First reported 2026-09-29 by TrendForce
TrendForce: 2027 HBM Blended ASP to Jump 121% as HBM4/HBM4E Mix Shifts
TrendForce, in a report dated September 29, projected that the blended average selling price of HBM in 2027 will rise 121% versus 2026, driven not by a uniform like-for-like price increase but by the mix shift toward higher-priced HBM4 and next-generation HBM4E stacks. The same report flags HBM's share of DRAM wafer capacity climbing from roughly 20% toward 30%, prolonging conventional DRAM tightness, while KB Securities expects HBM4-family products to grow from ~40% to ~80% of Samsung's HBM revenue next year.
A 121% blended-ASP move is a mix effect rather than a pure per-stack repricing, but for accelerator builders the practical result is the same: memory becomes the dominant and fastest-inflating line of the AI BOM in 2027. With HBM absorbing up to 30% of advanced DRAM wafer capacity, commodity server DRAM tightness is likely to persist as a second-order cost driver for AI server integrators.
The price figure is an average selling price, which moves with product mix (generation, stack height, customer) as well as price, so it is not applied to chip BOMs as a like-for-like price change.
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