How much does your chip cost to manufacture?
A provenance-backed data platform for semiconductor & AI-accelerator economics — wafer pricing, HBM, packaging, fabs, and foundry allocation. Every number dated and sourced, every dataset queryable by humans and AI agents alike.
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Chip Price Calculator
Wafer cost, yield modeling, packaging economics, and margin analysis across process nodes from 180nm to 2nm.
HBM Market Analysis
HBM market dynamics — accelerator specs, vendor market share, spot pricing, supply chain signals, and revenue forecasts.
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Explore 64 semiconductor fabs from TSMC, Samsung, Intel, GlobalFoundries, SMIC, UMC, and more. Filter by node, country, and capacity.
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Historical time series for wafer pricing, HBM/DRAM costs, fab utilization, CoWoS capacity, and NRE trends — 306 sourced data points across 16 datasets.
Cost Bridge Chart
Side-by-side manufacturing cost comparison across logic die, HBM memory, packaging, and assembly for 13 AI accelerators.
Packaging Model
Compare CoWoS-S, CoWoS-L, EMIB, SoIC, and flip-chip architectures with HBM stack cost analysis.
Supply Chain Explorer
Interactive sunburst visualization of semiconductor supply chain chokepoints — from ASML to Zeiss optics to Japanese photoresist monopolies.
Price / Performance Frontier
Compare AI accelerators on cost, throughput, training time, and TCO — H100, B200, MI300X, TPU v5p, and more.
Allocation Dashboard
Track foundry allocation status, CoWoS packaging availability, and HBM supply signals across 14 process nodes from TSMC, Samsung, Intel, and more.
Tapeout Decision Workspace
Guided 5-step workflow for fabless teams evaluating tapeout decisions — chip definition, foundry selection, cost modeling, competitive benchmarking, and go/no-go summary.
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Latest Analysis & Market Intelligence
Deep-dive reports and daily AI-detected supply-chain signals — each sourced and dated. Public sources only.
Nvidia–SK Hynix Multi-Year HBM Supply Partnership Confirmed at Up to $500B
Nvidia has secured a long-term HBM memory supply agreement with SK Hynix reported at up to $500 billion, encompassing next-generation HBM development for AI training, agents, and physical AI workloads, alongside a planned 2GW data center initiative for 2027. The deal, reported by CNBC and corroborated by The Economic Times via Facebook, represents the largest publicly disclosed memory supply commitment in the semiconductor industry and effectively locks in a dominant share of SK Hynix's HBM output for Nvidia's accelerator roadmap.
Supply commitment: up to $500B multi-year; Capacity: SK Hynix HBM allocation heavily directed toward Nvidia; Lead time risk for non-Nvidia HBM buyers: elevated (magnitude unquantified in sources).
Nvidia-SK Hynix & Samsung-Broadcom Lock In $950B HBM Supply Agreements, Securing Next-Gen Memory Pipeline Through 2030
Nvidia and SK Group have announced a $500B+ strategic initiative that includes a long-term HBM supply partnership with SK Hynix covering HBM4 memory for Vera Rubin-generation AI accelerators, with first AI data center deployment targeted for 2027; separately, Samsung Electronics signed a $200B collaboration with Broadcom spanning memory, foundry, and advanced packaging through 2030. Combined, South Korea's presidential adviser confirmed the two Korean memory giants have committed to $950B in memory supply partnerships with U.S. big tech — $750B from SK Hynix and $200B from Samsung — representing the most significant multi-year HBM supply lock-in ever disclosed publicly.
SK Hynix: $750B long-term HBM supply commitment to U.S. customers (led by Nvidia); Samsung: $200B memory + foundry + packaging commitment to Broadcom through 2030; SK Telecom 2GW AI data center powered by HBM4 targeting 2027 online date; TSMC CoWoS and advanced packaging capacity described as largely booked through 2027.
SK Hynix Commits $5.8B to Advanced HBM Packaging Facility; TSMC Confirms 2027 Wafer Price Hikes Up to 10%
SK Hynix's board has approved KRW 7.09 trillion ($5.8 billion) in capital expenditure for a next-generation advanced packaging facility in Cheongju, directly targeting HBM packaging capacity expansion to meet accelerating AI accelerator demand. Concurrently, TSMC has confirmed wafer manufacturing price increases for 2027, with mature-node technologies (12nm, 16nm, 28nm) facing hikes of up to 10%, signaling broad-based foundry cost inflation that will flow through to AI hardware BOMs.
