Foundry-Customer Technical Kickoff Meeting
Meeting Preparation & Agenda Template
- Fill in the project details, participants, and customize agenda timings/topics as needed.
- Use the checkboxes below to track pre-meeting requirements.
- Hover over terms like this for context.
- Use the Logs at the end to capture action items, decisions, and issues during the meeting.
- Click “Save as PDF” to generate a final agenda or minutes document.
Project Name: [PROJECT NAME]
Process Technology: [PROCESS NODE]
Date: [MEETING DATE] | Time: [START TIME] – [END TIME]
Location: [PHYSICAL LOCATION / VIRTUAL MEETING LINK]
PRE-MEETING PREPARATION
MEETING PARTICIPANTS
Foundry Team:
Customer Team:
AGENDA ITEMS
-
INTRODUCTIONS (15 minutes)
- Welcome and meeting objectives
- Introduction of key team members and roles
- Overview of communication channels and protocols
-
PROJECT OVERVIEW (30 minutes)
Customer presentation:- Product vision and market application
- Chip architecture overview
- Key functional blocks
- Critical performance requirements
- Preliminary floorplan (if available)
- Technology selection rationale
- Q&A
-
PROCESS TECHNOLOGY OVERVIEW (45 minutes)
Foundry presentation:- Process technology features and advantages
- Key performance parameters
- Process maturity status and manufacturing capabilities
- Proven product examples (as applicable)
- Known challenges and limitations
- Available process options and variants
- Process qualification status
- Q&A
-
PDK AND DESIGN ENABLEMENT (60 minutes)
- PDK components and versions
- Design rule overview and key constraints
- Device models and characterization status
- Standard cell libraries and IP availability
- Memory compilers and other design automation tools
- I/O and specialty components
- Reference flows for different EDA platforms
- DFM (Design for Manufacturing) guidelines
- PDK update schedule and notification process
- Known issues and workarounds
- Design support resources and escalation paths
-
BREAK (15 minutes)
-
DESIGN METHODOLOGY ALIGNMENT (45 minutes)
Customer design flow presentation- EDA tools and versions
- Design methodology alignment
- Library qualification status
- IP integration approach
- Verification strategy overview
- DFT (Design for Test) approach
- Design handoff requirements and formats (e.g., GDSII)
- Engineering change order (ECO) process
-
MANUFACTURING CONSIDERATIONS (30 minutes)
- Wafer fabrication flow
- Critical process steps
- Process control monitoring
- Test chip recommendations
- MPW (Multi-project wafer) options
- Prototype manufacturing options
- Volume manufacturing capabilities
- Yield optimization strategies
- Package and assembly options
- Known manufacturing risks
-
QUALITY AND RELIABILITY (30 minutes)
- Foundry quality management system (QMS)
- Reliability qualification status
- Failure analysis capabilities
- Statistical process control methods
- Qualification requirements for new products
- Reliability monitoring programs
- Product certification support
- Quality documentation requirements
-
PROJECT PLANNING AND TIMELINE (45 minutes)
- Major project milestones
- Design reviews (architecture, circuit, layout)
- Preliminary schedule for:
- Design completion
- Tape-out
- Mask preparation
- Wafer fabrication
- Wafer sort
- Assembly and test
- Qualification
- Production ramp
- Critical path identification
- Risk assessment and mitigation strategies
- Schedule dependencies and constraints
-
SUPPORT MODEL AND NEXT STEPS (30 minutes)
- Technical support structure and contacts
- Regular meeting schedule and format
- Documentation and knowledge base access
- Issue tracking system
- Design review process and schedule
- Training needs assessment
- Immediate action items
- Next meeting objectives and date
ACTION ITEMS, DECISIONS, AND ISSUES
ACTION ITEMS AND FOLLOW-UP
| No. | Action Item | Owner | Due Date | Status |
|---|---|---|---|---|
| 1 | ||||
| 2 | ||||
| 3 | ||||
| 4 | ||||
| 5 |
DECISIONS LOG
| No. | Decision | Date | Decision Maker(s) |
|---|---|---|---|
| 1 | |||
| 2 | |||
| 3 |
TECHNICAL ISSUES LOG
| No. | Issue Description | Impact | Owner | Resolution Plan | Target Date |
|---|---|---|---|---|---|
| 1 | |||||
| 2 | |||||
| 3 |
MEETING MINUTES
[To be completed during/after the meeting]APPENDIX A: REFERENCE DOCUMENTS
| Document Name | Version | Location/Link | Description |
|---|---|---|---|
| Process Technology Datasheet | |||
| PDK Release Notes | |||
| Design Rule Manual | |||
| Standard Cell Library Documentation | |||
| I/O Cell Documentation | |||
| DFM Guidelines | |||
| Project Specification | |||
| Block Diagram | |||
| Test Strategy |
APPENDIX B: GLOSSARY OF TERMS
- PDK
- Process Design Kit
- DRC
- Design Rule Check
- LVS
- Layout Versus Schematic
- MPW
- Multi-Project Wafer
- DFT
- Design For Test
- DFM
- Design For Manufacturing
- IP
- Intellectual Property
- ESD
- Electrostatic Discharge
- EDA
- Electronic Design Automation
APPENDIX C: CONTACT INFORMATION
Foundry Contacts:
Technical Support:
Email: [TECH_SUPPORT_EMAIL]
Phone: [TECH_SUPPORT_PHONE]
Hours: [SUPPORT_HOURS]
PDK Support:
Email: [PDK_SUPPORT_EMAIL]
Phone: [PDK_SUPPORT_PHONE]
Account Management:
Name: [ACCOUNT_MANAGER]
Email: [ACCOUNT_MANAGER_EMAIL]
Phone: [ACCOUNT_MANAGER_PHONE]
Escalation Path:
Level 1: [NAME], [TITLE], [CONTACT]
Level 2: [NAME], [TITLE], [CONTACT]
Level 3: [NAME], [TITLE], [CONTACT]
Customer Contacts:
Project Manager:
Name: [PROJECT_MANAGER]
Email: [PROJECT_MANAGER_EMAIL]
Phone: [PROJECT_MANAGER_PHONE]
Technical Lead:
Name: [TECHNICAL_LEAD]
Email: [TECHNICAL_LEAD_EMAIL]
Phone: [TECHNICAL_LEAD_PHONE]
Executive Sponsor:
Name: [EXECUTIVE_SPONSOR]
Email: [EXECUTIVE_SPONSOR_EMAIL]
Phone: [EXECUTIVE_SPONSOR_PHONE]