How Much Does a TSMC 3nm Chip Cost to Make? (2026)
Quick answer: As of February 2026, a TSMC 3nm (N3/N3E) wafer costs ~$19,500. A full mask set runs ~$15M. Per-die cost ranges from ~$50 for a small chip (50mm²) to ~$3,000+ for a large GPU die (800mm²). Total chip cost including packaging and HBM memory can reach $3,000–$13,000 for AI accelerators.
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1. TSMC 3nm Wafer Cost
TSMC's 3nm process (N3/N3E) uses extreme ultraviolet (EUV) lithography with more patterning layers than 5nm, driving wafer costs to approximately $19,500 on average. This represents a 5–6% increase over N5 pricing ($18,500).
| Metric | TSMC 3nm (N3/N3E) | TSMC 5nm (N5) |
|---|---|---|
| Avg. Wafer Price | $19,500 | $18,500 |
| Price Range | $17,000 – $22,000 | $16,000 – $21,300 |
| Lithography | EUV (more layers) | EUV |
| Mask Set Cost | ~$15M | ~$6.5M |
| Total NRE | ~$22M | ~$10M |
Sources: TrendForce, Morgan Stanley, CSET. Prices reflect high-volume contracts.
2. Die Cost by Size
Per-die cost is determined by how many good dies fit on a wafer (yield-adjusted GDPW). Larger dies have lower yield and fewer dies per wafer, driving cost exponentially higher.
| Die Size | Example | GDPW | Est. Yield | Cost/Die |
|---|---|---|---|---|
| 50 mm² | Small SoC | ~1,100 | ~90% | ~$20 |
| 100 mm² | Mobile AP | ~540 | ~85% | ~$42 |
| 200 mm² | Desktop CPU | ~293 | ~76% | ~$87 |
| 400 mm² | GPU / AI chip | ~143 | ~58% | ~$235 |
| 814 mm² | NVIDIA H100-class | ~70 | ~35% | ~$800 |
Estimates assume D0=0.14 defects/cm² and Murphy yield model. Actual yields vary by design maturity.
Quick Cost Estimator
3. Packaging and Memory Add Significant Cost
For AI accelerators on 3nm, the logic die is only 30–50% of total manufacturing cost. Advanced packaging (CoWoS) and HBM memory can exceed the die cost itself.
| Cost Component | Range | Notes |
|---|---|---|
| Logic Die (3nm) | $200 – $3,000+ | Depends on die area (100–800mm²) |
| CoWoS Packaging | $400 – $2,000 | CoWoS-S for single die, CoWoS-L for multi-die |
| HBM Memory | $960 – $4,800 | 4–12 stacks at $200–$500/stack |
| Test & Assembly | $100 – $400 | Wafer sort + final test + assembly |
4. Total Manufacturing Cost Examples
Here are estimated total manufacturing costs for chips fabricated on TSMC 3nm:
Frequently Asked Questions
How much does a TSMC 3nm wafer cost?
As of February 2026, a TSMC 3nm (N3/N3E) 300mm wafer costs approximately $19,500 on average, with a range of $17,000–$22,000 depending on volume commitments.
What yield can I expect at 3nm?
Yield varies by die size: small dies (<100mm²) achieve 85–92%, medium dies (200–400mm²) achieve 60–75%, and large GPU-class dies (>600mm²) may achieve 45–65%. N3E offers improved yields over N3.
Is 3nm worth it vs 5nm?
TSMC 3nm offers 10–15% speed improvement and 25–30% power reduction over 5nm, but wafer costs are only ~5% higher. The real cost increase comes from the $15M mask set (vs $6.5M at 5nm). For high-volume products (1M+ units), the per-die cost delta is small. For low-volume ASICs, the NRE premium is significant.