SK Hynix packaging CapEx: +$5.8B committed; TSMC mature-node wafer price hike: up to +10% effective 2027; advanced-node pricing direction unquantified but directionally upward per Barchart/TSMC guidance.
The Interconnect Ceiling: Why Optical Links Are Becoming the Defining Constraint in AI Chip Architecture
As AI clusters scale to tens of thousands of GPUs, electrical interconnects are hitting fundamental bandwidth and energy limits. This analysis examines how optical networking chips, co-packaged optics, and in-package photonics are reshaping AI chip design economics and supply chain strategy.
The AI infrastructure buildout is encountering a structural bottleneck that wafer capacity and HBM allocation alone cannot resolve: chip-to-chip and rack-to-rack interconnect bandwidth. Optical networking chips are transitioning from a peripheral technology to a central architectural requirement, with co-packaged optics timelines now embedded in leading-edge accelerator roadmaps. Supply chain and procurement teams that treat interconnect as a secondary specification risk systematic underestimation of system-level cost and lead time exposure.
Xeon Dunlow vs. Zen 6 Medusa Point: How the Datacenter CPU Market Is Repricing for the Inference Era
Intel's Xeon Dunlow and AMD's Zen 6 Medusa Point are converging on the same enterprise battleground at the same moment. This analysis unpacks the manufacturing economics, margin dynamics, and strategic positioning shaping datacenter CPU procurement in 2026 and beyond.
The datacenter CPU market is entering a structural repricing cycle driven by advanced node transitions, inference workload clustering, and enterprise capex reallocation away from pure GPU density. Intel and AMD are both betting that CPU-anchored inference clusters represent a durable revenue floor — but the margin trajectories, node economics, and platform lock-in strategies diverge sharply between Dunlow and Medusa Point.
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Semiconductor Cost Modeling Platform
Chip Cost Calculator
Model chip manufacturing costs across process nodes from 28nm to 2nm. Calculate GDPW, net die yield, wafer costs, CoWoS packaging, HBM memory pricing, and total chip cost with interactive parameter adjustments. Free alternative to paid die calculators.
Supply Chain Intelligence
Explore 64 semiconductor fabs worldwide with capacity data, track HBM market dynamics with live spot pricing and vendor market share, and visualize supply chain chokepoints from ASML lithography to Japanese photoresist monopolies.
Market Analysis
30+ deep-dive reports covering TSMC wafer pricing, NVIDIA GPU economics, HBM memory shortages, export controls, and AI chip demand trends. Data-driven analysis with interactive cost models and structured data via our free API.
Semiconductor Manufacturing FAQ
- How much does it cost to make a semiconductor chip?
- Semiconductor manufacturing costs vary by process node: mature 28nm costs ~$3,000 per wafer, advanced 5nm costs ~$18,500, and cutting-edge 3nm costs ~$19,500. Per-chip cost depends on die size and yield — for example, an NVIDIA H100 (814mm² at TSMC 4N) costs approximately $3,320 to manufacture, while the B200 costs approximately $6,400.
- How many chips can you get from one wafer?
- The number of chips per wafer (Gross Dies Per Wafer or GDPW) depends on die size and wafer diameter. On a standard 300mm wafer: a small chip (50mm²) yields ~1,250 gross dies, a medium chip (200mm²) yields ~300, and a large chip like NVIDIA's H100 (814mm²) yields approximately 74 gross dies before yield loss.
- What is the most expensive chip to manufacture?
- As of 2026, the most expensive chips to manufacture are large AI accelerators. NVIDIA's B200 (Blackwell) at TSMC 4NP has an estimated manufacturing cost of ~$6,400, with HBM memory ($2,900) being the largest cost component. AMD's MI300X, using N5/N6 chiplets with advanced packaging, costs approximately $5,300 to manufacture.
- How many semiconductor fabs are there in the world?
- Silicon Analysts tracks 64 semiconductor fabrication facilities across 10 countries, operated by 16 companies including TSMC, Samsung, Intel, GlobalFoundries, UMC, and SMIC. New fabs are currently under construction or announced globally, including TSMC Arizona, JASM Kumamoto, and Intel Ohio.
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