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SOIC — storyline

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  1. HighPackagingAug 18, 2026

    TSMC CoWoS 5.5x Reticle Hits 98-99% Yield in Volume Production; 14x Roadmap Confirmed to 2029

    TSMC disclosed at the 2026 OCP APAC Summit that its 5.5x reticle-size CoWoS is now in volume production with yields consistently above 98% and reaching 99% across multiple AI customer products — a strong positive signal for advanced packaging supply stability. The company additionally confirmed a technology roadmap extending to 14x reticle-size CoWoS by 2029 and a SoIC hybrid bonding pitch reduction to 4.5 microns, signaling sustained multi-year capacity and capability expansion for AI accelerator packaging.

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