HBM Price per GB by Generation — Historical Time Series Data
HBM contract and spot pricing per GB from HBM2 through HBM4, 2020-2026. Now includes spot vs. contract series separation — capturing the 2023 shortage when spot traded at 2x contract price as SK Hynix sold exclusively to NVIDIA under LTAs.
HBM Price per GB by Generation
HBM contract and spot pricing per GB from HBM2 through HBM4, 2020-2026. Now includes spot vs. contract series separation — capturing the 2023 shortage when spot traded at 2x contract price as SK Hynix sold exclusively to NVIDIA under LTAs.
Model Bear / Base / Bull scenarios with interactive assumptions
Data sparse before 2022. Public pricing data for this category is limited prior to the AI demand inflection. Data points before 2022 are single-source estimates and should be treated as directional only.
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Data Table
| Period | Series | Value |
|---|---|---|
2020–21 | HBM2 | $8.00 |
Q3 2022 | HBM2E | $10.00 |
Q1 2023 | HBM3 | $11.00 |
Q2–Q3 2023 | HBM3 | $13.00 |
Q4 2023 | HBM3E | ••• |
Q1–Q2 2024 | HBM3E | ••• |
Q1 2024 | HBM3 | $12.50 |
Q3–Q4 2024 | HBM3E | ••• |
H1 2025 | HBM3E | $17.50 |
H2 2025 | HBM3E | $15.00 |
2026 (proj.)P | HBM3E | $11.00 |
2026 (proj.)P | HBM4 | $14.00 |
Methodology & Sources
Sources: TrendForce, KED Global, Goldman Sachs, SemiAnalysis. Contract prices are confidential; figures are analyst estimates from earnings call commentary and industry reports.
Citations:
- Industry inference (Mar 2026)
- Deep Research (99 sources) (Mar 2026)
- SemiAnalysis (Mar 2024)
- The Register / TrendForce (May 2024)
- KED Global (May 2024)
- KED Global / Micron IR (May 2024)
- TrendForce / industry inference (Mar 2026)
- TrendForce / Goldman Sachs (Dec 2024)
- Goldman Sachs / Deep Research (Mar 2026)
- TrendForce / Goldman Sachs (Nov 2025)
- Goldman Sachs (Dec 2025)
- TrendForce / KED (Nov 2025)
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Market intelligence on this data
All market intelligence →SK Hynix Commits $5.8B to Advanced HBM Packaging Facility; TSMC Confirms 2027 Wafer Price Hikes Up to 10%
SK Hynix packaging CapEx: +$5.8B committed; TSMC mature-node wafer price hike: up to +10% effective 2027; advanced-node pricing direction unquantified but directionally upward per Barchart/TSMC guidance.
TSMC Commits $100B+ Arizona Expansion, Accelerates 3nm Conversion to Meet AI Chip Surge
Capacity: TSMC U.S. CapEx raised by +$100B incremental; total U.S. commitment reaches ~$265B per Odaily/Reuters; annual CapEx guidance lifted to $60–64B. 5nm-to-3nm fab conversion timeline accelerated (no specific % capacity figure disclosed publicly).
TSMC $265B US CapEx Commitment + ASML 30% EUV Capacity Surge Signal Multi-Year AI Supply Expansion — with Equipment Price Hike Risk
TSMC CapEx: +$100B incremental US commitment (total $265B), 2026 CapEx at high end of $52–56B range; ASML EUV/DUV capacity: +30% per year for 2 years; ASML 2026 revenue guidance raised ~15–19% vs prior midpoint (€38B → €44B midpoint); ASML EUV price hike quantum not yet disclosed — wafer/packaging cost pass-through risk flagged but unquantified.
SK Hynix CEO Flags 2027 as Worst-Ever HBM Supply Crunch; $26.5B IPO Capital Earmarked for Capacity Expansion
Capacity expansion funded: $26.5B raised (new fab + packaging facility + EUV scanners); Supply gap: demand forecasted to exceed supply through 2030+; No specific yield or price-per-unit figure disclosed.
Frequently Asked Questions
- How much does HBM3E memory cost per GB?
- HBM3E pricing peaked at approximately $17–20 per GB in H1 2025 during peak AI demand. By H2 2025, blended ASP declined to approximately $13–17/GB as Samsung offered discounts of roughly 30% below SK Hynix.
- Why is HBM so much more expensive than standard DRAM?
- HBM costs significantly more than standard DRAM due to through-silicon via (TSV) processing, die stacking (8–12 layers), silicon interposer integration, and extremely tight testing requirements. Each HBM3E 12-hi stack costs approximately $300–500, compared to roughly $3–5 for an equivalent-capacity DDR5 module.
- Who are the HBM market share leaders?
- SK Hynix leads the HBM market with approximately 53% share in 2025, down from roughly 90% in 2023 when it was the sole qualified HBM3 supplier for NVIDIA H100. Samsung holds approximately 28% share and Micron approximately 19%, both growing as they qualify HBM3E for additional platforms.