Semiconductor Cost Tools for Fabless Startups
Silicon Analysts provides free interactive tools for fabless semiconductor startups planning their first tapeout. Estimate chip manufacturing costs, compare foundry options, model NRE budgets, and generate stakeholder-ready reports — no enterprise contract or sales call required.
For Fabless Startups
Plan your first tapeout with confidence
Free tools used by 1,000+ semiconductor professionals monthly to estimate chip costs, compare foundries, and budget tapeouts. No enterprise contract, no sales call.
How much does a tapeout cost?
Tapeout costs vary dramatically by process node. Here are industry-typical ranges for a full-mask production run.
| Node | Wafer Cost | Mask Set | Typical NRE | Timeline |
|---|---|---|---|---|
| 180nm | $1,500–$2,500 | $100K–$300K | $500K–$2M | 6–9 months |
| 65nm | $3,000–$5,000 | $500K–$1M | $2M–$5M | 9–12 months |
| 28nm | $5,000–$7,000 | $1M–$3M | $5M–$15M | 12–15 months |
| 7nm | $10,000–$12,000 | $5M–$10M | $15M–$30M | 15–18 months |
| 5nm | $16,000–$21,000 | $10M–$15M | $30M–$50M | 18–24 months |
| 3nm | $17,000–$22,000 | $15M–$20M | $50M–$100M+ | 18–24 months |
Sources: TrendForce, Morgan Stanley, CSET, industry expert consensus. MPW shuttle runs start at $5K–$100K depending on node.
Tools built for your workflow
Tapeout Decision Workspace
5-step guided assessment: define your chip, compare foundry options, model costs, benchmark against competitors, and generate a stakeholder-ready report.
Chip Cost Calculator
Estimate per-chip manufacturing cost including wafer, yield, packaging, HBM, and test. Save and compare multiple scenarios.
Foundry Engagement Guide
Step-by-step guide from MPW shuttle to production: NDA process, PDK access, VCA partners, and NRE breakdown.
What most teams get wrong about chip budgeting
Underestimating NRE by 2-3x
Mask sets, IP licensing, EDA tools, and verification often exceed the wafer cost itself. Teams budget for silicon and forget the surrounding costs.
Choosing the wrong node
Leading-edge nodes have better PPA but 5-10x higher NRE. Many startups should start at 28nm or 16nm for first silicon, then migrate.
Ignoring packaging costs
Advanced packaging (CoWoS, chiplet) can add $500-$2,000 per unit. For HBM-equipped chips, packaging often exceeds the logic die cost.
No break-even analysis
How many chips do you need to sell to recoup NRE? At 7nm, the answer might be 50,000+ units. This shapes your entire go-to-market strategy.
Ready to plan your tapeout?
Start with the Tapeout Decision Workspace — define your chip, compare foundries, and get a stakeholder-ready budget in under 30 minutes.
Start Your Free Tapeout Assessment →