The live ledger of AI-chip economics

A provenance-backed data platform for semiconductor & AI-accelerator economics — wafer pricing, HBM, packaging, fabs, and foundry allocation. Every number dated and sourced, every dataset queryable by humans and AI agents alike.

1,000+ monthly usersCited by ChatGPT & PerplexityDated · sourced · growing weekly

Analysis & Modeling Tools

From wafer-level cost modeling to global supply chain mapping — everything in one platform.

Cost Modeling

Chip Price Calculator

Wafer cost, yield modeling, packaging economics, and margin analysis across process nodes from 180nm to 2nm.

180nm–2nm · 8 foundriesAugust 2026
Market Intelligence

HBM Market Analysis

HBM market dynamics — accelerator specs, vendor market share, spot pricing, supply chain signals, and revenue forecasts.

9 datasets · Live dataLive data
Supply Chain

Fab Explorer

Explore 64 semiconductor fabs from TSMC, Samsung, Intel, GlobalFoundries, SMIC, UMC, and more. Filter by node, country, and capacity.

64 fabs · 10 countriesAugust 2026
Market Intelligence

Market Data

Historical time series for wafer pricing, HBM/DRAM costs, fab utilization, CoWoS capacity, and NRE trends — 328 sourced data points across 16 datasets.

16 datasets · 328 data pointsAugust 2026
Cost Modeling

Cost Bridge Chart

Side-by-side manufacturing cost comparison across logic die, HBM memory, packaging, and assembly for 18 AI accelerators.

18 chips · 4 cost layersAugust 2026
Cost Modeling

Packaging Model

Compare CoWoS-S, CoWoS-L, EMIB, SoIC, and flip-chip architectures with HBM stack cost analysis.

5 architectures · HBM stacksAugust 2026
Supply Chain

Supply Chain Explorer

Interactive sunburst visualization of semiconductor supply chain chokepoints — from ASML to Zeiss optics to Japanese photoresist monopolies.

12 chokepoints · 7 countriesAugust 2026
Benchmarking

Price / Performance Frontier

Compare AI accelerators on cost, throughput, training time, and TCO — H100, B200, MI300X, TPU v5p, and more.

12 accelerators · 4 metricsAugust 2026
Supply Chain

Allocation Dashboard

Track foundry allocation status, CoWoS packaging availability, and HBM supply signals across 14 process nodes from TSMC, Samsung, Intel, and more.

14 nodes · 3 packaging · 3 HBMApril 2026
Decision Tools

Tapeout Decision Workspace

Guided 5-step workflow for fabless teams evaluating tapeout decisions — chip definition, foundry selection, cost modeling, competitive benchmarking, and go/no-go summary.

5 steps · 40+ benchmarksAugust 2026
$ curl /api/v1/accelerators
{ "success": true, "data": [...] }
$ curl /api/v1/articles?q=nvidia
{ "count": 11 }
$ curl /api/v1/hbm
API

Developer API

Structured semiconductor data for AI agents and applications — wafer pricing, HBM, foundry economics, the daily change ledger, and 30+ articles. Free, no key required.

37 endpoints · JSON + MCPAugust 2026
Free · Silicon Analysts Weekly

The AI-chip supply chain, one email a week

One short email a week on the AI-chip supply chain — pricing & lead-time signals, HBM and foundry-capacity moves, and that week's new analysis. Sourced, dated, human-reviewed. No marketing, ever.

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Latest Analysis & Market Intelligence

Deep-dive reports and daily AI-detected supply-chain signals — each sourced and dated. Public sources only.

HighMemory

SK Hynix Breaks Ground on Indiana HBM Fab: $4B US Domestic Capacity Confirmed

SK Hynix formally broke ground on its Indiana HBM production facility on August 27–28, 2026, committing approximately $4B in US-based HBM manufacturing capacity with volume production targeted from 2029 onward. This represents the first confirmed US-soil HBM fab groundbreaking by a major memory supplier, establishing a new domestic supply node for AI accelerator customers such as Nvidia.

CapEx commitment: ~$4B USD; production ramp targeted 2029; near-term (2026–2028) HBM supply capacity unchanged.

HighPackaging

SK Hynix Breaks Ground on $4B+ Indiana HBM4E Packaging Facility; HBM Shortage Forecast Through 2030

SK Hynix formally broke ground on its first U.S. advanced HBM packaging facility in West Lafayette, Indiana on August 27, 2026, committing more than $4 billion toward a cleanroom targeted for completion by October 2028 and HBM4E mass production in Q3 2029. SK Hynix CEO Kwak Noh-Jung simultaneously stated the company expects the current memory chip shortage to persist through the end of 2030, signaling a multi-year structural supply deficit for HBM used in AI accelerators including Nvidia H200 and B-series products.

Capacity: +U.S. HBM4E packaging base online Q3 2029 (net-new domestic capacity); CapEx committed: >$4B; Supply gap: HBM shortage characterized as persisting through end-2030 per SK Hynix CEO public statement.

