Silicon Analysts

How much does your chip cost to manufacture?

Free interactive tools for semiconductor cost modeling, fab tracking, and supply chain analysis. Trusted by 1,000+ engineers monthly and cited by ChatGPT, Perplexity, and Gemini.

1,000+ monthly usersCited by ChatGPT & Perplexity64 fabs · 13 AI chips · 30+ reports

Analysis & Modeling Tools

From wafer-level cost modeling to global supply chain mapping — everything in one platform.

Cost Modeling

Chip Price Calculator

Wafer cost, yield modeling, packaging economics, and margin analysis across process nodes from 180nm to 2nm.

180nm–2nm · 8 foundriesJune 2026
Cost Modeling

Packaging Model

Compare CoWoS-S, CoWoS-L, EMIB, SoIC, and flip-chip architectures with HBM stack cost analysis.

5 architectures · HBM stacksJuly 2026
Supply Chain

Fab Explorer

Explore 64 semiconductor fabs from TSMC, Samsung, Intel, GlobalFoundries, SMIC, UMC, and more. Filter by node, country, and capacity.

64 fabs · 10 countriesApril 2026
Benchmarking

Price / Performance Frontier

Compare AI accelerators on cost, throughput, training time, and TCO — H100, B200, MI300X, TPU v5p, and more.

12 accelerators · 4 metricsApril 2026
Market Intelligence

HBM Market Analysis

HBM market dynamics — accelerator specs, vendor market share, spot pricing, supply chain signals, and revenue forecasts.

9 datasets · Live dataLive data
Cost ModelingUPDATED

Cost Bridge Chart

Side-by-side manufacturing cost comparison across logic die, HBM memory, packaging, and assembly for 13 AI accelerators.

13 chips · 4 cost layersApril 2026
Market Intelligence

Market Data

Historical time series for wafer pricing, HBM/DRAM costs, fab utilization, CoWoS capacity, and NRE trends — 306 sourced data points across 16 datasets.

16 datasets · 306 data pointsMar 2026
Supply Chain

Supply Chain Explorer

Interactive sunburst visualization of semiconductor supply chain chokepoints — from ASML to Zeiss optics to Japanese photoresist monopolies.

12 chokepoints · 7 countriesApril 2026
Supply Chain

Allocation Dashboard

Track foundry allocation status, CoWoS packaging availability, and HBM supply signals across 14 process nodes from TSMC, Samsung, Intel, and more.

14 nodes · 3 packaging · 3 HBMApril 2026
Decision Tools

Tapeout Decision Workspace

Guided 5-step workflow for fabless teams evaluating tapeout decisions — chip definition, foundry selection, cost modeling, competitive benchmarking, and go/no-go summary.

5 steps · 40+ benchmarksJuly 2026
$ curl /api/v1/accelerators
{ "success": true, "data": [...] }
$ curl /api/v1/articles?q=nvidia
{ "count": 11 }
$ curl /api/v1/hbm
API

Developer API

Structured semiconductor data for AI agents and applications — accelerator costs, HBM market data, and 30+ articles. Free, no key required.

4 endpoints · JSONJuly 2026

Featured Analysis

NVIDIA B200 Manufacturing Cost: $6,400 per chip — 84% gross margin at $40k sell price

See full cost breakdown →

Latest Market Intelligence

Daily AI-detected supply-chain signals — each brief sourced and dated. Public sources only.

HighPackaging

SK Hynix CEO Flags 2027 as Worst-Ever HBM Supply Crunch; $26.5B IPO Capital Earmarked for Capacity Expansion

SK Hynix CEO Kwak Noh-Jung publicly stated that 2027 will represent the worst supply shortage in the memory industry's history, with demand forecast to exceed production capacity beyond 2030, according to a Reuters interview conducted on July 10, 2026. Concurrently, SK Hynix raised $26.5B in its Nasdaq ADR debut — the largest-ever US IPO by a foreign company — with proceeds explicitly allocated to a new South Korean fab, a new packaging facility, and EUV scanner procurement to address AI-driven HBM demand.

Capacity expansion funded: $26.5B raised (new fab + packaging facility + EUV scanners); Supply gap: demand forecasted to exceed supply through 2030+; No specific yield or price-per-unit figure disclosed.

