Data contracts / chart
CoWoS Packaging Capacity (TSMC)
TSMC CoWoS monthly capacity expansion with quarterly granularity from End 2023 through End 2026, tracking the AI chip packaging bottleneck from 13K to 125K+ wpm.
- Coverage window
- End 2023 → End 2026 (target) (9 rows)Computed from the backing series at page-render time — never typed by hand.
- History honesty
- Observations recorded as published; no archive backfill flag on this series.
- Cadence
- Event-driven — curated prints land when a dated public source publishes one (per-dataset cadence weekly → annual, see recommended_cadence). The market-data agent sweeps Sundays 02:00 UTC; prints that clear its validation gate (source-excerpt verification included) apply automatically, the rest queue for human review.
- Revision policy
- Points change only through staged updates (market_data_staged_updates) with an audit log; the Pro export carries X-Corrections-Count.
- Sources (source_name)
- Silicon Analysts interpolation (2) · TrendForce (2) · Nomad Semi (1) · TweakTown / Ctee (1) · SemiVision / SemiWiki (1) · GlobalSemiResearch (1) · Nomad Semi / SemiVision (1)
- Known gaps
- Known-gaps review pending — the coverage boundaries above are computed and current, but the curator’s qualitative gaps assessment has not been written yet. We state that rather than inventing one.
- Access
- Free API keyAPI:
/api/v1/market-data/cowos-capacity - Machine-readable
/api/v1/catalog/cowos-capacity/contract