 2024-09-16 | Intel | Magdeburg Fab | delay | Germany | source |
| 2024-08-20 | TSMC | ESMC Dresden Fab 1 | groundbreaking | Germany | source |
| 2024-08-20 | TSMC | ESMC Dresden | groundbreaking | Germany | source |
| 2024-07-26 | SK hynix | Yongin Fab 1 | announced | South Korea | source |
| 2024-06-28 | Nexperia | Hamburg Fab | expansion | Germany | source |
| 2024-05-31 | STMicroelectronics | Catania Silicon Carbide Campus | announced | Italy | source |
| 2024-05-21 | UMC | Fab 12i Singapore | delay | Singapore | source |
| 2024-05-21 | UMC | Fab 12i Singapore | equipment_move_in | Singapore | source |
| 2024-05-02 | PSMC | Tongluo Fab | risk_production | Taiwan | source |
| 2024-04-24 | SK hynix | M15X Cheongju | conversion | South Korea | source |
| 2024-04-24 | SK hynix | M15X Cheongju | announced | South Korea | source |
| 2024-04-15 | Samsung | Taylor Fab 1 | expansion | USA | source |
| 2024-04-08 | TSMC | Fab 21 Phase 3 | announced | USA | source |
| 2024-04-08 | TSMC | Fab 21 Phase 2 | delay | USA | source |
| 2024-04-03 | SK hynix | West Lafayette Indiana Advanced Packaging Fab | announced | USA | source |
| 2024-02-24 | TSMC | JASM Kumamoto 1 | topping_out | Japan | source |
| 2024-02-19 | GlobalFoundries | Malta Campus New Fab | announced | United States | source |
| 2024-02-06 | TSMC | JASM Kumamoto 2 | announced | Japan | source |
| 2024-02-02 | Intel | Ohio One Mod 1 | delay | USA | source |
| 2024-01-24 | Intel | Rio Rancho Fab 9 | hvm_start | United States | source |
| 2023-12-26 | Intel | Kiryat Gat Fab 38 | expansion | Israel | source |
| 2023-11-06 | Micron | Advanced Assembly and Test Taiwan (AATT) | expansion | Taiwan | source |
| 2023-09-29 | Intel | Fab 34 Leixlip | hvm_start | Ireland | source |
| 2023-09-12 | GlobalFoundries | Fab 7 Singapore | expansion | Singapore | source |
| 2023-09-01 | Rapidus | IIM-1 | groundbreaking | Japan | source |
| 2023-08-08 | TSMC | ESMC Dresden 1 | announced | Germany | source |
| 2023-08-08 | TSMC | ESMC Dresden Fab 1 | announced | Germany | source |
| 2023-07-20 | TSMC | Fab 21 Phase 1 | delay | USA | source |
| 2023-07-18 | TSMC | Fab 22 Phase 1 | conversion | Taiwan | source |
| 2023-06-22 | Micron | Sanand ATMP Facility | announced | India | source |
| 2023-06-19 | Intel | Magdeburg Fab | expansion | Germany | source |
| 2023-05-17 | Micron | Hiroshima Fab | announced | Japan | source |
| 2023-02-28 | Rapidus | IIM-1 | announced | Japan | source |
| 2023-02-17 | Infineon | Dresden Smart Power Fab | announced | Germany | source |
| 2023-02-01 | Wolfspeed | Ensdorf Saarland Fab | announced | Germany | source |
Showing the most recent rows. The full series is available via the API.
How this is collected
Collected from foundry investor relations, company press releases, government filings and trade press. A schedule slip is recorded as its own dated delay event, so the original plan and the revision both remain visible.
Every row carries a source URL, a verbatim quote from that source, and a confidence tier. Readings that cannot be verified against a dated public source are dropped rather than estimated — a visible gap beats a wrong value. See data quality.