HighMemory

Nvidia Flags 'Extreme' Memory Costs Compressing Margins; Supply Meets Only 70% of Demand — HBM Shortage Structural, Not Transient

Nvidia's Q2 FY2027 earnings (revenue $96.2B, +106% YoY) included an explicit management warning that memory costs are 'extreme' and surpassed internal forecasts, forcing a gross margin guidance reset for the coming year; Nvidia simultaneously disclosed it can currently supply only 70% of demand from existing customers. A former Nvidia executive cited on CNBC corroborated the view that elevated memory pricing is structural, arguing Nvidia's own 70% FY2028 revenue growth projection — explicitly characterized by CFO Colette Kress as a 'supply-constrained outlook' — would be higher were HBM constraints not binding.

Gross margin pressure: Nvidia guiding below current ~75% GM due to memory cost overage; supply gap: ~30% of current customer demand unmet; FY2028 revenue upside capped by HBM supply constraint (analyst Stacy Rasgon, Bernstein, quantifies constrained vs. unconstrained delta as implying >$200B in suppressed revenue potential).

ANALYSIS

The Forecast Is a Path, Not a Number: What 44 Revision Chains Reveal About Semiconductor Consensus

Silicon Analysts archives third-party semiconductor forecasts under their original publication date. Reading 228 observations as chains rather than snapshots exposes three regularities in how the industry's consensus actually behaves — and one structural gap nobody fills.

A semiconductor forecast is almost never read as what it is: one point on a path that the forecaster is still walking. Across 44 revision chains spanning 2018 to 2026, three patterns hold. Forecasters move as a bloc within a target year — every one of the six CY2023 chains was revised down, and all eight CY2024 chains were revised up. Revisions converge as the target approaches, with the median step shrinking from 8.2% to 3.5%. And the record always stops before the year does: the median final print lands 64 days before the target year closes, and not one of the 44 chains contains a print published after the period ended. The number that becomes "what they forecast" is therefore always a number published while the answer was still unknown, and no forecaster returns to mark it. The archive's widest move shows the stakes: WSTS raised its own 2026 market forecast from $760.7 billion to $1.51 trillion in twelve months, with memory alone accounting for about 79% of the revision.

MEMORY

DRAM Spot Price Outlook 2026: What the DDR4/DDR5 Spread Is Telling Us About the Memory Cycle

DDR4 and DDR5 spot prices are surging into 2026, with contract prices lagging behind. We decode what the widening spot-contract spread historically signals about memory cycle turns.

DRAM spot prices for both DDR4 and DDR5 have entered a sharp acceleration phase, with server DRAM contract prices rising 45–50% in Q4 2025 and TrendForce projecting a further 55–60% quarter-on-quarter gain in Q1 2026. A rare inversion—where chip spot quotes have exceeded module quotes—is flashing one of the clearest early-cycle signals in years. With AI-driven HBM demand cannibalizing standard DRAM capacity and no meaningful supply relief expected before 2027, the spot market is pricing in a sustained upcycle, not a transient squeeze.

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Semiconductor Cost Modeling Platform

Chip Cost Calculator

Model chip manufacturing costs across process nodes from 28nm to 2nm. Calculate GDPW, net die yield, wafer costs, CoWoS packaging, HBM memory pricing, and total chip cost with interactive parameter adjustments. Free alternative to paid die calculators.

Supply Chain Intelligence

Explore 64 semiconductor fabs worldwide with capacity data, track HBM market dynamics with live spot pricing and vendor market share, and visualize supply chain chokepoints from ASML lithography to Japanese photoresist monopolies.

Market Analysis

30+ deep-dive reports covering TSMC wafer pricing, NVIDIA GPU economics, HBM memory shortages, export controls, and AI chip demand trends. Data-driven analysis with interactive cost models and structured data via our free API.

Semiconductor Manufacturing FAQ

How much does it cost to make a semiconductor chip?
Semiconductor manufacturing costs vary by process node: mature 28nm costs ~$3,000 per wafer, advanced 5nm costs ~$18,500, and cutting-edge 3nm costs ~$19,500. Per-chip cost depends on die size and yield — for example, an NVIDIA H100 (814mm² at TSMC 4N) costs approximately $3,320 to manufacture, while the B200 costs approximately $6,400.
How many chips can you get from one wafer?
The number of chips per wafer (Gross Dies Per Wafer or GDPW) depends on die size and wafer diameter. On a standard 300mm wafer: a small chip (50mm²) yields ~1,250 gross dies, a medium chip (200mm²) yields ~300, and a large chip like NVIDIA's H100 (814mm²) yields approximately 74 gross dies before yield loss.
What is the most expensive chip to manufacture?
As of 2026, the most expensive chips to manufacture are large AI accelerators. NVIDIA's B200 (Blackwell) at TSMC 4NP has an estimated manufacturing cost of ~$6,750, with HBM memory ($3,250) being the largest cost component. AMD's MI300X, using N5/N6 chiplets with advanced packaging, costs approximately $5,300 to manufacture.
How many semiconductor fabs are there in the world?
Silicon Analysts tracks 64 semiconductor fabrication facilities across 10 countries, operated by 16 companies including TSMC, Samsung, Intel, GlobalFoundries, UMC, and SMIC. New fabs are currently under construction or announced globally, including TSMC Arizona, JASM Kumamoto, and Intel Ohio.

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