{"name":"Silicon Analysts Data API","version":"1","baseUrl":"https://siliconanalysts.com/api/v1","docs":"https://siliconanalysts.com/developers","llmsTxt":"https://siliconanalysts.com/llms.txt","description":"Structured semiconductor data for AI agents, applications, and researchers. Accelerator cost breakdowns, HBM market analysis, and industry articles.","endpoints":[{"path":"/api/v1","method":"GET","description":"This manifest; lists available endpoints."},{"path":"/api/v1/market-data","method":"GET","description":"List all 14 semiconductor market data datasets with metadata (name, category, unit, description, cadence). Covers wafer pricing, HBM/DRAM pricing, CoWoS capacity, fab utilization, NRE costs, AI chip BOM, capex, lead times, NAND pricing, cloud GPU pricing.","cache":"1 hour"},{"path":"/api/v1/market-data/{datasetId}","method":"GET","description":"Data points for a specific market dataset. Free tier returns recent data points with source citations and confidence ratings. Pro returns full history from 2004.","queryParams":{"datasetId":"Dataset identifier (e.g., wafer-price-tsmc, hbm-pricing, cowos-capacity)"},"cache":"5 minutes"},{"path":"/api/v1/accelerators","method":"GET","description":"AI accelerator manufacturing cost breakdowns (13 chips: NVIDIA H100/H200/B100/B200/GB200, AMD MI300X/MI355X, Intel Gaudi 3, Google TPU v5p, AWS Trainium 2, Microsoft Maia 100, Meta MTIA v2). Includes logic die, HBM, packaging, test costs, sell price, and gross margin.","queryParams":{"vendor":"Filter by vendor (case-insensitive)","chip":"Filter by chip name (partial match, case-insensitive)","fields":"Return only specified fields (comma-separated)"},"cache":"1 hour"},{"path":"/api/v1/hbm","method":"GET","description":"Full HBM market analysis dataset (accelerators, specs, market share, spot prices, leading indicators, qualification feed, revenue forecast, supplier revenue, validation checks).","schema":{"success":"boolean","data":{"accelerators":"array","specs":"array","marketShare":"array","spotPrices":"array","leadingIndicators":"array","qualificationFeed":"array","revenueForecast":"array","supplierRevenue":"array","validationChecks":"array"},"meta":"object (source, apiVersion, docs, schema hints)"},"cache":"5 minutes"},{"path":"/api/v1/articles","method":"GET","description":"Analysis article index with metadata for 30+ semiconductor industry articles. Includes title, date, description, executive insight, key takeaways, cited sources, and full URL.","queryParams":{"limit":"Return only the N most recent articles","q":"Search in title and description (case-insensitive)"},"cache":"1 hour"},{"path":"/api/v1/market-pulse","method":"GET","description":"Semiconductor market pulse data. Supply chain intelligence across 6 sectors (Logic, Memory, Packaging, Connectivity, Power, Geopolitics) with trend indicators and impact analysis.","queryParams":{"category":"Filter by category (case-insensitive)","trend":"Filter by trend direction (up, down, neutral)","limit":"Return only the N most recent items"},"cache":"5 minutes"},{"path":"/api/v1/foundry/wafer-pricing","method":"GET","description":"Wafer price ranges by process node (TSMC, Samsung, Intel). Includes defect density, NRE costs, and node maturity status.","queryParams":{"node":"Filter to a specific node (e.g. tsmc-n3, tsmc-n5, samsung-3nm, intel-16)"},"cache":"1 hour"},{"path":"/api/v1/foundry/packaging-costs","method":"GET","description":"Packaging cost benchmarks and technology capabilities (CoWoS, EMIB, SoIC, FC-BGA, etc.). Also returns HBM memory specs and per-stack costs.","queryParams":{"type":"Filter by packaging type (e.g. cowos, emib, soic, fc-bga)"},"cache":"1 