HighMemory

HBM Supply Shortage Persists as SK Hynix Commands 56.4% Market Share; Micron Commits $250B to Domestic DRAM Expansion

SK Hynix's SEC filing confirms it holds 56.4% of the HBM market amid a verified global shortage affecting data center builders, with demand for its US listing running 7x oversubscribed — underscoring persistent HBM supply tightness directly impacting AI accelerator BOM costs. Concurrently, Micron has committed $250 billion in US DRAM manufacturing investment through 2035, targeting 40% of its DRAM output domestically, with ground broken on a New York fab on July 9, 2026.

HBM shortage: supply constrained with SK Hynix holding 56.4% market share per SEC filing; Micron US DRAM capacity target: 40% of total output domestically by 2035; Micron data center segment gross margin reached 87% on $11.5B revenue (up 103% QoQ), signaling sustained premium pricing on memory inputs to AI hardware.

HighPackaging

SK Hynix Commits $706B to HBM/DRAM Scale-Up as ISM Flags Memory Components in Active Short Supply

SK Hynix, the dominant HBM supplier to Nvidia, has committed KRW 1,100 trillion (~$706B) within SK Group's broader $1.36 trillion investment roadmap to scale HBM and next-generation DRAM production capacity, while a separately announced KRW 20 trillion P&T7 advanced packaging facility (targeting 2027 completion) signals a direct push to relieve CoWoS-adjacent packaging bottlenecks. Concurrently, the ISM June services survey explicitly flagged memory components as having shifted from 'more expensive' to 'now in short supply,' introducing near-term allocation risk for AI accelerator BOMs ahead of capacity coming online.

Capacity: P&T7 packaging facility targeted for end-2027; M17 NAND fab operations targeted H1 2029; SK Group aggregate HBM/DRAM CapEx: ~$706B committed. Supply tightness signal: ISM June 2026 survey flags memory in active short supply (no precise % figure cited). Bernstein projects SK Hynix DRAM gross margins peaking at ~92.7% in Q4 2026, implying sustained elevated HBM ASPs through at least 2028.

Latest Analysis

Deep-dive reports on semiconductor technology, supply chains, and market dynamics

AI HARDWARE

What You're Actually Paying For in a GPU-Hour: Hardware, Power, and the Scarcity Premium

We decompose H100, H200, and B200 rental prices into hardware, energy, and scarcity premium: 52-88% of every rented GPU-hour is demand premium, not cost.

Strip a rented GPU-hour down to its cost basis and the hardware barely matters. At 70% fleet utilization, four-year amortization of a fully burdened H100 server comes to $1.12/hr, and energy plus facility adds another $0.33/hr — against a $3.99 on-demand price at Lambda. The residual $2.54/hr — 64% of the price — is demand premium: scarcity rent, not cost recovery (SA estimate). That premium splits the market into two pricing regimes. Neoclouds price per unit of compute: Lambda's B200 rents at 1.38x its H100 price for 2.27x the FP8 (sparse) throughput — about 39% cheaper per effective PFLOP. Hyperscalers price scarcity: AWS capacity blocks put B200 at 2.38x H100 — per-PFLOP parity, meaning the newest silicon carries zero performance discount. How fast reserved-tier discounts erode that premium is the most useful forward indicator of AI compute supply catching up with demand.

ANALYSIS

The Hyperscaler Capex Wall: $434B of Buyer-Side AI Spend, the Depreciation Lag, and Why Big Tech Borrows

Microsoft, Alphabet, Amazon, and Meta spent a combined $434B on property and equipment over the last four quarters — nearly 3x their reported depreciation. The gap is by design, it is temporary, and it explains why cash-rich companies are suddenly issuing record bonds.

The four US hyperscalers — Microsoft, Alphabet, Amazon, and Meta — purchased $433.9B of property and equipment in the four quarters through March 2026 (SA estimate: sum of reported cash-flow figures), against roughly $149B of reported depreciation over the same span. Quarterly combined capex reached $129.8B in 1Q26, up 80% year over year, and company guidance for calendar 2026 sums to roughly $700B of intended spend. The capex-to-depreciation gap is structural: depreciation recognizes spend over 5-6 year server schedules and 25-40 year building schedules, so today's income statements carry only a fraction of today's build-out. That wave arrives regardless of what AI revenue does. It also explains the borrowing: Meta priced $30B in October 2025 (the largest investment-grade deal of the year) plus a ~$27B off-balance-sheet SPV, Alphabet raised ~$25B in November 2025 and ~$31B more in February 2026, and Amazon added $24.9B this week after $15B in November — all while generating record operating cash flow. Amazon's trailing-4Q capex now exceeds its trailing-4Q operating cash flow (102%, SA-computed). For the supplier chain, buyer-side capex is the demand signal; the depreciation drag is the 2027-2028 risk to its durability.

