Advanced Packaging
Deep dives into CoWoS, EMIB, chiplet architectures, interposer technology, and the advanced packaging capacity constraints shaping AI chip supply.
2 articles
ByteDance's $14.3B Nvidia AI Chip Investment: A Deep Dive
Analysis of ByteDance's $14.3 billion investment in Nvidia AI chips, impacting supply chains and hardware roadmaps.
ByteDance's substantial investment underscores the escalating demand for AI accelerators and highlights the critical importance of securing access to advanced computing resources. The investment intensifies pressure on Nvidia's supply chain, especially HBM and advanced packaging capacities, which could lead to extended lead times and pricing pressures across the industry.
TSMC Price Hikes: 3-10% Increase on Advanced Chips from 2026
Analysis of TSMC's 3-10% price increase on advanced chips starting in 2026, driven by AI demand exceeding supply.
TSMC's announced price increases of 3-10% on advanced chips, particularly sub-3nm nodes, underscores the substantial demand for AI semiconductors and highlights TSMC's significant market power in advanced chip manufacturing. This shift will ripple through the electronics ecosystem, influencing the cost structure for smartphones, GPUs, servers, and AI systems, necessitating strategic adjustments in hardware roadmaps and procurement strategies.