TSMC — storyline
Every Silicon Analysts market-intelligence brief on TSMC, newest first — each sourced and dated. The arc, not a disconnected feed.
- HighPackagingJul 16, 2026
TSMC $265B US CapEx Commitment + ASML 30% EUV Capacity Surge Signal Multi-Year AI Supply Expansion — with Equipment Price Hike Risk
TSMC has committed an additional $100B in US manufacturing investment (total $265B) while confirming 2026 CapEx at the high end of $52B–$56B guidance, directly supporting CoWoS and advanced-node wafer capacity for AI accelerators including Nvidia H200/B200 SKUs. Concurrently, ASML — the sole supplier of EUV lithography equipment critical to HBM and leading-edge logic fabs — raised its 2026 revenue outlook by ~$6–7B to €43–45B and announced 30% annual production capacity expansion for both EUV and DUV systems over the next two years, while separately reporting active negotiations to raise tool pricing, with TSMC reportedly resisting increases on both EUV and DUV equipment.
- HighPackagingJun 26, 2026
TSMC CoWoS-L Capacity Reported Sold Out Through 2026
Trade press indicates TSMC CoWoS-L advanced-packaging capacity is fully booked through 2026, with lead times of 40-52 weeks as Blackwell-class demand outpaces the expansion ramp.
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