First reported 2026-10-16 by Techtimes (reporting Micron's AATT2 opening ceremony)
Micron Opens Second Taiwan HBM Packaging Fab; All 2027 Output Already Sold Out
Micron began HBM packaging and test operations at AATT2 in Taichung on its committed mid-October 2026 timeline, with President and COO Manish Bhatia stating that "the entire planned 2027 capacity is already sold out." The added back-end capacity targets the TSV/stacking step identified as the tightest chokepoint in AI accelerator supply, but a pending labor strike vote raises execution risk against those pre-committed 2027 deliveries.
Incremental HBM back-end capacity arrives already fully allocated, so near-term HBM scarcity and pricing leverage for memory suppliers are unlikely to ease through 2027. A Taichung labor action would hit the single most constrained step in the AI accelerator BOM and would propagate directly into Blackwell/Vera Rubin-class build schedules.
Chips affected — model the economics
This signal touches these AI accelerators. Open any in the cost calculator, pre-filled with its full BOM.
Sources
- Techtimes — Micron Opens HBM Plant With 2027 Output Fully Contracted; Strike Vote Looms
- BigGo Finance — Yang Yige: Micron Overtakes SK Hynix on the "Legacy DRAM Price Surge," but the Real Test Lies in HBM4E
- Semiconductor Engineering — Chip Industry Week In Review
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