AI HARDWARE

The Inference Accelerator Wars: Why Cost-Per-Token Is Now the Defining Metric in AI Silicon

OpenAI's Jalapeño ASIC and the broader custom inference push are reshaping GPU vs ASIC economics. This analysis breaks down total cost of ownership, cost-per-token dynamics, and what the custom silicon wave means for enterprise AI infrastructure strategy.

The AI infrastructure battleground has shifted from training throughput to inference unit economics. OpenAI's Jalapeño — a custom inference accelerator built with Broadcom — is not primarily a competitive strike against NVIDIA; it is a structural bet that owning inference silicon is the only way to make gigawatt-scale LLM deployment economically sustainable. Enterprise buyers who treat GPU procurement as their only inference lever are already behind the curve.

FOUNDRY

Terafab, Intel 14A, and the New US Fab Startup Playbook: What the Musk-Intel Alliance Really Signals

Terafab's Intel 14A licensing deal reframes how US fab startups can achieve capital efficiency under the CHIPS Act — and what the exodus of Intel foundry talent means for execution risk. A Silicon Analysts deep-dive.

Terafab is not a Tesla fab — it is an Intel foundry engagement dressed in Musk-brand capital formation, with Tesla and SpaceX providing the demand anchor that Intel's foundry turnaround desperately needs. The 14A licensing arrangement tests a structurally new US fab model: committed captive demand substituting for the open-market customer base that eluded Intel Foundry Services. Whether the model survives execution depends on talent retention, CHIPS Act disbursement timing, and whether Gary Jiang's operational playbook from Tesla can translate into semiconductor manufacturing discipline.

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Why Silicon Analysts

Industry-Standard Models

Built on semiconductor cost models used by leading companies. Wafer pricing, yield curves, and packaging economics from publicly available data.

Real-Time Market Data

Live ticker, HBM spot prices, and fab capacity tracking. Stay ahead of supply chain shifts with structured, programmatic data access.

Open & Transparent

Free tools, public API, documented data sources. No black boxes — every estimate links to methodology and cited research.

Semiconductor Cost Modeling Platform

Chip Cost Calculator

Model chip manufacturing costs across process nodes from 28nm to 2nm. Calculate GDPW, net die yield, wafer costs, CoWoS packaging, HBM memory pricing, and total chip cost with interactive parameter adjustments. Free alternative to paid die calculators.

Supply Chain Intelligence

Explore 64 semiconductor fabs worldwide with capacity data, track HBM market dynamics with live spot pricing and vendor market share, and visualize supply chain chokepoints from ASML lithography to Japanese photoresist monopolies.

Market Analysis

30+ deep-dive reports covering TSMC wafer pricing, NVIDIA GPU economics, HBM memory shortages, export controls, and AI chip demand trends. Data-driven analysis with interactive cost models and structured data via our free API.

Semiconductor Manufacturing FAQ

How much does it cost to make a semiconductor chip?
Semiconductor manufacturing costs vary by process node: mature 28nm costs ~$3,000 per wafer, advanced 5nm costs ~$18,500, and cutting-edge 3nm costs ~$19,500. Per-chip cost depends on die size and yield — for example, an NVIDIA H100 (814mm² at TSMC 4N) costs approximately $3,320 to manufacture, while the B200 costs approximately $6,400.
How many chips can you get from one wafer?
The number of chips per wafer (Gross Dies Per Wafer or GDPW) depends on die size and wafer diameter. On a standard 300mm wafer: a small chip (50mm²) yields ~1,250 gross dies, a medium chip (200mm²) yields ~300, and a large chip like NVIDIA's H100 (814mm²) yields approximately 74 gross dies before yield loss.
What is the most expensive chip to manufacture?
As of 2026, the most expensive chips to manufacture are large AI accelerators. NVIDIA's B200 (Blackwell) at TSMC 4NP has an estimated manufacturing cost of ~$6,400, with HBM memory ($2,900) being the largest cost component. AMD's MI300X, using N5/N6 chiplets with advanced packaging, costs approximately $5,300 to manufacture.
How many semiconductor fabs are there in the world?
Silicon Analysts tracks 64 semiconductor fabrication facilities across 10 countries, operated by 16 companies including TSMC, Samsung, Intel, GlobalFoundries, UMC, and SMIC. New fabs are currently under construction or announced globally, including TSMC Arizona, JASM Kumamoto, and Intel Ohio.

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