Tapeout Decision Workspace - Semiconductor Cost & Foundry Comparison
Guided decision-making tool for fabless semiconductor startups evaluating tapeout decisions. Follow a 5-step workflow: define your chip specifications, explore foundry and process node options (TSMC, Samsung, Intel across 3nm to 28nm), model full manufacturing costs including wafer, packaging, HBM memory, and NRE, analyze competitive positioning against 13 existing AI accelerators, and generate a comprehensive decision report for stakeholders.
Define Your Chip
Describe the chip you're planning to tape out. This information will be used to configure foundry options and cost models in subsequent steps.
Quick Start
Start from a reference design similar to a known chip, then customize to match your project.
Basic Information
Chip Specifications (estimates are fine)
Typical: 50-800 mm²
Memory Configuration (if applicable)
Production Plan (rough estimates work)
Assembly + test yield. Typical: 90-98%
Wafer probe + final test. Typical: $2-50
Tapeout Decision FAQ
- What is a tapeout decision and why is it important?
- A tapeout is the final step in chip design where the layout is sent to a foundry for manufacturing. It represents a $5M-50M+ commitment for fabless startups, covering mask sets, NRE (non-recurring engineering) costs, and initial wafer runs. This workspace helps teams evaluate foundry options, model total costs, and build a data-driven case for stakeholders before committing.
- How does the Tapeout Decision Workspace compare foundry options?
- The workspace lets you select 2-3 foundry/node combinations (e.g., TSMC 3nm vs Samsung 3nm vs TSMC 5nm) and compares them across wafer cost, expected die yield, total BOM cost, NRE amortization, and break-even production volume. It uses real industry benchmark data for wafer pricing, defect density, and node maturity.
- What data sources does the cost modeling use?
- Cost models are built from analyst reports, foundry pricing benchmarks (TrendForce, Morgan Stanley, IC Insights), and publicly available semiconductor data. Wafer pricing covers TSMC, Samsung, and Intel nodes from 3nm to 28nm. Defect density and yield models use Poisson and Murphy yield equations with industry-standard parameters.
Explore More
Related Tools
Related Tools & Guides
- Chip Cost Calculator — Model wafer costs, GDPW, die yield, and full chip pricing
- Fab Explorer — Browse global foundry capacity and fab locations
- Cost Bridge Chart — Side-by-side AI accelerator cost comparison
- Foundry Engagement Guide — MPW to production, step by step
- Semiconductor Cost Guide — Comprehensive wafer pricing and chip cost reference