hour"},{"path":"/api/v1/calculate/chip-cost","method":"POST","description":"Programmatic chip cost estimation. Accepts die dimensions, process node, and optional parameters. Returns full cost breakdown including yield, GDPW, and per-unit economics.","body":{"dieWidth":"Die width in mm (required)","dieHeight":"Die height in mm (required)","processNode":"Foundry node ID (optional, default: tsmc-n5)","waferCost":"Override wafer cost in USD (optional, uses benchmark if omitted)","packagingType":"Packaging architecture (optional, default: flip-chip)","packagingCost":"Override packaging cost in USD (optional)","hbmStacks":"Number of HBM stacks (optional, default: 0)","hbmCost":"HBM cost per GB (optional, default: 0)","testCost":"Test cost per unit in USD (optional, default: 2)","marginTarget":"Target gross margin percentage (optional, default: 50)","volume":"Production volume (optional, default: 10000)"},"rateLimit":"3/24h anon · 20/24h free key · 10,000/hr Pro key","cache":"none"}],"proEndpoints":[{"path":"/api/v1/chip-history","method":"GET","description":"Historical manufacturing cost data for a specific AI accelerator. Track cost trends over time.","queryParams":{"chip":"Chip ID (required, e.g. h100-sxm5)","from":"Start date YYYY-MM (optional, default: 12 months ago)","to":"End date YYYY-MM (optional, default: now)"},"auth":"Required — Pro subscription","cache":"5 minutes (private)"},{"path":"/api/v1/wafer-trends","method":"GET","description":"Historical wafer pricing trends for a process node. Track foundry pricing over time.","queryParams":{"node":"Node ID (required, e.g. tsmc-n3)","from":"Start date YYYY-MM (optional)","to":"End date YYYY-MM (optional)"},"auth":"Required — Pro subscription","cache":"5 minutes (private)"},{"path":"/api/v1/margin-trends","method":"GET","description":"Historical gross margin data for semiconductor categories. Track quarterly margin trends.","queryParams":{"category":"Category (required: gpu-ai, mobile-soc, mainstream-cpu, automotive-mcu, fpga)","from":"Start date YYYY-MM (optional)","to":"End date YYYY-MM (optional)"},"auth":"Required — Pro subscription","cache":"5 minutes (private)"}],"authentication":{"freeEndpoints":"No key required for GET endpoints (subject to anonymous IP rate limit). Malformed bearer tokens are rejected — supply a valid sa_live_ key or no key at all.","proEndpoints":"Requires Pro API key (X-API-Key header) or Supabase session with Pro subscription.","headers":{"X-API-Key":"API key from siliconanalysts.com/developers. Free keys: 100 req/24h. Pro keys: 10,000 req/hr + Pro endpoints.","Authorization":"Bearer <api_key> — alternative to X-API-Key."},"rateLimits":{"noKey":"GET: 10 requests/24h by IP. POST /calculate/chip-cost: 3/24h.","freeKey":"GET: 100 requests/24h by key. POST /calculate/chip-cost: 20/24h.","proKey":"GET + POST: 10,000 requests/hour + access to Pro-gated endpoints.","note":"Rate limits are per-instance today; cross-instance enforcement coming with paid launch."}},"mcp":{"endpoint":"https://siliconanalysts.com/api/mcp","transport":"streamable-http","tools":6,"toolNames":["get_accelerator_costs","calculate_chip_cost","get_hbm_market_data","get_market_pulse","get_wafer_pricing","get_packaging_costs"],"auth":"Required. Bearer token (sa_live_ API key from siliconanalysts.com/developers) via Authorization header, or X-API-Key header.","rateLimits":"Free key: 100 req/24h. Pro key: 10,000 req/hr.","description":"MCP server for AI agents. Exposes semiconductor supply chain data as callable tools."},"usage":{"tracking":"All requests to /api/v1/* are logged (endpoint, method, user-agent, optional API key).","terms":"Data is provided for analysis; see siliconanalysts.com/terms for full terms. Pro endpoints require paid subscription."}}